WDVC5510AZGWA2 Equivalent & Substitute Parts

Part Overview

The WDVC5510AZGWA2 is a fixed-point Digital Signal Processor (DSP) integrated circuit manufactured by Texas Instruments, designed for embedded applications requiring high-speed signal processing. This device features a 200MHz clock rate, 320kB on-chip RAM, and 32kB ROM, with dual voltage supply architecture (3.30V I/O, 1.60V core). The part is currently classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new design implementations.

Substiute Parts

WDVC5510AZGWA2
Texas InstrumentsIn Stock: 1176WDVC5510AZGWA2 Datasheet
WDVC5510AZGWA2
Current Part
WDVC5510AZAVA2
Texas InstrumentsIn Stock: 796WDVC5510AZAVA2 Datasheet
WDVC5510AZAVA2
Direct

Key Parameters

Parameter Value
Manufacturer Texas Instruments
Category Embedded, Integrated Circuits (ICs)
Type Fixed Point DSP
Clock Rate 200MHz
On-Chip RAM 320kB
Non-Volatile Memory (ROM) 32kB
Interface Host Interface, McBSP
Voltage - I/O 3.30V
Voltage - Core 1.60V
Operating Temperature Range -40°C ~ 85°C (TC)
Mounting Type Surface Mount
Package / Case 240-LFBGA
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the WDVC5510AZGWA2 is determined by strict equivalence across the following critical parameters:

Core Functional Parameters:

  • Fixed-point DSP architecture with identical clock rate (200MHz)
  • Matching memory configuration: 320kB on-chip RAM and 32kB ROM
  • Identical interface specification: Host Interface and McBSP support
  • Dual voltage supply compatibility: 3.30V I/O and 1.60V core

Physical & Environmental Parameters:

  • Surface mount technology with 240-pin BGA package footprint
  • Operating temperature range: -40°C to 85°C
  • Moisture sensitivity level 3 (168 hours)
  • RoHS3 compliance

Regulatory & Compliance Parameters:

  • ECCN classification: 3A991A2
  • HTSUS code: 8542.31.0001

The WDVC5510AZAVA2 meets all substitution criteria through identical functional specifications and environmental ratings, with the primary distinction being product status (active versus obsolete) and package variant designation.

Parameter Comparison

Parameter WDVC5510AZGWA2 (Main) WDVC5510AZAVA2 (Substitute) Match Status
Manufacturer Texas Instruments Texas Instruments Identical
Type Fixed Point Fixed Point Identical
Clock Rate 200MHz 200MHz Identical
On-Chip RAM 320kB 320kB Identical
Non-Volatile Memory (ROM) 32kB 32kB Identical
Interface Host Interface, McBSP Host Interface, McBSP Identical
Voltage - I/O 3.30V 3.30V Identical
Voltage - Core 1.60V 1.60V Identical
Operating Temperature -40°C ~ 85°C (TC) -40°C ~ 85°C (TC) Identical
Mounting Type Surface Mount Surface Mount Identical
Package / Case 240-LFBGA 240-LFBGA Identical
Supplier Device Package 240-BGA MICROSTAR (15x15) 240-NFBGA (15x15) Variant
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours) Identical
Product Status Obsolete Active Different

Engineering Selection Recommendations

The WDVC5510AZAVA2 serves as a direct functional equivalent to the WDVC5510AZGWA2 for applications requiring fixed-point DSP processing at 200MHz with specified memory and interface configurations. Selection of the substitute part is supported by the following factors:

Product Status Consideration: The WDVC5510AZGWA2 is classified as obsolete, while the WDVC5510AZAVA2 maintains active product status. This distinction ensures continued availability, manufacturing support, and supply chain reliability for new implementations and system maintenance.

Compliance & Certification: Both parts maintain identical RoHS3 compliance and REACH unaffected status, ensuring regulatory alignment for applications subject to environmental and hazardous substance restrictions. Identical ECCN and HTSUS classifications confirm export control and tariff equivalence.

Package & Environmental Equivalence: Both devices employ 240-pin BGA surface-mount packaging with identical thermal and moisture specifications. The package variant designation (MICROSTAR versus NFBGA) represents supplier-specific nomenclature for functionally equivalent 15x15mm BGA configurations.

Memory & Interface Parity: Identical on-chip RAM (320kB), ROM (32kB), and interface specifications (Host Interface, McBSP) ensure software and hardware compatibility without modification to existing firmware or PCB designs.

Frequently Asked Questions (FAQ)

Q: Can the WDVC5510AZAVA2 replace the WDVC5510AZGWA2 in existing designs?

A: Yes. The WDVC5510AZAVA2 provides functional equivalence across all critical parameters: clock rate, memory configuration, interface specification, voltage requirements, and operating temperature range. No design modifications are required for direct substitution.

Q: What is the significance of the package variant designation (MICROSTAR versus NFBGA)?

A: Both designations refer to 240-pin BGA packages with identical 15x15mm footprints and pin configurations. The variant naming reflects supplier-specific nomenclature and does not affect electrical or mechanical compatibility.

Q: Why is the WDVC5510AZGWA2 classified as obsolete?

A: Obsolescence classification indicates the part is no longer in active production. The WDVC5510AZAVA2, with identical specifications and active status, ensures continued access to equivalent functionality and manufacturing support.

Q: Are there any voltage or thermal differences between these parts?

A: No. Both parts operate with identical I/O voltage (3.30V), core voltage (1.60V), and temperature range (-40°C to 85°C). Moisture sensitivity levels are also identical at MSL 3 (168 hours).

Q: What compliance certifications apply to both parts?

A: Both the WDVC5510AZGWA2 and WDVC5510AZAVA2 are RoHS3 compliant. The WDVC5510AZAVA2 additionally carries REACH unaffected status. Both share identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications.

Q: Is PCB redesign necessary when switching from WDVC5510AZGWA2 to WDVC5510AZAVA2?

A: No. Identical package specifications (240-LFBGA, 15x15mm footprint) and pin configurations eliminate the need for PCB layout modifications.

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