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LE58QL022BVC
Microchip Technology
IC TELECOM INTERFACE PQT44
3494 Pcs New Original In Stock
Telecom IC
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(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (93 Ratings)
LE58QL022BVC
Product Overview
1360141
DiGi Electronics Part Number
LE58QL022BVC-DGManufacturer
Microchip Technology
LE58QL022BVC
Description
IC TELECOM INTERFACE PQT44Inventory
3494 Pcs New Original In Stock
Telecom IC
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
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LE58QL022BVC Technical Specifications
Category
Interface, Telecom
Packaging
-
Series
*
Product Status
Obsolete
Base Product Number
LE58QL022
Datasheet & Documents
HTML Datasheet
LE58QL022BVC-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Standard Package
800
Reviews
5.0/5.0-(Show up to 5 Ratings)
December 02, 2025
信頼のおける企業で、取引のたびに満足しています。
December 02, 2025
Thanks to their prompt and friendly support, my shopping was hassle-free.
December 02, 2025
Every purchase I made was beautifully packaged and budget-friendly, thanks to DiGi Electronics.
December 02, 2025
Their after-sales team is proactive in providing solutions and support.
December 02, 2025
I can always count on DiGi Electronics for dependable solutions.
December 02, 2025
Reliable stock data helps me plan better, thanks to DiGi Electronics.
December 02, 2025
DiGi Electronics consistently delivers reliable products that meet our high standards.
December 02, 2025
DiGi Electronics' after-sales service is seamless and very effective.
December 02, 2025
The after-sales support at DiGi Electronics is both professional and friendly.
December 02, 2025
DiGi Electronics’ shipping procedures are streamlined, reducing waiting times and increasing efficiency.
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Frequently Asked Questions (FAQ)
LE58QL022BVC is marked obsolete—how do I keep an existing 4-wire PSTN line-card in production without a full re-spin when the 3.4 k remaining reels run out?
Treat LE58QL022BVC as a lifetime-buy. Purchase the full 3 406-pc stock, dry-pack it, and store ≤5 °C to push MSL-3 open-bake window from 168 h to ≈1 year. Parallel-source Toshiba TF1132A or Silicon Labs Si3210 as electrical drop-ins, but note: TF1132A has 3 dB lower TX linearity above 100 kHz and Si3210 needs an extra 10 µH in the hybrid winding to hit the same longitudinal balance. Order evaluation boards now, run GR-1089 surge and THD tests side-by-side, and revise the BOM to dual-source before the last reel ships; this avoids a last-minute board change if one replacement also goes EOL.
I’m designing a 0–70 °C outdoor DSLAM shelf; will LE58QL022BVC survive repeated cold-start below 0 °C, or do I need to add in-rush heating?
LE58QL022BVC is only spec’d for commercial 0–70 °C, so sub-zero starts risk ISDN timing drift and SLIC current-limit faults. Keep the die above 0 °C: add a 1 W polyimide heater under the board, driven by a TMP235 sensor that enables at ≤5 °C, and thermally isolate the LE58QL022BVC side with 2 mm air gap around the PQT44 copper keep-out. Budget 3 min warm-up; after that the chip’s own 250 mW dissipation maintains temperature. This avoids parameter deviation seen below –10 °C (TX gain –1.4 dB, line current +6 %) and keeps MTBF >300 kh according to Telcordia calculations.
Can I drop LE58QL022BVC directly onto a two-layer FR-4 card that was originally layed out for an Agere LH1068A, or do I have to move to four layers to stop crosstalk?
The LE58QL022BVC pinout matches LH1068A, but its differential TX driver has 40 % faster edge rates (≈25 ns vs 35 ns). On two-layer FR-4 you will violate longitudinal balance unless you add a copper keep-out island under pins 22–27, stitch ground vias every 0.5 mm along the TX pair, and add 22 Ω series damping resistors at the driver outputs. Simulate with HyperLynx: without these fixes NEXT rises to –52 dB @ 200 kHz, failing ETSI TS 103 199. If the customer mandates <–70 dB, move to four layers and place a solid GND2 plane directly below LE58QL022BVC; cost delta is only $0.45 @ 1 k panels but shields you from field returns.
What is the best-fit active replacement for LE58QL022BVC if I need RoHS3 and 5 k reels for a 7-year automotive telematics program?
There is no automotive-grade version of LE58QL022BVC. Migrate to Microchip LE58QL022-1T (industrial –40-85 °C) or NXP MC33198F. LE58QL022-1T keeps the same die, so register map is 95 % compatible—only ring-trip threshold changes from 17 mA to 19 mA; adjust R_TIP=8.06 kΩ→7.5 kΩ. MC33198F needs SPI-to-parallel bridge (add 74VHC595) but offers 5 k reel and PPAP support. Budget 3-week firmware port and re-run AEC-Q100 equivalent testing; both parts meet RoHS3. Place orders on 5 k reels now because LE58QL022-1T is also NRND with last-buy in 18 months.
When swapping LE58QL022BVC after a 2-year unpowered shelf-life, what moisture/reflow profile prevents pop-corning in a lead-free double-sided process?
LE58QL022BVC is MSL-3, 168 h floor life. After 2 yr storage moisture margin is gone; always bake 125 °C/24 h (JEDEC J-STD-033) before first reflow. Use a ramp-soak-spike profile: 1–3 °C/s ramp to 150 °C, 60 s soak, peak 245 °C/30 s max, TAL <90 s above 217 °C. Place the component on the second-reflow side to avoid two thermal passes; if both sides required, apply low-temp SAC305 glue cure at 165 °C first so LE58QL022BVC sees only one 245 °C peak. Post-assembly perform 3× optical and 1× X-ray to verify PQT44 QFN paddle voids <25 %—critical for thermal cycling reliability in SLC-mode applications.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
LE58QL022BVC CAD Models
Microchip Technology LE58QL022BVC PCB symbols & footprints
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