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Z8523310FSG Equivalent & Substitute Parts
Part Overview
The Z8523310FSG is a specialized interface IC manufactured by Zilog in a 44-QFP package. This component is classified as obsolete, making equivalent and substitute parts necessary for ongoing system support and new design implementations. The part operates within a 4.5V to 5.5V supply voltage range and is designed for surface mount applications. Given its obsolete status, identifying compatible alternatives from active product lines is essential for procurement and design continuity.
Substiute Parts
Key Parameters
| Parameter | Z8523310FSG |
|---|---|
| Manufacturer | Zilog |
| Category | Interface |
| Package / Case | 44-QFP |
| Mounting Type | Surface Mount |
| Voltage - Supply | 4.5V ~ 5.5V |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
Substitute Part Grouping Explanation
Substitute parts for the Z8523310FSG are selected based on the following criteria:
Primary Substitution Parameters:
- Category: Interface IC
- Mounting Type: Surface Mount
- RoHS3 Compliance: Required
- REACH Unaffected Status: Required
- Voltage Supply Range Compatibility: Parts must operate within or encompass the 4.5V to 5.5V range, or provide functional overlap
Substitution Logic: Substitute parts are grouped by their ability to fulfill interface functionality while maintaining compliance certifications and surface mount compatibility. Parts with active product status are prioritized over obsolete alternatives. Package form factors vary based on application requirements, as different QFP, QFN, DFN, and BGA packages may accommodate the same functional requirements depending on PCB layout constraints.
Parameter Comparison
| Part Number | Manufacturer | Package / Case | Mounting Type | Voltage - Supply | Product Status | RoHS Status | MSL |
|---|---|---|---|---|---|---|---|
| Z8523310FSG | Zilog | 44-QFP | Surface Mount | 4.5V ~ 5.5V | Obsolete | ROHS3 Compliant | 3 (168 Hours) |
| TDA8026ET/C3Y | NXP USA Inc. | 64-TFBGA (7x7) | Surface Mount | 2.7V ~ 5.5V | Active | ROHS3 Compliant | 2 (1 Year) |
| LTC4317CDHC#PBF | Analog Devices Inc. | 16-WFDFN Exposed Pad | Surface Mount | 2.25V ~ 5.5V | Active | ROHS3 Compliant | 1 (Unlimited) |
| DS110DF111SQE/NOPB | Texas Instruments | 24-WQFN (4x4) | Surface Mount | 2.375V ~ 2.625V, 3V ~ 3.6V | Active | ROHS3 Compliant | 3 (168 Hours) |
| LTC1955EUH#PBF | Analog Devices Inc. | 32-WFQFN Exposed Pad | Surface Mount | 1.7V ~ 5.5V | Active | ROHS3 Compliant | 1 (Unlimited) |
| AD7569KNZ | Analog Devices Inc. | 24-DIP (0.300", 7.62mm) | Through Hole | 4.75V ~ 5.25V | Active | ROHS3 Compliant | 1 (Unlimited) |
| DP83822HRHBT | Texas Instruments | 32-VFQFN Exposed Pad | Surface Mount | 1.71V ~ 3.45V | Active | ROHS3 Compliant | 2 (1 Year) |
| LMH0034MAX/NOPB | Texas Instruments | 16-SOIC (0.154", 3.90mm Width) | Surface Mount | 3.135V ~ 3.465V | Active | ROHS3 Compliant | 1 (Unlimited) |
Engineering Selection Recommendations
All substitute parts listed maintain ROHS3 compliance and REACH unaffected status, meeting regulatory requirements equivalent to the Z8523310FSG. The following considerations apply:
Active Product Status Priority: TDA8026ET/C3Y, LTC4317CDHC#PBF, DS110DF111SQE/NOPB, LTC1955EUH#PBF, DP83822HRHBT, and LMH0034MAX/NOPB are all active products with established supply chains and ongoing manufacturer support, providing superior long-term availability compared to the obsolete Z8523310FSG.
Voltage Supply Range: TDA8026ET/C3Y, LTC4317CDHC#PBF, and LTC1955EUH#PBF offer voltage ranges that fully encompass the original 4.5V to 5.5V specification. AD7569KNZ provides a closely matched range of 4.75V to 5.25V, suitable for applications with tighter voltage tolerance requirements.
Moisture Sensitivity: Parts with MSL 1 (Unlimited) provide superior handling flexibility during storage and assembly. Parts with MSL 2 or 3 require controlled moisture environments consistent with the original component's MSL 3 specification.
Mounting Type Consideration: AD7569KNZ is a through-hole component and represents a substitution option only for applications where PCB redesign to through-hole mounting is feasible. All other substitutes maintain surface mount compatibility with the original Z8523310FSG.
Frequently Asked Questions (FAQ)
Q: Why is the Z8523310FSG listed as obsolete? A: The Z8523310FSG is an obsolete product from Zilog's EMSCCâ„¢ series. Obsolete status indicates the manufacturer has discontinued production and support. Substitute parts from active product lines ensure continued availability and manufacturer technical support.
Q: Can I directly replace the Z8523310FSG with any of these substitute parts? A: Direct replacement depends on functional requirements and PCB layout constraints. All listed substitutes are interface ICs with ROHS3 compliance and surface mount capability (except AD7569KNZ, which is through-hole). Package form factors differ, requiring PCB design evaluation for each candidate.
Q: What is the significance of the voltage supply range differences? A: The Z8523310FSG operates at 4.5V to 5.5V. Substitute parts with wider ranges (such as 2.7V to 5.5V or 1.7V to 5.5V) provide greater design flexibility for multi-voltage systems. Parts with narrower ranges (such as 3.135V to 3.465V) are suitable only for applications operating within their specified range.
Q: Does MSL rating affect substitution compatibility? A: MSL rating indicates moisture sensitivity during storage and assembly. The Z8523310FSG has MSL 3 (168 Hours), requiring controlled moisture environments. Substitute parts with MSL 1 (Unlimited) offer superior handling flexibility. Parts with MSL 2 or 3 require equivalent moisture control procedures.
Q: Are all substitute parts RoHS3 compliant? A: Yes. All substitute parts listed are ROHS3 compliant and REACH unaffected, matching the regulatory compliance of the Z8523310FSG.
Q: What package considerations should I evaluate? A: The Z8523310FSG uses a 44-QFP package. Substitute parts employ various packages including 64-TFBGA, 16-DFN, 24-WQFN, 32-QFN, 24-DIP, 32-VQFN, and 16-SOIC. Package selection depends on PCB layout, thermal requirements, and assembly capabilities. Surface mount packages (QFP, QFN, DFN, BGA, SOIC) require reflow soldering; through-hole packages (DIP) require wave soldering.
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