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WDVC5510AZGWA2 Equivalent & Substitute Parts
Part Overview
The WDVC5510AZGWA2 is a fixed-point Digital Signal Processor (DSP) integrated circuit manufactured by Texas Instruments, designed for embedded applications requiring high-speed signal processing. This device features a 200MHz clock rate, 320kB on-chip RAM, and 32kB ROM, with dual voltage supply architecture (3.30V I/O, 1.60V core). The part is currently classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new design implementations.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Category | Embedded, Integrated Circuits (ICs) |
| Type | Fixed Point DSP |
| Clock Rate | 200MHz |
| On-Chip RAM | 320kB |
| Non-Volatile Memory (ROM) | 32kB |
| Interface | Host Interface, McBSP |
| Voltage - I/O | 3.30V |
| Voltage - Core | 1.60V |
| Operating Temperature Range | -40°C ~ 85°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 240-LFBGA |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the WDVC5510AZGWA2 is determined by strict equivalence across the following critical parameters:
Core Functional Parameters:
- Fixed-point DSP architecture with identical clock rate (200MHz)
- Matching memory configuration: 320kB on-chip RAM and 32kB ROM
- Identical interface specification: Host Interface and McBSP support
- Dual voltage supply compatibility: 3.30V I/O and 1.60V core
Physical & Environmental Parameters:
- Surface mount technology with 240-pin BGA package footprint
- Operating temperature range: -40°C to 85°C
- Moisture sensitivity level 3 (168 hours)
- RoHS3 compliance
Regulatory & Compliance Parameters:
- ECCN classification: 3A991A2
- HTSUS code: 8542.31.0001
The WDVC5510AZAVA2 meets all substitution criteria through identical functional specifications and environmental ratings, with the primary distinction being product status (active versus obsolete) and package variant designation.
Parameter Comparison
| Parameter | WDVC5510AZGWA2 (Main) | WDVC5510AZAVA2 (Substitute) | Match Status |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Identical |
| Type | Fixed Point | Fixed Point | Identical |
| Clock Rate | 200MHz | 200MHz | Identical |
| On-Chip RAM | 320kB | 320kB | Identical |
| Non-Volatile Memory (ROM) | 32kB | 32kB | Identical |
| Interface | Host Interface, McBSP | Host Interface, McBSP | Identical |
| Voltage - I/O | 3.30V | 3.30V | Identical |
| Voltage - Core | 1.60V | 1.60V | Identical |
| Operating Temperature | -40°C ~ 85°C (TC) | -40°C ~ 85°C (TC) | Identical |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| Package / Case | 240-LFBGA | 240-LFBGA | Identical |
| Supplier Device Package | 240-BGA MICROSTAR (15x15) | 240-NFBGA (15x15) | Variant |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) | Identical |
| Product Status | Obsolete | Active | Different |
Engineering Selection Recommendations
The WDVC5510AZAVA2 serves as a direct functional equivalent to the WDVC5510AZGWA2 for applications requiring fixed-point DSP processing at 200MHz with specified memory and interface configurations. Selection of the substitute part is supported by the following factors:
Product Status Consideration: The WDVC5510AZGWA2 is classified as obsolete, while the WDVC5510AZAVA2 maintains active product status. This distinction ensures continued availability, manufacturing support, and supply chain reliability for new implementations and system maintenance.
Compliance & Certification: Both parts maintain identical RoHS3 compliance and REACH unaffected status, ensuring regulatory alignment for applications subject to environmental and hazardous substance restrictions. Identical ECCN and HTSUS classifications confirm export control and tariff equivalence.
Package & Environmental Equivalence: Both devices employ 240-pin BGA surface-mount packaging with identical thermal and moisture specifications. The package variant designation (MICROSTAR versus NFBGA) represents supplier-specific nomenclature for functionally equivalent 15x15mm BGA configurations.
Memory & Interface Parity: Identical on-chip RAM (320kB), ROM (32kB), and interface specifications (Host Interface, McBSP) ensure software and hardware compatibility without modification to existing firmware or PCB designs.
Frequently Asked Questions (FAQ)
Q: Can the WDVC5510AZAVA2 replace the WDVC5510AZGWA2 in existing designs?
A: Yes. The WDVC5510AZAVA2 provides functional equivalence across all critical parameters: clock rate, memory configuration, interface specification, voltage requirements, and operating temperature range. No design modifications are required for direct substitution.
Q: What is the significance of the package variant designation (MICROSTAR versus NFBGA)?
A: Both designations refer to 240-pin BGA packages with identical 15x15mm footprints and pin configurations. The variant naming reflects supplier-specific nomenclature and does not affect electrical or mechanical compatibility.
Q: Why is the WDVC5510AZGWA2 classified as obsolete?
A: Obsolescence classification indicates the part is no longer in active production. The WDVC5510AZAVA2, with identical specifications and active status, ensures continued access to equivalent functionality and manufacturing support.
Q: Are there any voltage or thermal differences between these parts?
A: No. Both parts operate with identical I/O voltage (3.30V), core voltage (1.60V), and temperature range (-40°C to 85°C). Moisture sensitivity levels are also identical at MSL 3 (168 hours).
Q: What compliance certifications apply to both parts?
A: Both the WDVC5510AZGWA2 and WDVC5510AZAVA2 are RoHS3 compliant. The WDVC5510AZAVA2 additionally carries REACH unaffected status. Both share identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications.
Q: Is PCB redesign necessary when switching from WDVC5510AZGWA2 to WDVC5510AZAVA2?
A: No. Identical package specifications (240-LFBGA, 15x15mm footprint) and pin configurations eliminate the need for PCB layout modifications.
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