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VLZ4V3-GS08 Equivalent & Substitute Parts
Part Overview
The VLZ4V3-GS08 is a Zener Diode rated at 4.3 V with 500 mW power dissipation in a Surface Mount SOD-80 QuadroMELF package. Manufactured by Vishay General Semiconductor - Diodes Division, this component is classified as Obsolete. Due to its obsolete status, identification of equivalent substitute parts is necessary to maintain design continuity and ensure component availability for production and repair applications. The substitute part maintains identical electrical specifications while offering active product status and alternative packaging configurations.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Zener (Nominal) | 4.3 | V |
| Power - Maximum | 500 | mW |
| Impedance (Maximum) | 40 | Ohms |
| Voltage - Forward (Maximum) @ If | 1.5 V @ 200 mA | V @ mA |
| Operating Temperature Range | -65 to 175 | °C |
| Mounting Type | Surface Mount | — |
| Package / Case | SOD-80 | — |
| Grade | Automotive | — |
| Qualification | AEC-Q101 | — |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitution of the VLZ4V3-GS08 is determined by the following critical parameters:
- Zener Voltage (Nominal): 4.3 V — must match exactly
- Power Dissipation (Maximum): 500 mW — must match or exceed
- Impedance (Maximum): 40 Ohms — must match or be lower
- Forward Voltage: 1.5 V @ 200 mA — must match or be lower
- Operating Temperature Range: -65°C to 175°C — must encompass or match
- Package Type: SOD-80 — physical and electrical compatibility required
- Mounting Type: Surface Mount — must be compatible
- Compliance Standards: RoHS3, AEC-Q101, REACH Unaffected — must be maintained
The substitute part TLZ4V3-GS08 meets all electrical and thermal specifications. Both parts are manufactured by Vishay General Semiconductor - Diodes Division and share identical core electrical parameters. The primary difference is product status (Obsolete vs. Active) and packaging variant (QuadroMELF vs. MiniMELF within the SOD-80 family).
Parameter Comparison
| Parameter | VLZ4V3-GS08 (Main Part) | TLZ4V3-GS08 (Substitute) | Match Status |
|---|---|---|---|
| Voltage - Zener (Nominal) | 4.3 V | 4.3 V | Identical |
| Power - Maximum | 500 mW | 500 mW | Identical |
| Impedance (Maximum) | 40 Ohms | 40 Ohms | Identical |
| Voltage - Forward (Maximum) @ If | 1.5 V @ 200 mA | 1.5 V @ 200 mA | Identical |
| Operating Temperature Range | -65°C to 175°C | -65°C to 175°C | Identical |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| Package / Case | SOD-80 QuadroMELF | SOD-80 MiniMELF | Compatible Variant |
| Product Status | Obsolete | Active | Substitute is Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | Identical |
| REACH Status | REACH Unaffected | REACH Unaffected | Identical |
Engineering Selection Recommendations
The TLZ4V3-GS08 is a direct electrical equivalent to the VLZ4V3-GS08. Both components are manufactured by Vishay General Semiconductor - Diodes Division and maintain identical electrical specifications across all critical parameters: Zener voltage, power dissipation, impedance, forward voltage, and operating temperature range.
Product Status Consideration: The VLZ4V3-GS08 is classified as Obsolete, while the TLZ4V3-GS08 is Active. For new designs and ongoing production, the TLZ4V3-GS08 is the appropriate selection due to its active status and continued manufacturer support.
Compliance and Certification: Both parts maintain ROHS3 compliance, AEC-Q101 automotive qualification (VLZ4V3-GS08), and REACH Unaffected status. The TLZ4V3-GS08 is suitable for automotive and industrial applications requiring equivalent performance.
Package Compatibility: Both parts use SOD-80 package technology. The VLZ4V3-GS08 uses QuadroMELF variant while the TLZ4V3-GS08 uses MiniMELF variant. Both are surface mount compatible and electrically interchangeable. PCB layout and thermal management considerations should account for the physical footprint differences between QuadroMELF and MiniMELF variants.
Frequently Asked Questions (FAQ)
Q: Can the TLZ4V3-GS08 be used as a direct replacement for the VLZ4V3-GS08?
A: Yes. The TLZ4V3-GS08 is electrically equivalent to the VLZ4V3-GS08. Both components have identical Zener voltage (4.3 V), power rating (500 mW), impedance (40 Ohms), forward voltage (1.5 V @ 200 mA), and operating temperature range (-65°C to 175°C). Both are surface mount SOD-80 devices manufactured by Vishay General Semiconductor - Diodes Division.
Q: What is the difference between QuadroMELF and MiniMELF packaging?
A: Both QuadroMELF and MiniMELF are variants within the SOD-80 package family. The primary difference is physical size and thermal characteristics. QuadroMELF provides a larger footprint, while MiniMELF offers a more compact form factor. Electrical performance is identical. PCB layout modifications may be required when transitioning between these variants.
Q: Why is the VLZ4V3-GS08 marked as Obsolete?
A: The VLZ4V3-GS08 is classified as Obsolete by the manufacturer. The TLZ4V3-GS08 is the active equivalent part. For new designs and production applications, the TLZ4V3-GS08 should be specified to ensure long-term component availability and manufacturer support.
Q: Are there any compliance or certification differences between these parts?
A: Both parts are ROHS3 compliant and REACH Unaffected. The VLZ4V3-GS08 carries AEC-Q101 automotive qualification. Both components are suitable for automotive and industrial applications. Compliance requirements should be verified against specific application standards.
Q: What is the Moisture Sensitivity Level (MSL) for these components?
A: Both the VLZ4V3-GS08 and TLZ4V3-GS08 have MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. Standard handling and storage procedures are applicable.
Q: Can these parts be used interchangeably in existing designs?
A: Electrical interchangeability is confirmed. Physical footprint differences between QuadroMELF and MiniMELF variants require PCB layout verification. Thermal management and board space considerations should be evaluated for the specific application.
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