TCR3DM18,RF(SE Linear Voltage Regulator Equivalent & Substitute Parts

Part Overview

The TCR3DM18,RF(SE is a linear voltage regulator IC manufactured by Toshiba Semiconductor and Storage, classified as a Power Management (PMIC) component. This device functions as a positive fixed output LDO (Low Dropout) regulator with a 300mA output current capability and 1.8V fixed output voltage. The part is actively produced and widely used in applications requiring stable low-voltage power delivery with minimal dropout characteristics.

Identification of equivalent and substitute parts becomes necessary when the primary part number is unavailable, when alternative packaging formats are required, or when design flexibility across qualified component sources is needed. The substitute parts listed maintain electrical and mechanical compatibility within the specified parameter ranges.

Key Parameters

Parameter	Value	Unit
Output Configuration	Positive	—
Output Type	Fixed	—
Number of Regulators	1	—
Voltage - Input (Max)	5.5	V
Voltage - Output (Min/Fixed)	1.8	V
Voltage Dropout (Max)	0.38	V @ 300mA
Current - Output	300	mA
Operating Temperature Range	-40 to 85	°C
Mounting Type	Surface Mount	—
Package / Case	4-UDFN Exposed Pad	—
Control Features	Enable	—
Protection Features	Over Current, Over Temperature	—
RoHS Status	ROHS3 Compliant	—
Moisture Sensitivity Level (MSL)	1 (Unlimited)	—

Substitute Part Grouping Explanation

Substitute parts for the TCR3DM18,RF(SE are qualified based on the following critical parameters that determine functional and mechanical compatibility:

Primary Substitution Criteria:

Output voltage: 1.8V fixed
Output current: 300mA minimum
Maximum input voltage: 5.5V
Dropout voltage: ≤0.38V @ 300mA
Package type: 4-UDFN Exposed Pad or equivalent footprint
Operating temperature range: -40°C to 85°C minimum
Control features: Enable function required
Protection: Over Current and Over Temperature protection required
Compliance: ROHS3 Compliant, MSL 1

The substitute parts identified maintain these electrical specifications and mechanical compatibility. Variations in secondary parameters such as quiescent current (Iq) and PSRR do not affect substitutability when primary parameters are met.

Parameter Comparison

Parameter	TCR3DM18,RF(SE	TCR3DM18,LF(SE	BU18UA3WNVX-TL
Manufacturer	Toshiba Semiconductor and Storage	Toshiba Semiconductor and Storage	Rohm Semiconductor
Output Configuration	Positive	Positive	Positive
Output Type	Fixed	Fixed	Fixed
Number of Regulators	1	1	1
Voltage - Input (Max)	5.5V	5.5V	5.5V
Voltage - Output (Min/Fixed)	1.8V	1.8V	1.8V
Voltage Dropout (Max)	0.38V @ 300mA	0.38V @ 300mA	0.32V @ 300mA
Current - Output	300mA	300mA	300mA
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C
Mounting Type	Surface Mount	Surface Mount	Surface Mount
Package / Case	4-UDFN Exposed Pad	4-UDFN Exposed Pad	4-UDFN Exposed Pad
Supplier Device Package	4-DFN (1x1)	4-DFN (1x1)	SSON004X1010
Control Features	Enable	Enable	Enable
Protection Features	Over Current, Over Temperature	Over Current, Over Temperature	Over Current, Over Temperature
Product Status	Active	Active	Not For New Designs
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
MSL	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)

Engineering Selection Recommendations

TCR3DM18,LF(SE is a direct parametric equivalent to the TCR3DM18,RF(SE. Both parts are manufactured by Toshiba Semiconductor and Storage, maintain identical electrical specifications, and carry Active product status. The primary distinction is the packaging format designation (RF versus LF suffix). This part is suitable for new designs and ongoing production applications.

BU18UA3WNVX-TL manufactured by Rohm Semiconductor meets all critical electrical parameters and maintains the required 4-UDFN Exposed Pad package footprint. This part exhibits superior dropout voltage performance (0.32V versus 0.38V @ 300mA). However, this part carries a "Not For New Designs" product status designation. Selection of this part is appropriate only for legacy system maintenance, repair, or applications where existing inventory must be utilized. For new design implementations, TCR3DM18,LF(SE is the preferred substitute.

All three parts maintain ROHS3 compliance, MSL 1 rating, and identical operating temperature ranges, ensuring regulatory and environmental compatibility across applications.

Frequently Asked Questions (FAQ)

Q: Can TCR3DM18,LF(SE be used as a direct replacement for TCR3DM18,RF(SE in existing designs?

A: Yes. Both parts are manufactured by Toshiba Semiconductor and Storage and maintain identical electrical specifications, output voltage (1.8V fixed), output current (300mA), maximum input voltage (5.5V), dropout voltage (0.38V @ 300mA), operating temperature range (-40°C to 85°C), and package type (4-UDFN Exposed Pad). The RF and LF designations indicate different packaging formats within the same product line. Schematic and PCB layouts require no modification.

Q: What is the difference between the Toshiba TCR3DM18 variants and the Rohm BU18UA3WNVX-TL?

A: All three parts share identical output voltage (1.8V), output current (300mA), input voltage rating (5.5V max), operating temperature range (-40°C to 85°C), and package footprint (4-UDFN Exposed Pad). The BU18UA3WNVX-TL offers lower dropout voltage (0.32V versus 0.38V @ 300mA). The primary distinction is manufacturer source and product status: Toshiba parts are Active, while the Rohm part is designated "Not For New Designs."

Q: Is the BU18UA3WNVX-TL suitable for new product development?

A: The BU18UA3WNVX-TL carries a "Not For New Designs" product status. This designation indicates the manufacturer does not recommend this part for new design implementations. For new product development, TCR3DM18,LF(SE is the appropriate selection. The BU18UA3WNVX-TL is suitable for legacy system support, repair operations, or applications utilizing existing inventory.

Q: Are there package compatibility concerns when substituting between these parts?

A: No. All three parts utilize the 4-UDFN Exposed Pad package type with identical footprints. PCB layouts and assembly processes require no modification. The supplier device package designations (4-DFN 1x1 for Toshiba parts and SSON004X1010 for the Rohm part) refer to the same physical package specification.

Q: Do all substitute parts maintain the same compliance certifications?

A: Yes. All three parts are ROHS3 Compliant, carry MSL 1 (Unlimited) moisture sensitivity rating, and are REACH Unaffected. Regulatory and environmental compliance requirements are satisfied across all substitute options.

Q: What is the significance of the dropout voltage difference between TCR3DM18,RF(SE and BU18UA3WNVX-TL?

A: The BU18UA3WNVX-TL exhibits 0.32V dropout at 300mA compared to 0.38V for the TCR3DM18,RF(SE. This 0.06V difference represents improved efficiency in applications operating near the minimum input voltage threshold. For applications with input voltage margins exceeding 0.5V above the 1.8V output requirement, this difference is not functionally significant. For margin-constrained designs, the lower dropout voltage of the BU18UA3WNVX-TL provides operational advantage.

Q: Can these parts be used interchangeably in the same PCB assembly?

A: Yes, provided the PCB layout accommodates the 4-UDFN Exposed Pad footprint. All three parts share identical pinout, electrical specifications, and mechanical dimensions. Assembly processes, reflow profiles, and handling procedures remain unchanged. No design modifications are required for substitution.

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