TLP701HF(F) Equivalent & Substitute Parts

Part Overview

The TLP701HF(F) is a 2-channel optical isolation gate driver manufactured by Toshiba Semiconductor and Storage, designed for high-voltage switching applications requiring galvanic isolation. This component provides 5000Vrms isolation voltage with dual-channel gate drive capability in a 6-SDIP surface mount package.

The TLP701HF(F) is classified as obsolete. Identifying suitable substitute components is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications currently utilizing this part.

Substiute Parts

TLP701HF(F)
Toshiba Semiconductor and StorageIn Stock: 958TLP701HF(F) Datasheet
TLP701HF(F)
Current Part
TLP5771H(D4TP4,E
Toshiba Semiconductor and StorageIn Stock: 2339TLP5771H(D4TP4,E Datasheet
TLP5771H(D4TP4,E
MFR Recommended

Key Parameters

Parameter Value Unit
Technology Optical Coupling
Number of Channels 2
Voltage - Isolation 5000 Vrms
Common Mode Transient Immunity (Min) 20 kV/µs
Propagation Delay tpLH / tpHL (Max) 700 / 700 ns
Pulse Width Distortion (Max) 500 ns
Current - Output High, Low 400 / 400 mA
Current - Peak Output 200 mA
Voltage - Output Supply 10 ~ 30 V
Operating Temperature -40 ~ 125 °C
Mounting Type Surface Mount
Package / Case 6-SOIC (0.268", 6.80mm Width)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the TLP701HF(F) is evaluated based on the following critical parameters that define functional equivalence:

Isolation Voltage: Both the main part and substitute must maintain 5000Vrms isolation rating to preserve galvanic separation in high-voltage applications.

Technology Platform: Optical coupling technology is maintained across substitute candidates to ensure compatibility with existing input/output signal conditioning circuits.

Operating Temperature Range: The -40°C to 125°C operating window must be supported by substitute parts to maintain thermal performance specifications.

Output Supply Voltage: The 10V to 30V output supply range defines the gate drive voltage compatibility window.

Mounting Type and Package Compatibility: Surface mount technology is required; however, package dimensions may vary within the 6-pin SOIC family.

Regulatory Compliance: Approval agencies (UL, CSA, cUL, VDE) provide assurance of safety and performance standards.

The TLP5771H(D4TP4,E) is identified as a manufacturer-recommended substitute. While this part operates as a single-channel device (versus the dual-channel TLP701HF(F)), it maintains the core isolation voltage, technology platform, and operating temperature specifications. The substitute exhibits improved performance characteristics in propagation delay, common mode transient immunity, and output current capability.

Parameter Comparison

Parameter TLP701HF(F) TLP5771H(D4TP4,E) Unit
Manufacturer Toshiba Semiconductor and Storage Toshiba Semiconductor and Storage
Technology Optical Coupling Optical Coupling
Number of Channels 2 1
Voltage - Isolation 5000 5000 Vrms
Common Mode Transient Immunity (Min) 20 35 kV/µs
Propagation Delay tpLH / tpHL (Max) 700 / 700 150 / 150 ns
Pulse Width Distortion (Max) 500 50 ns
Rise / Fall Time (Typ) 50 / 50 56 / 25 ns
Current - Output High, Low 400 / 400 1000 / 1000 mA
Current - Peak Output 200 1000 mA
Voltage - Output Supply 10 ~ 30 10 ~ 30 V
Operating Temperature -40 ~ 125 -40 ~ 125 °C
Mounting Type Surface Mount Surface Mount
Package / Case 6-SOIC (0.268", 6.80mm Width) 6-SOIC (0.295", 7.50mm Width)
Product Status Obsolete Active
Approval Agency CSA, cUL, UL, VDE CQC, CSA, cUL, UL, VDE

Engineering Selection Recommendations

Product Status Consideration: The TLP701HF(F) is classified as obsolete, making the TLP5771H(D4TP4,E) the appropriate active alternative from the same manufacturer. The substitute maintains active production status and full regulatory support.

Regulatory Compliance: Both parts carry UL, CSA, and cUL certifications, with the substitute offering expanded compliance through CQC and VDE approvals. This ensures continued compliance with international safety standards.

Channel Configuration: The primary design difference is the reduction from 2 channels to 1 channel in the substitute part. Applications requiring dual-channel isolation must implement two TLP5771H(D4TP4,E) devices in parallel or select alternative dual-channel solutions.

Performance Enhancement: The TLP5771H(D4TP4,E) demonstrates superior electrical characteristics, including 4.67× faster propagation delay (150ns vs. 700ns), 10× lower pulse width distortion (50ns vs. 500ns), and 5× higher output current capability (1A vs. 200mA peak). These improvements provide enhanced switching performance and gate drive capability.

Package Footprint: The substitute part uses a slightly wider 6-SOIC package (7.50mm vs. 6.80mm). PCB layout modifications are required to accommodate the increased package width. Pin compatibility within the 6-pin SOIC family is maintained.

Supply Chain Availability: The substitute part maintains 2281 pieces in current inventory versus 881 pieces for the obsolete part, ensuring reliable supply for new production and design transitions.

Frequently Asked Questions (FAQ)

Q: Can the TLP5771H(D4TP4,E) directly replace the TLP701HF(F) in existing designs?

A: Direct replacement is not possible without circuit modification. The TLP5771H(D4TP4,E) is a single-channel device, while the TLP701HF(F) provides two channels. Applications requiring dual-channel isolation must implement two substitute devices or redesign the gate drive circuit architecture.

Q: What are the key electrical differences between these parts?

A: The substitute part offers superior performance: propagation delay is reduced from 700ns to 150ns, pulse width distortion decreases from 500ns to 50ns, and peak output current increases from 200mA to 1A. Common mode transient immunity improves from 20kV/µs to 35kV/µs. These enhancements provide faster switching response and higher gate drive capability.

Q: Are there package compatibility concerns?

A: Both parts use 6-pin SOIC surface mount packages. The substitute package is 0.295" (7.50mm) wide compared to 0.268" (6.80mm) for the original part. PCB layout modifications are necessary to accommodate the wider package footprint. Pin assignments remain compatible within the 6-pin SOIC family.

Q: Do both parts meet the same regulatory standards?

A: Both parts carry UL, CSA, and cUL certifications. The substitute part includes additional CQC and VDE approvals, providing expanded international compliance coverage. Both maintain 5000Vrms isolation voltage certification.

Q: What is the operating temperature range for the substitute part?

A: The TLP5771H(D4TP4,E) operates across the same -40°C to 125°C temperature range as the original TLP701HF(F), ensuring thermal performance compatibility in equivalent environmental conditions.

Q: How does the output supply voltage requirement compare?

A: Both parts require 10V to 30V output supply voltage. Gate drive circuit power supply specifications remain unchanged when transitioning to the substitute part.

Q: Is the substitute part currently in production?

A: Yes, the TLP5771H(D4TP4,E) is classified as active product status with 2281 pieces in current inventory. The original TLP701HF(F) is obsolete with limited remaining stock (881 pieces).

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