Request Quote
(Ships tomorrow)
THGAMRT0T43BAIR Equivalent & Substitute Parts
Part Overview
The THGAMRT0T43BAIR is a 1Tbit NAND Flash eMMC memory IC manufactured by Kioxia America, Inc., packaged in a 153-WFBGA (11.5x13mm) configuration. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and component procurement. The part operates across an industrial temperature range of -25°C to 85°C and complies with RoHS3 and REACH standards.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | THGAMRT0T43BAIR |
| Manufacturer | Kioxia America, Inc. |
| Memory Type | Non-Volatile FLASH |
| Memory Size | 1Tbit |
| Memory Organization | 128G x 8 |
| Memory Interface | eMMC |
| Package Type | 153-WFBGA (11.5x13mm) |
| Operating Temperature | -25°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Product Status | Obsolete |
| RoHS Compliance | ROHS3 Compliant |
| MSL Rating | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the THGAMRT0T43BAIR is determined by the following critical parameters:
- Memory Capacity: 1Tbit (128G x 8 organization) must be maintained
- Interface Standard: eMMC protocol compatibility
- Package Footprint: 153-BGA form factor (11.5x13mm) for PCB layout compatibility
- Mounting Technology: Surface mount configuration
- Environmental Compliance: RoHS3 and REACH certification status
- Moisture Sensitivity: MSL 3 rating for handling and storage requirements
The substitute part THGAMVT0T43BAIR meets these core substitution criteria while offering enhanced specifications in interface capability and supply voltage range.
Parameter Comparison
| Parameter | THGAMRT0T43BAIR (Main) | THGAMVT0T43BAIR (Substitute) |
|---|---|---|
| Manufacturer | Kioxia America, Inc. | Kioxia America, Inc. |
| Memory Type | Non-Volatile FLASH | Non-Volatile FLASH |
| Memory Size | 1Tbit | 1Tbit |
| Memory Organization | 128G x 8 | 128G x 8 |
| Memory Interface | eMMC | eMMC_5.1 |
| Clock Frequency | Not specified | 200 MHz |
| Voltage - Supply | Not specified | 2.7V ~ 3.6V |
| Operating Temperature | -25°C ~ 85°C (TA) | -20°C ~ 85°C (TC) |
| Package Type | 153-WFBGA (11.5x13mm) | 153-VFBGA (11.5x13mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Product Status | Obsolete | Active |
| RoHS Compliance | ROHS3 Compliant | Not specified |
| MSL Rating | 3 (168 Hours) | 3 (168 Hours) |
| ECCN | 3A991B1A | 3A991B1A |
| HTSUS | 8542.32.0071 | 8542.32.0071 |
Engineering Selection Recommendations
The THGAMVT0T43BAIR is the manufacturer-recommended substitute for the obsolete THGAMRT0T43BAIR. Both components share identical memory capacity, organization, and physical footprint specifications. The substitute part is currently in active production status, ensuring long-term availability and supply chain continuity.
Key considerations for selection:
- Interface Upgrade: The substitute implements eMMC_5.1 specification versus the base eMMC interface, providing enhanced protocol capabilities
- Supply Voltage Definition: The substitute specifies 2.7V ~ 3.6V operating range, whereas the original part does not provide this specification
- Temperature Range: The substitute operates from -20°C to 85°C (TC), compared to the original -25°C to 85°C (TA). Applications requiring operation below -20°C require design review
- Compliance Continuity: Both parts share identical ECCN and HTSUS classifications, maintaining regulatory alignment
- Packaging Variants: Both use 153-BGA form factor with identical 11.5x13mm dimensions, ensuring PCB compatibility without layout modification
Frequently Asked Questions (FAQ)
Q: Can THGAMVT0T43BAIR directly replace THGAMRT0T43BAIR in existing designs?
A: Yes, for applications operating within -20°C to 85°C temperature range. The identical 153-BGA footprint (11.5x13mm), memory capacity (1Tbit, 128G x 8), and eMMC interface compatibility enable direct substitution without PCB redesign. Applications requiring operation below -20°C require thermal analysis.
Q: What is the difference between 153-WFBGA and 153-VFBGA package designations?
A: Both designations refer to 153-ball fine-pitch BGA packages with 11.5x13mm dimensions. The letter suffix indicates internal package variant classification by the manufacturer. Both are mechanically and electrically compatible for this application.
Q: Are there supply voltage compatibility concerns?
A: The substitute part specifies 2.7V ~ 3.6V supply voltage. Designs must confirm that system power delivery meets this specification. The original part does not provide voltage specification in available documentation.
Q: Does the eMMC_5.1 interface provide backward compatibility?
A: eMMC_5.1 maintains protocol compatibility with earlier eMMC specifications. The 200 MHz clock frequency of the substitute represents enhanced performance capability compared to the original part.
Q: What are the moisture handling requirements?
A: Both parts carry MSL 3 rating, requiring storage at ≤30°C and ≤60% relative humidity, with a floor life of 168 hours after moisture exposure. Identical handling procedures apply to both components.
Q: Are there regulatory or compliance differences?
A: Both parts share identical ECCN (3A991B1A) and HTSUS (8542.32.0071) classifications. RoHS3 compliance is confirmed for the original part; compliance status for the substitute should be verified with the manufacturer for specific applications.
Alternative Parts
SJ6012L2TP
Littelfuse Inc.
6 Alternative Parts
JMK107BBJ476MA-RE
Taiyo Yuden
10 Alternative Parts
GMK107BBJ475MA-T
Taiyo Yuden
5 Alternative Parts
SJ6020N2ARP
Littelfuse Inc.
3 Alternative Parts
SJ6025R2ATP
Littelfuse Inc.
4 Alternative Parts
2474-05L
API Delevan Inc.
1 Alternative Parts
4590R-684K
API Delevan Inc.
1 Alternative Parts
CM6560R-334
API Delevan Inc.
1 Alternative Parts
CM6460-104
API Delevan Inc.
1 Alternative Parts
5526-12
API Delevan Inc.
1 Alternative Parts