Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
SST13LP05-MLCF
Microchip Technology
IC AMP 802.11A/B/G 2.4GHZ 16LGA
6609 Pcs New Original In Stock
RF Amplifier IC 802.11a/b/g/WiFi, WLAN 2.4GHz ~ 2.5GHz, 4.9GHz ~ 5.8GHz 16-LFLGA (4x4)
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (296 Ratings)
SST13LP05-MLCF
Product Overview
1663998
DiGi Electronics Part Number
SST13LP05-MLCF-DGManufacturer
Microchip Technology
SST13LP05-MLCF
Description
IC AMP 802.11A/B/G 2.4GHZ 16LGAInventory
6609 Pcs New Original In Stock
RF Amplifier IC 802.11a/b/g/WiFi, WLAN 2.4GHz ~ 2.5GHz, 4.9GHz ~ 5.8GHz 16-LFLGA (4x4)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
SST13LP05-MLCF Technical Specifications
Category
RF Amplifiers
Packaging
Cut Tape (CT)
Series
-
Product Status
Obsolete
Frequency
2.4GHz ~ 2.5GHz, 4.9GHz ~ 5.8GHz
P1dB
25dBm
Gain
29dB
Noise Figure
-
RF Type
802.11a/b/g/WiFi, WLAN
Voltage - Supply
3V ~ 3.6V
Current - Supply
235mA
Test Frequency
2.4GHz ~ 2.5GHz
Mounting Type
Surface Mount
Package / Case
16-LFLGA Exposed Pad
Supplier Device Package
16-LFLGA (4x4)
Datasheet & Documents
HTML Datasheet
SST13LP05-MLCF-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.33.0001
Additional Information
Other Names
SST13LP05MLCF
SST13LP05-MLCFCT
SST13LP05-MLCFTR
SST13LP05-MLCFDKR
Standard Package
3,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
December 02, 2025
믿고 구매할 수 있는 최고의 전자상거래 업체입니다.
December 02, 2025
DiGi Electronics makes customer service a priority with fast shipping and support.
December 02, 2025
I am very satisfied with the high quality of the products I received.
December 02, 2025
DiGi Electronics' speedy delivery helps me stay ahead of my project timelines.
December 02, 2025
Every interaction with their support team was positive, helpful, and courteous.
December 02, 2025
Their products are not only affordable but also reliably consistent in function and design.
December 02, 2025
Shipping was lightning fast, and the staff made the entire experience seamless and stress-free.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
What are the key design risks when replacing SST13LP05-MLCF in a legacy 802.11g WiFi module, and how can I ensure signal integrity during the transition?
Replacing the obsolete SST13LP05-MLCF requires careful evaluation of gain flatness, output P1dB (25dBm), and impedance matching across 2.4–2.5GHz, as subtle deviations can degrade EVM and reduce range. Unlike newer parts like the Qorvo QPA2320 or Skyworks SKY65404-31, the SST13LP05-MLCF has a unique 16-LFLGA (4x4) exposed-pad package with specific thermal and grounding requirements—improper PCB layout during replacement may cause oscillations or overheating. Always re-simulate the matching network using S-parameters and validate with a network analyzer; consider adding a π-match at the output to compensate for board parasitics. Also verify that the replacement’s current draw (235mA @ 3.3V) aligns with your power budget to avoid regulator instability.
Can I use SST13LP05-MLCF in a dual-band 5GHz IoT access point design despite its primary optimization for 2.4GHz?
While the SST13LP05-MLCF supports 4.9–5.8GHz operation, its performance is suboptimal for high-efficiency 5GHz designs due to reduced gain flatness and higher harmonic distortion in that band compared to dedicated 5GHz PAs like the Microchip SST11LF04 or Analog Devices HMC985. The device’s 29dB gain is specified at 2.4GHz, and gain drops significantly above 5GHz, risking insufficient link margin. If you must use it for cost or footprint reasons, add external filtering (e.g., a 5.8GHz bandpass SAW filter) and derate output power by 2–3dB to stay within spectral mask limits. However, for new designs, selecting a modern dual-band PA with integrated matching is strongly advised to avoid certification failures.
How does the moisture sensitivity level (MSL 2) of SST13LP05-MLCF impact high-volume manufacturing, and what handling precautions are necessary?
The SST13LP05-MLCF’s MSL 2 rating means it can be exposed to ambient conditions for up to 1 year before baking is required, but in high-humidity environments or during rework, moisture absorption can lead to 'popcorning' during reflow. Always store the components in dry cabinets (<10% RH) and limit floor life to <6 months if possible. During assembly, follow IPC/JEDEC J-STD-033 guidelines: if the reel has been opened and stored beyond 12 months at >30% RH, perform a 125°C bake for 24 hours. For pick-and-place operations, ensure the reflow profile peaks at 245–250°C with a controlled ramp rate (<3°C/sec) to minimize thermal stress on the LGA pads, which are prone to cracking if heated too rapidly.
Is the SST13LP05-MLCF suitable for battery-powered WLAN sensors requiring low standby current, and what power management trade-offs should I consider?
The SST13LP05-MLCF draws 235mA during transmit at 3.3V, which is relatively high for battery-operated devices—this limits runtime in coin-cell or small Li-ion applications. Unlike newer low-standby-current PAs (e.g., TI CC2652-based modules with integrated PA bypass modes), the SST13LP05-MLCF lacks a shutdown pin or quiescent current control, forcing the entire system to power-cycle the amplifier. This introduces latency and stresses the 3.3V regulator. To mitigate, use a load switch (e.g., TPS22916) to cut power between transmissions and ensure your DC-DC converter can handle the 235mA surge without droop. However, for new low-power designs, consider migrating to System-in-Package (SiP) solutions with integrated power control to avoid these inefficiencies.
What layout and grounding practices are critical when designing a PCB for SST13LP05-MLCF to prevent self-oscillation and meet FCC emissions limits?
The SST13LP05-MLCF’s 16-LFLGA exposed-pad package demands a solid, low-inductance ground plane directly under the die paddle—use at least nine 0.3mm vias in a 3x3 array to connect to an internal ground layer. Poor grounding is the leading cause of instability; even 1nH of via inductance can trigger oscillations above 3GHz. Keep input/output traces short (<5mm) and impedance-controlled (50Ω), with no stubs or sharp bends. Place the input DC-blocking capacitor (100pF) and output matching components within 1mm of the pins. Avoid routing digital control lines near RF traces, and use a grounded coplanar waveguide structure if space allows. Finally, add a 10nF + 1μF decoupling capacitor pair within 2mm of the VDD pin to suppress supply-borne noise that could modulate the carrier and violate FCC Part 15.247 spurious emission limits.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
SST13LP05-MLCF CAD Models
Microchip Technology SST13LP05-MLCF PCB symbols & footprints
productDetail
