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PD54003L-E
STMicroelectronics
RF MOSFET LDMOS 7.5V POWERFLAT
4074 Pcs New Original In Stock
RF Mosfet 7.5 V 50 mA 500MHz 20dB 3W PowerFLAT™ (5x5)
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5.0 / 5.0
- (407 Ratings)
PD54003L-E
Product Overview
12877832
DiGi Electronics Part Number
PD54003L-E-DGManufacturer
STMicroelectronics
PD54003L-E
Description
RF MOSFET LDMOS 7.5V POWERFLATInventory
4074 Pcs New Original In Stock
RF Mosfet 7.5 V 50 mA 500MHz 20dB 3W PowerFLAT™ (5x5)
Quantity
Minimum 1
Minimum 1
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PD54003L-E Technical Specifications
Category
Transistors, FETs, MOSFETs, RF FETs, MOSFETs
Packaging
-
Series
-
Product Status
Obsolete
Technology
LDMOS
Frequency
500MHz
Gain
20dB
Voltage - Test
7.5 V
Current Rating (Amps)
4A
Noise Figure
-
Current - Test
50 mA
Power - Output
3W
Voltage - Rated
25 V
Package / Case
8-PowerVDFN
Supplier Device Package
PowerFLAT™ (5x5)
Base Product Number
PD54003
Datasheet & Documents
HTML Datasheet
PD54003L-E-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8541.29.0095
Additional Information
Other Names
PD54003L-E-DG
497-6470-6
PD54003LE
497-6470-1
497-6470-2
Standard Package
3,000
Alternative Parts
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MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
December 02, 2025
Excellent support that helps resolve issues swiftly.
December 02, 2025
Delivery and support services from DiGi Electronics are top-notch, making our procurement seamless.
December 02, 2025
Delivery was prompt and hassle-free, thanks to their efficient logistics system.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing PD54003L-E with PD54008L-E in a 500MHz RF power amplifier due to its obsolete status?
Replacing the obsolete PD54003L-E with PD54008L-E introduces risks related to gate drive requirements and thermal performance. While both are STMicroelectronics LDMOS devices in PowerFLAT™ (5x5) packages, the PD54008L-E has a higher Vds rating (28V vs. 25V) and different transconductance characteristics, which may require re-tuning of the input matching network and bias circuitry. Additionally, the higher output capacitance (Coss) of the PD54008L-E can affect stability at 500MHz, potentially causing oscillations if the layout isn’t optimized. Always perform S-parameter validation and thermal cycling tests before full deployment, especially in high-duty-cycle applications.
How does the PowerFLAT™ (5x5) package of PD54003L-E impact PCB layout and thermal management in compact RF designs?
The PowerFLAT™ (5x5) package used in PD54003L-E offers excellent thermal performance but demands strict PCB design practices. Its exposed thermal pad must be soldered to a sufficiently large ground plane with multiple thermal vias (≥9 vias, 0.3mm diameter) to maintain junction temperatures below 150°C under 3W output. Inadequate via stitching or insufficient copper area can lead to thermal runaway, especially at 500MHz where efficiency drops. Avoid placing sensitive analog traces under the device, and ensure symmetrical grounding to prevent parasitic inductance that degrades gain and stability.
Can PD54003L-E be safely operated near its 25V rated voltage in a 7.5V test circuit without compromising long-term reliability?
Operating PD54003L-E near its 25V maximum rated voltage—even though it's tested at 7.5V—is not recommended for continuous use and significantly increases reliability risks. The 7.5V test condition reflects optimal gain and linearity, not operational limits. Running near 25V without proper derating (typically 80% of Vds(max) for industrial applications) accelerates hot-carrier injection and oxide degradation, leading to premature failure. For robust designs, keep Vds ≤ 20V and implement overvoltage protection, especially in supply-vulnerable environments like base stations or automotive RF systems.
What integration challenges arise when using PD54003L-E in a 500MHz transmitter due to its MSL 3 moisture sensitivity rating?
The MSL 3 (168-hour floor life) rating of PD54003L-E requires strict handling and assembly protocols to prevent popcorning and solder joint defects. After exposure to ambient conditions beyond 168 hours, the device must undergo a bake at 125°C for 24 hours before reflow. In high-volume production, this adds logistics complexity and risk of field failures if moisture ingress occurs. Always use dry storage (<5% RH) and monitor ambient humidity during assembly. Consider conformal coating post-assembly if the end application is in high-humidity environments, but ensure it doesn’t interfere with RF performance or thermal dissipation.
How does the 20dB gain specification of PD54003L-E influence input power requirements and stability in a low-drive RF front-end design?
The 20dB gain of PD54003L-E means it can deliver 3W output with only ~30mW input, making it suitable for low-drive applications—but this high gain increases the risk of unintended feedback and oscillations, especially at 500MHz. Without proper isolation (≥30dB) between input and output stages, parasitic coupling through the PCB or power supply rails can cause instability. Use a well-decoupled bias network (e.g., ferrite beads + low-ESR capacitors) and maintain >5mm separation from other RF components. Additionally, verify gain flatness across temperature, as LDMOS devices like PD54003L-E exhibit gain roll-off at elevated temperatures, which may require AGC compensation in precision systems.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
PD54003L-E CAD Models
STMicroelectronics PD54003L-E PCB symbols & footprints
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