TLP701A(TP,F) Equivalent & Substitute Parts

Part Overview

The TLP701A(TP,F) is a 600mA gate driver optical coupler manufactured by Toshiba Semiconductor and Storage, providing 5000Vrms isolation in a 6-SDIP gull wing surface mount package. This component is designed for high-voltage gate driving applications requiring galvanic isolation between control and power circuits.

The TLP701A(TP,F) is classified as obsolete. Locating equivalent substitute parts is necessary to support ongoing system maintenance, design updates, and new production requirements where this component is specified or functionally required.

Substiute Parts

TLP701A(TP,F)

Toshiba Semiconductor and StorageIn Stock: 1145TLP701A(TP,F) Datasheet

Current PartRFQ

TLP5771(TP,E

Toshiba Semiconductor and StorageIn Stock: 1115TLP5771(TP,E Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLP701A(TP,F) is determined by the following critical parameters that must be maintained or exceeded:

Mandatory Compatibility Parameters:

• Technology: Optical Coupling (single-channel gate driver architecture)
• Voltage - Isolation: 5000Vrms minimum
• Number of Channels: 1
• Voltage - Output Supply Range: 10V ~ 30V
• Mounting Type: Surface Mount
• Package Category: 6-SOIC (surface mount, 6-pin configuration)

Performance Parameters (Substitutes Must Meet or Exceed):

• Current - Peak Output: 600mA minimum
• Operating Temperature Range: Must encompass or extend the -40°C ~ 100°C range

The TLP5771(TP,E) qualifies as a direct substitute because it maintains all mandatory compatibility parameters while providing enhanced performance specifications across propagation delay, pulse width distortion, rise/fall time, and output current capacity.

Parameter Comparison

Engineering Selection Recommendations

TLP5771(TP,E) as Primary Substitute:

The TLP5771(TP,E) is the manufacturer-recommended substitute for the obsolete TLP701A(TP,F). This part maintains functional and electrical compatibility across all critical isolation, supply voltage, and channel configuration parameters.

The TLP5771(TP,E) provides measurable performance improvements in propagation delay (150ns versus 500ns), pulse width distortion (50ns versus 350ns), and output current capacity (1A versus 600mA peak). The extended operating temperature range (-40°C ~ 110°C versus -40°C ~ 100°C) provides additional thermal margin.

Both parts carry equivalent international safety approvals (CSA, cUL, UL, VDE for TLP701A; CQC, cUR, UR, VDE for TLP5771). The TLP5771(TP,E) holds active product status with RoHS compliance and REACH unaffected designation, supporting long-term supply chain continuity.

Package Consideration:

Both parts use 6-SOIC surface mount packages. The TLP5771(TP,E) package width is 7.50mm compared to 6.80mm for the TLP701A(TP,F). PCB layout verification is required to confirm package footprint compatibility in existing designs.

Frequently Asked Questions (FAQ)

Q: Can the TLP5771(TP,E) directly replace the TLP701A(TP,F) in existing designs?

A: The TLP5771(TP,E) maintains electrical compatibility across isolation voltage, supply voltage range, channel configuration, and operating temperature specifications. PCB layout must accommodate the slightly larger 6-SOIC package width (7.50mm versus 6.80mm). Functional verification of gate drive timing and output current requirements is necessary for design validation.

Q: What are the key performance differences between these parts?

A: The TLP5771(TP,E) provides faster propagation delay (150ns versus 500ns), lower pulse width distortion (50ns versus 350ns), higher output current capacity (1A versus 600mA peak), and improved common mode transient immunity (35kV/µs versus 20kV/µs). These enhancements result in improved gate drive performance and reduced timing uncertainty.

Q: Are there compliance or certification differences?

A: Both parts carry international safety certifications appropriate for isolated gate driver applications. The TLP5771(TP,E) includes RoHS compliance and REACH unaffected status, supporting modern supply chain and environmental requirements. The TLP701A(TP,F) certifications (CSA, cUL, UL, VDE) remain valid for legacy system support.

Q: What is the supply availability status?

A: The TLP701A(TP,F) is classified as obsolete with 1107 pieces in current inventory. The TLP5771(TP,E) is active product with 1077 pieces in inventory, ensuring ongoing availability for new designs and production requirements.

Q: How do the package dimensions affect PCB layout?

A: Both parts use 6-SOIC surface mount packages. The TLP5771(TP,E) has a package width of 7.50mm (0.295") compared to 6.80mm (0.268") for the TLP701A(TP,F). Existing PCB layouts designed for the TLP701A(TP,F) require footprint verification and potential layout adjustment to accommodate the TLP5771(TP,E) package dimensions.

Q: What is the forward voltage difference and does it affect circuit design?

A: The TLP5771(TP,E) forward voltage is 1.65V typical compared to 1.57V for the TLP701A(TP,F). This 0.08V difference is within normal component tolerance and does not require input circuit redesign for standard gate driver applications operating within the 10V ~ 30V supply range.