74ABT16541CSSCX >
74ABT16541CSSCX
onsemi
IC BUFF NON-INVERT 5.5V 48SSOP
4235 Pcs New Original In Stock
Buffer, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-SSOP
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74ABT16541CSSCX onsemi
5.0 / 5.0 - (413 Ratings)

74ABT16541CSSCX

Product Overview

7745816

DiGi Electronics Part Number

74ABT16541CSSCX-DG

Manufacturer

onsemi
74ABT16541CSSCX

Description

IC BUFF NON-INVERT 5.5V 48SSOP

Inventory

4235 Pcs New Original In Stock
Buffer, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-SSOP
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 1.1890 1.1890
  • 200 0.4601 92.0200
  • 500 0.4439 221.9500
  • 1000 0.4366 436.6000
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74ABT16541CSSCX Technical Specifications

Category Logic, Buffers, Drivers, Receivers, Transceivers

Manufacturer onsemi

Packaging -

Series 74ABT

Product Status Obsolete

Logic Type Buffer, Non-Inverting

Number of Elements 2

Number of Bits per Element 8

Input Type -

Output Type 3-State

Current - Output High, Low 32mA, 64mA

Voltage - Supply 4.5V ~ 5.5V

Operating Temperature -40°C ~ 85°C (TA)

Mounting Type Surface Mount

Package / Case 48-BSSOP (0.295", 7.50mm Width)

Supplier Device Package 48-SSOP

Base Product Number 74ABT16541

Datasheet & Documents

HTML Datasheet

74ABT16541CSSCX-DG

Environmental & Export Classification

Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Standard Package
1,000

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
SN74ABT16541ADGGR
Texas Instruments
2506
SN74ABT16541ADGGR-DG
0.6465
Similar
SN74ABT16541ADLR
Texas Instruments
1019
SN74ABT16541ADLR-DG
0.7050
Parametric Equivalent
SN74ABT16541ADL
Texas Instruments
1058
SN74ABT16541ADL-DG
0.8956
Similar

Reviews

5.0/5.0-(Show up to 5 Ratings)
天***時
December 02, 2025
5.0
快遞速度極快,幾乎是隔天就能收到商品,購物體驗很棒!
Bouque***Fleurs
December 02, 2025
5.0
Les composants offrent une performance constante, garantissant la qualité de mes montages électroniques.
Velv***iews
December 02, 2025
5.0
After-sales assistance was outstanding, offering clear guidance and support.
Moonb***Trail
December 02, 2025
5.0
The craftsmanship and quality control are truly impressive.
Aur***Haze
December 02, 2025
5.0
They provide a wide range of choices with transparent costs, making decision-making simpler.
Sky***ker
December 02, 2025
5.0
The combination of low prices and reliable delivery keeps me coming back.
Bre***Days
December 02, 2025
5.0
The meticulous packaging safety standards set a benchmark in the industry.
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Frequently Asked Questions (FAQ)

Can the 74ABT16541CSSCX be used in high-speed data bus applications with tight timing constraints, and what design considerations should I account for when replacing it with SN74ABT16541ADGGR?

Yes, the 74ABT16541CSSCX is suitable for high-speed bus buffering due to its 3-state outputs and ABT (Advanced BiCMOS) technology enabling fast switching. However, when replacing it with the SN74ABT16541ADGGR, verify timing compatibility—especially propagation delay and enable/disable times—as minor differences between manufacturers can affect bus contention or setup/hold margins. Also check package thermal characteristics: while both are 48-SSOP, TI’s variant may have slightly different thermal resistance. Always simulate or bench-test timing margins in your specific trace topology to avoid data corruption risks.

What are the reliability risks of using the obsolete 74ABT16541CSSCX in a new industrial design with a 10-year lifecycle?

Using the obsolete 74ABT16541CSSCX introduces significant supply chain and end-of-life risks for long-lifecycle industrial systems. While onsemi’s device is still in stock now, future obsolescence may lead to last-time buys or counterfeit exposure. For reliability, ensure your design includes lifecycle monitoring and a formal obsolescence mitigation plan. Strongly consider redesigning with a currently recommended pin-compatible alternative such as SN74ABT16541ADGGR, and validate long-term availability with your distributor before full-scale production.

How should I address grounding and signal integrity when integrating the 74ABT16541CSSCX in a mixed-signal system with sensitive analog components?

When integrating the 74ABT16541CSSCX in mixed-signal environments, employ a solid ground plane and isolate digital ground return paths from analog sections to avoid noise coupling through ground bounce. Due to its high output drive (32mA high, 64mA low), fast edge rates can induce switching noise. Use local decoupling (0.1µF ceramic + 1µF tantalum) near the VCC pin and consider series damping resistors (22–33Ω) in outputs if routing to long traces. Avoid routing 74ABT16541CSSCX signals near sensitive analog nodes to minimize capacitive crosstalk.

Is the 74ABT16541CSSCX susceptible to latch-up in harsh environments, and what precautions should I take during power sequencing?

The 74ABT16541CSSCX, built on BiCMOS process, has inherent latch-up protection but remains vulnerable under abnormal conditions like overvoltage transients or improper power sequencing. Ensure all inputs are held low or within supply rails during power-up/down. Avoid hot-plugging scenarios unless inputs are current-limited externally. In industrial applications, add series current-limiting resistors (100–470Ω) and clamp diodes to suppress transients. Confirm that VCC ramps monotonically—abrupt or staggered power sequencing can trigger parasitic SCR activation, leading to latch-up and potential device failure.

What are the key differences between 74ABT16541CSSCX and SN74ABT16541ADLR in terms of PCB layout and thermal management?

The 74ABT16541CSSCX and SN74ABT16541ADLR are functionally equivalent but differ subtly in thermal performance and layout requirements. The TI device (ADLR) specifies a slightly lower thermal resistance (θJA ~ 77°C/W vs onsemi’s ~85°C/W estimate), allowing marginally better heat dissipation. Ensure consistent copper land patterns per respective datasheets to maintain thermal integrity. Also, match pour and via placement around GND/VCC pads. Both use 48-SSOP, so footprint adjustments are minimal, but verify solder mask and stencil designs to prevent tombstoning during reflow, especially for the 0.5mm pitch leads.

Quality Assurance (QC)

DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.

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