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MAX17841GUE+T
Analog Devices Inc./Maxim Integrated
IC BATT INTERFACE AUTO SPI TSSOP
3671 Pcs New Original In Stock
Battery IC
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(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (36 Ratings)
MAX17841GUE+T
Product Overview
6246769
DiGi Electronics Part Number
MAX17841GUE+T-DGManufacturer
Analog Devices Inc./Maxim Integrated
MAX17841GUE+T
Description
IC BATT INTERFACE AUTO SPI TSSOPInventory
3671 Pcs New Original In Stock
Battery IC
Quantity
Minimum 1
Minimum 1
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MAX17841GUE+T Technical Specifications
Category
Power Management (PMIC), Battery Management
Packaging
-
Series
*
Product Status
Obsolete
Base Product Number
MAX17841
Datasheet & Documents
HTML Datasheet
MAX17841GUE+T-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
2,500
Reviews
5.0/5.0-(Show up to 5 Ratings)
December 02, 2025
Ils prennent soin de leurs clients même après l’achat, c’est rare et précieux.
December 02, 2025
素早い対応とリーズナブルな価格設定で、いつも頼りにしています。
December 02, 2025
多くの選択肢がありながらも、価格と配送の点で特に優れていると感じます。
December 02, 2025
The straightforward pricing policies make planning purchases hassle-free.
December 02, 2025
Their post-sale assistance shows genuine care for customer satisfaction.
December 02, 2025
DiGi Electronics offers incredible prices that make shopping very affordable without compromising quality.
December 02, 2025
They provide timely advice and tips post-purchase, enhancing my confidence and satisfaction.
December 02, 2025
They consistently offer discounts, and their delivery schedule is always reliable.
December 02, 2025
DiGi's packaging is sturdy and professional, reflecting their commitment to excellence.
December 02, 2025
Support team was quick to address my concerns and inquiries.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the MAX17841GUE+T in a new battery management system given its obsolete status?
Using the MAX17841GUE+T in a new design carries significant long-term supply chain risk due to its obsolete status. While current inventory of 3600 units is available, there is no guaranteed future availability, which can disrupt production and increase lifecycle costs. For long-term reliability and scalability, consider redesigning with active-pin-compatible alternatives like the MAX17854ATJ+ from Analog Devices, which supports modern 16-cell stack monitoring and includes improved SPI isolation. If you must use the MAX17841GUE+T, secure buffer stock early and validate second-source or drop-in replacement options during design review to mitigate obsolescence-related field failures or manufacturing delays.
How does the MAX17841GUE+T compare to the LTC6811-1 in high-noise automotive battery pack applications?
The MAX17841GUE+T integrates galvanic isolation via capacitive coupling and supports isolated SPI communication, making it suitable for high-noise environments such as automotive battery packs. Compared to the LTC6811-1, which requires external digital isolators (e.g., ADuM140x) for SPI interfacing, the MAX17841GUE+T reduces component count and board complexity. However, the LTC6811-1 offers higher cell measurement accuracy and is in active production. When choosing the MAX17841GUE+T over the LTC6811-1, evaluate trade-offs between integration simplicity and long-term supply chain stability, especially since the MAX17841GUE+T is obsolete. Implement robust EMC filtering even with its isolated interface to prevent SPI corruption in high EMI conditions.
Can the MAX17841GUE+T be used in a redundant BMS architecture for functional safety (ISO 26262) compliance?
While the MAX17841GUE+T supports isolated SPI communication and can interface with safety microcontrollers, its obsolete status and lack of ASIL-rated documentation limit its suitability for ISO 26262-compliant systems. It lacks built-in diagnostics required for ASIL-D compliance, such as end-to-end data integrity checking on SPI. If using the MAX17841GUE+T in a redundant BMS, implement external cyclic redundancy checks (CRC) and watchdog monitoring on the SPI bus, and pair it with a secondary monitoring IC like the TI BQ79656-Q1 for cross-validation. Due to its obsolescence, it's not recommended for new safety-critical designs—consider upgrading to the MAX17854 family, which offers functional safety documentation and better diagnostic coverage.
What are the thermal design considerations when operating the MAX17841GUE+T at maximum SPI data rates in a sealed battery enclosure?
The MAX17841GUE+T in TSSOP package has limited thermal dissipation capability, especially in sealed battery enclosures where ambient temperatures can exceed 70°C. Operating at high SPI clock rates (e.g., >5 MHz) increases internal power dissipation due to isolation buffer activity. To avoid thermal runaway or timing errors, ensure PCB copper pads provide sufficient heat spreading (at least 300 mm² of ground plane), avoid placing near high-power components, and derate SPI speed in high-temperature environments (>85°C). Consider reducing SPI frequency to 2–3 MHz and using burst-mode data reads to minimize active duty cycle, especially in thermally constrained pack designs.
What are the reliability risks of using MAX17841GUE+T in a high-vibration industrial battery system, and how can they be mitigated?
The TSSOP package of the MAX17841GUE+T is more susceptible to solder joint fatigue under continuous vibration compared to leaded or quad-flat packages. In high-vibration industrial applications like material handling or off-road equipment, microcracks can develop at the PCB interface, disrupting isolated SPI communication. To improve reliability, use underfill material around the package, reinforce PCB mounting with compliant brackets, and avoid locating the IC at board edges. Additionally, implement periodic SPI loopback self-tests in firmware to detect intermittent communication faults early. Given the device's obsolete status, evaluate transitioning to more rugged alternatives like the MAX17854ATJ+ with improved mechanical robustness and active support for industrial BMS designs.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MAX17841GUE+T CAD Models
Analog Devices Inc./Maxim Integrated MAX17841GUE+T PCB symbols & footprints
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