TLC27M2CP Equivalent & Substitute Parts

Part Overview

The TLC27M2CP is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, part of the LinCMOS™ series. This device integrates two independent amplifier circuits in an 8-pin DIP package and is designed for low-power analog signal processing applications requiring rail-to-rail operation across a 3V to 16V supply range.

The TLC27M2CP is designated as Last Time Buy, indicating discontinued production status. Identifying equivalent and substitute parts is necessary to ensure design continuity and maintain component availability for ongoing production, maintenance, and new designs requiring identical or compatible functionality.

Substiute Parts

TLC27M2CP

Texas InstrumentsIn Stock: 4254TLC27M2CP Datasheet

Current PartRFQ

TLC27M2CDR

Texas InstrumentsIn Stock: 55149TLC27M2CDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC27M2CP is determined by electrical parameter equivalence and functional compatibility. The primary substitute identified is the TLC27M2CDR, which shares the identical base product number (TLC27M2) and maintains all critical electrical specifications:

Key Parameters Determining Substitution:

• Amplifier Type: CMOS (identical)
• Number of Circuits: 2 (identical)
• Slew Rate: 0.62 V/µs (identical)
• Gain Bandwidth Product: 635 kHz (identical)
• Input Bias Current: 0.7 pA (identical)
• Input Offset Voltage: 1.1 mV (identical)
• Supply Current: 285 µA per channel (identical)
• Output Current: 30 mA per channel (identical)
• Supply Voltage Range: 3V to 16V (identical)
• Operating Temperature: 0°C to 70°C (identical)
• Base Product Number: TLC27M2 (identical)

The TLC27M2CDR differs only in packaging format (8-SOIC surface mount versus 8-DIP through-hole) and product status (Active versus Last Time Buy). All electrical and functional parameters remain equivalent.

Parameter Comparison

Engineering Selection Recommendations

Electrical Compatibility:

The TLC27M2CDR is electrically equivalent to the TLC27M2CP. All analog performance parameters, supply voltage requirements, and operating temperature specifications are identical. The devices are functionally interchangeable from a circuit design perspective.

Regulatory and Compliance Status:

Both parts maintain ROHS3 compliance and REACH Unaffected status, satisfying current environmental and regulatory requirements. Both are classified under ECCN EAR99 and HTSUS code 8542.33.0001.

Product Status Consideration:

The TLC27M2CP is designated Last Time Buy, indicating production discontinuation. The TLC27M2CDR maintains Active product status with significantly higher inventory availability (55,100 pieces versus 4,200 pieces), ensuring long-term supply continuity.

Packaging and Mounting Differences:

The primary distinction between these parts is packaging format. The TLC27M2CP uses through-hole 8-DIP mounting, while the TLC27M2CDR uses surface-mount 8-SOIC packaging. Selection between these variants depends on PCB design requirements and assembly process capabilities. Through-hole designs require DIP sockets or wave soldering processes, while surface-mount designs require reflow soldering and SMD placement equipment.

Selection Criteria:

• For existing through-hole PCB designs: TLC27M2CP (while inventory remains available)
• For new designs or surface-mount PCB layouts: TLC27M2CDR
• For designs requiring long-term supply assurance: TLC27M2CDR (Active status, higher inventory)

Frequently Asked Questions (FAQ)

Q: Can the TLC27M2CDR directly replace the TLC27M2CP in an existing circuit?

A: Electrically, yes. All analog specifications are identical. However, physical replacement requires PCB redesign if the original design uses through-hole DIP sockets. The TLC27M2CDR requires surface-mount footprint and reflow soldering.

Q: What is the difference between 8-DIP and 8-SOIC packaging?

A: 8-DIP (Dual In-line Package) is a through-hole component with 0.300" (7.62mm) pin spacing, suitable for breadboards and wave soldering. 8-SOIC (Small Outline Integrated Circuit) is a surface-mount package with 0.154" (3.90mm) width, requiring SMD placement and reflow soldering. Pin count and electrical function are identical.

Q: Why is the TLC27M2CP marked as Last Time Buy?

A: Last Time Buy designation indicates Texas Instruments has discontinued production of this part number. Existing inventory may be available, but no future production is planned. The TLC27M2CDR (Active status) is the recommended alternative for new designs.

Q: Are there any electrical performance differences between these parts?

A: No. Slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, and supply voltage range are identical across both part numbers.

Q: What is the Moisture Sensitivity Level (MSL) difference?

A: The TLC27M2CP lists MSL as Not Applicable, while the TLC27M2CDR specifies MSL 1 (Unlimited). MSL 1 indicates the component can be stored indefinitely without moisture control measures, providing superior shelf-life characteristics for the surface-mount variant.

Q: Can I use the TLC27M2CDR in a design originally specified for TLC27M2CP?

A: Functionally and electrically, yes. The circuit behavior will be identical. PCB layout and assembly process must be adapted to accommodate surface-mount 8-SOIC packaging instead of through-hole 8-DIP.

Q: Which part should I specify for a new design?

A: The TLC27M2CDR is recommended for new designs. It maintains Active product status, offers higher inventory availability, and provides superior long-term supply assurance compared to the Last Time Buy TLC27M2CP.