TLC27L2BIP Equivalent & Substitute Parts

Part Overview

The TLC27L2BIP is a CMOS amplifier integrated circuit manufactured by Texas Instruments, featuring two independent amplifier circuits in an 8-pin DIP package. This device operates as a low-power, low-speed operational amplifier suitable for applications requiring minimal current consumption and moderate bandwidth performance. The part is currently in Last Time Buy status, indicating discontinued production. Identifying equivalent and substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and support long-term product availability for existing applications.

Substiute Parts

TLC27L2BIP

Texas InstrumentsIn Stock: 1515TLC27L2BIP Datasheet

Current PartRFQ

TLC27L2BIDR

Texas InstrumentsIn Stock: 2057TLC27L2BIDR Datasheet

MFR RecommendedRFQ

NJM13404D#

Nisshinbo Micro Devices Inc.In Stock: 817NJM13404D# Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLC27L2BIP is determined by strict equivalence across the following critical parameters:

Primary Substitution Criteria:

• Number of circuits: 2 independent amplifier channels
• Amplifier type: CMOS technology
• Slew rate: 0.03 V/µs
• Gain bandwidth product: 110 kHz
• Input bias current: 0.6 pA
• Input offset voltage: 240 µV
• Supply current per channel: 20 µA
• Output current per channel: 30 mA
• Supply voltage range: 4 V to 16 V
• Operating temperature: -40°C to 85°C
• RoHS compliance: ROHS3 Compliant

Packaging Considerations: Substitutes may differ in mounting type (through-hole versus surface-mount) and package form factor (DIP versus SOIC), provided all electrical parameters remain identical. Package selection depends on circuit board design and assembly capabilities.

Parameter Comparison

Engineering Selection Recommendations

TLC27L2BIDR (Texas Instruments, Manufacturer Recommended):

The TLC27L2BIDR is the manufacturer-recommended equivalent substitute for the TLC27L2BIP. This part maintains identical electrical specifications across all critical parameters: CMOS amplifier type, dual-circuit configuration, 0.03 V/µs slew rate, 110 kHz gain bandwidth product, 0.6 pA input bias current, 240 µV input offset voltage, 20 µA supply current per channel, and 30 mA output current per channel. Supply voltage range (4 V to 16 V) and operating temperature range (-40°C to 85°C) are identical. The primary difference is packaging: TLC27L2BIDR uses 8-SOIC surface-mount technology versus the through-hole 8-DIP package of the main part. Both parts carry ROHS3 compliance and are manufactured by Texas Instruments. The TLC27L2BIDR is in Active product status with higher inventory availability (2000 Pcs), making it suitable for new designs and ongoing production requiring surface-mount assembly.

NJM13404D# (Nisshinbo Micro Devices Inc., Functional Alternative):

The NJM13404D# is a general-purpose dual-amplifier alternative manufactured by Nisshinbo Micro Devices Inc. While this part shares the same dual-circuit configuration, 8-DIP through-hole package, and operating temperature range (-40°C to 85°C), it exhibits significantly different electrical performance characteristics. The NJM13404D# features a 1.2 V/µs slew rate (40× faster), 2 MHz gain bandwidth product (18× higher), 25 nA input bias current (41,667× higher), and 500 µV input offset voltage (2.08× higher). Supply current consumption is substantially higher at 2 mA per channel (100× greater). The supply voltage range is wider (2 V to 14 V). This part is suitable only for applications where higher bandwidth, faster slew rate, and increased output current capability are required, and where the elevated supply current consumption is acceptable. The NJM13404D# is in Active product status with RoHS compliance.

Frequently Asked Questions (FAQ)

Q1: Can TLC27L2BIDR be used as a direct replacement for TLC27L2BIP in existing through-hole PCB designs?

A: TLC27L2BIDR cannot be used as a direct through-hole replacement due to its 8-SOIC surface-mount package. However, it is electrically equivalent and can be used in new designs or PCB revisions that accommodate surface-mount assembly. For through-hole designs requiring an active substitute, NJM13404D# maintains the 8-DIP package format but with different electrical performance characteristics.

Q2: What are the key electrical differences between TLC27L2BIP and NJM13404D#?

A: The primary differences are: NJM13404D# has 40× faster slew rate (1.2 V/µs vs. 0.03 V/µs), 18× higher gain bandwidth product (2 MHz vs. 110 kHz), 41,667× higher input bias current (25 nA vs. 0.6 pA), and 100× higher supply current consumption (2 mA vs. 20 µA per channel). These differences make NJM13404D# unsuitable for low-power, low-bandwidth applications designed around TLC27L2BIP specifications.

Q3: Is TLC27L2BIDR suitable for low-power battery-operated applications?

A: Yes. TLC27L2BIDR maintains identical supply current specifications (20 µA per channel) as the TLC27L2BIP, making it equally suitable for low-power applications. The only consideration is the surface-mount package requirement.

Q4: What compliance certifications apply to these substitute parts?

A: TLC27L2BIP and TLC27L2BIDR are both ROHS3 Compliant and REACH Unaffected. NJM13404D# is RoHS Compliant and REACH Unaffected. All three parts carry ECCN classification EAR99 and HTSUS code 8542.33.0001.

Q5: Why is TLC27L2BIP in Last Time Buy status?

A: Last Time Buy status indicates the manufacturer (Texas Instruments) has discontinued production of this part number. Existing inventory is available for final orders, but no future production is planned. The manufacturer-recommended substitute is TLC27L2BIDR, which remains in Active production status.

Q6: Can NJM13404D# be used in applications originally designed for TLC27L2BIP?

A: NJM13404D# can be used only if the application can tolerate significantly higher bandwidth (2 MHz vs. 110 kHz), faster slew rate (1.2 V/µs vs. 0.03 V/µs), higher input bias current (25 nA vs. 0.6 pA), and 100× higher supply current consumption. For applications requiring the exact electrical characteristics of TLC27L2BIP, NJM13404D# is not suitable.

Q7: What is the difference between 8-DIP and 8-SOIC packages?

A: 8-DIP (Dual In-line Package) is a through-hole package with 0.300" (7.62mm) width, suitable for manual insertion and wave soldering. 8-SOIC (Small Outline Integrated Circuit) is a surface-mount package with 0.154" (3.90mm) width, requiring pick-and-place assembly and reflow soldering. Both packages contain the same number of pins and can carry identical die, but require different PCB designs and assembly processes.