THGAMRT0T43BAIR Equivalent & Substitute Parts

Part Overview

The THGAMRT0T43BAIR is a 1Tbit NAND Flash eMMC memory IC manufactured by Kioxia America, Inc., packaged in a 153-WFBGA (11.5x13mm) configuration. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and component procurement. The part operates across an industrial temperature range of -25°C to 85°C and complies with RoHS3 and REACH standards.

Substiute Parts

THGAMRT0T43BAIR
Kioxia America, Inc.In Stock: 5246THGAMRT0T43BAIR Datasheet
THGAMRT0T43BAIR
Current Part
THGAMVT0T43BAIR
Kioxia America, Inc.In Stock: 967THGAMVT0T43BAIR Datasheet
THGAMVT0T43BAIR
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number THGAMRT0T43BAIR
Manufacturer Kioxia America, Inc.
Memory Type Non-Volatile FLASH
Memory Size 1Tbit
Memory Organization 128G x 8
Memory Interface eMMC
Package Type 153-WFBGA (11.5x13mm)
Operating Temperature -25°C ~ 85°C (TA)
Mounting Type Surface Mount
Product Status Obsolete
RoHS Compliance ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the THGAMRT0T43BAIR is determined by the following critical parameters:

  • Memory Capacity: 1Tbit (128G x 8 organization) must be maintained
  • Interface Standard: eMMC protocol compatibility
  • Package Footprint: 153-BGA form factor (11.5x13mm) for PCB layout compatibility
  • Mounting Technology: Surface mount configuration
  • Environmental Compliance: RoHS3 and REACH certification status
  • Moisture Sensitivity: MSL 3 rating for handling and storage requirements

The substitute part THGAMVT0T43BAIR meets these core substitution criteria while offering enhanced specifications in interface capability and supply voltage range.

Parameter Comparison

Parameter THGAMRT0T43BAIR (Main) THGAMVT0T43BAIR (Substitute)
Manufacturer Kioxia America, Inc. Kioxia America, Inc.
Memory Type Non-Volatile FLASH Non-Volatile FLASH
Memory Size 1Tbit 1Tbit
Memory Organization 128G x 8 128G x 8
Memory Interface eMMC eMMC_5.1
Clock Frequency Not specified 200 MHz
Voltage - Supply Not specified 2.7V ~ 3.6V
Operating Temperature -25°C ~ 85°C (TA) -20°C ~ 85°C (TC)
Package Type 153-WFBGA (11.5x13mm) 153-VFBGA (11.5x13mm)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
RoHS Compliance ROHS3 Compliant Not specified
MSL Rating 3 (168 Hours) 3 (168 Hours)
ECCN 3A991B1A 3A991B1A
HTSUS 8542.32.0071 8542.32.0071

Engineering Selection Recommendations

The THGAMVT0T43BAIR is the manufacturer-recommended substitute for the obsolete THGAMRT0T43BAIR. Both components share identical memory capacity, organization, and physical footprint specifications. The substitute part is currently in active production status, ensuring long-term availability and supply chain continuity.

Key considerations for selection:

  • Interface Upgrade: The substitute implements eMMC_5.1 specification versus the base eMMC interface, providing enhanced protocol capabilities
  • Supply Voltage Definition: The substitute specifies 2.7V ~ 3.6V operating range, whereas the original part does not provide this specification
  • Temperature Range: The substitute operates from -20°C to 85°C (TC), compared to the original -25°C to 85°C (TA). Applications requiring operation below -20°C require design review
  • Compliance Continuity: Both parts share identical ECCN and HTSUS classifications, maintaining regulatory alignment
  • Packaging Variants: Both use 153-BGA form factor with identical 11.5x13mm dimensions, ensuring PCB compatibility without layout modification

Frequently Asked Questions (FAQ)

Q: Can THGAMVT0T43BAIR directly replace THGAMRT0T43BAIR in existing designs?

A: Yes, for applications operating within -20°C to 85°C temperature range. The identical 153-BGA footprint (11.5x13mm), memory capacity (1Tbit, 128G x 8), and eMMC interface compatibility enable direct substitution without PCB redesign. Applications requiring operation below -20°C require thermal analysis.

Q: What is the difference between 153-WFBGA and 153-VFBGA package designations?

A: Both designations refer to 153-ball fine-pitch BGA packages with 11.5x13mm dimensions. The letter suffix indicates internal package variant classification by the manufacturer. Both are mechanically and electrically compatible for this application.

Q: Are there supply voltage compatibility concerns?

A: The substitute part specifies 2.7V ~ 3.6V supply voltage. Designs must confirm that system power delivery meets this specification. The original part does not provide voltage specification in available documentation.

Q: Does the eMMC_5.1 interface provide backward compatibility?

A: eMMC_5.1 maintains protocol compatibility with earlier eMMC specifications. The 200 MHz clock frequency of the substitute represents enhanced performance capability compared to the original part.

Q: What are the moisture handling requirements?

A: Both parts carry MSL 3 rating, requiring storage at ≤30°C and ≤60% relative humidity, with a floor life of 168 hours after moisture exposure. Identical handling procedures apply to both components.

Q: Are there regulatory or compliance differences?

A: Both parts share identical ECCN (3A991B1A) and HTSUS (8542.32.0071) classifications. RoHS3 compliance is confirmed for the original part; compliance status for the substitute should be verified with the manufacturer for specific applications.

Request Quote (Ships tomorrow)