UCC3802N Equivalent & Substitute Parts

Part Overview

The UCC3802N is an offline switch controller IC manufactured by Texas Instruments, designed for power conversion applications supporting Boost, Buck, Flyback, and Forward topologies with switching frequencies up to 1MHz. The device is classified as obsolete, making equivalent substitute parts necessary for new designs and production continuity. The UCC3802N operates with a supply voltage range of 8.3V to 12V and includes current limiting fault protection with frequency control features. Due to its obsolete status, the UCC3802D surface mount variant serves as the primary active substitute while maintaining identical electrical specifications.

Substiute Parts

UCC3802N

Texas InstrumentsIn Stock: 1657UCC3802N Datasheet

Current PartRFQ

UCC3802D

Texas InstrumentsIn Stock: 1324UCC3802D Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the UCC3802N is determined by strict equivalence across all electrical and functional parameters. The UCC3802 base product family maintains identical electrical specifications across package variants. The primary substitution criterion is the preservation of:

• Voltage supply range (8.3V ~ 12V)
• Startup voltage threshold (12.5V)
• Maximum switching frequency (1MHz)
• Supported topologies (Boost, Buck, Flyback, Forward)
• Duty cycle capability (99%)
• Fault protection mechanism (Current Limiting)
• Control features (Frequency Control)
• Operating temperature range (-40°C ~ 85°C)
• Compliance certifications (ROHS3, REACH Unaffected)

The UCC3802D is electrically equivalent to the UCC3802N, with the primary difference being the package format: the UCC3802N uses through-hole 8-DIP packaging while the UCC3802D uses surface mount 8-SOIC packaging. Both variants share identical electrical performance and are manufactured by Texas Instruments under the same base product number.

Parameter Comparison

Engineering Selection Recommendations

The UCC3802D is the recommended substitute for the UCC3802N based on product status and compliance alignment. The UCC3802N is classified as obsolete, while the UCC3802D maintains active product status with identical electrical specifications and certifications. Both devices are ROHS3 compliant and REACH unaffected, ensuring regulatory compliance for new designs.

Selection between these variants depends on PCB assembly requirements: the UCC3802N through-hole package suits legacy designs or applications requiring manual assembly, while the UCC3802D surface mount package is appropriate for modern automated manufacturing processes. The electrical performance, thermal characteristics, and functional capabilities remain identical across both package formats.

Frequently Asked Questions (FAQ)

Q: Can the UCC3802D directly replace the UCC3802N in existing designs?

A: Electrical substitution is direct due to identical specifications. PCB layout modification is required due to package format differences: the UCC3802N uses through-hole 8-DIP while the UCC3802D uses surface mount 8-SOIC. Pin-to-pin electrical functionality is equivalent.

Q: Why is the UCC3802N classified as obsolete?

A: The UCC3802N through-hole package variant has reached end-of-life status. The UCC3802D surface mount variant remains in active production, reflecting industry transition toward surface mount technology.

Q: Are there any compliance differences between UCC3802N and UCC3802D?

A: No. Both variants maintain identical ROHS3 compliance and REACH unaffected status. Moisture sensitivity level (MSL 1 - Unlimited) is equivalent across both packages.

Q: What are the key electrical parameters that define substitution eligibility?

A: Substitution eligibility is determined by matching supply voltage range (8.3V ~ 12V), startup voltage (12.5V), maximum switching frequency (1MHz), supported topologies (Boost, Buck, Flyback, Forward), duty cycle (99%), fault protection (Current Limiting), and operating temperature range (-40°C ~ 85°C).

Q: Does package format affect electrical performance?

A: No. The 8-DIP and 8-SOIC packages contain identical die and electrical specifications. Package selection is determined by PCB assembly method and space constraints, not electrical performance.