STPS30170CFP Equivalent & Substitute Parts

Part Overview

The STPS30170CFP is a Schottky diode array manufactured by STMicroelectronics, configured as 1 pair common cathode with a maximum reverse voltage rating of 170 V and average rectified current of 15 A per diode. The device is packaged in TO-220-3 Full Pack for through-hole mounting applications. This part is classified as obsolete, necessitating identification of equivalent substitute components for new designs and ongoing production requirements. Substitute parts maintain functional compatibility while offering alternative packaging options, current ratings, or active product status.

Substiute Parts

STPS30170CFP

STMicroelectronicsIn Stock: 1119STPS30170CFP Datasheet

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STPS40170CG-TR

STMicroelectronicsIn Stock: 4369STPS40170CG-TR Datasheet

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MBRF20200CTG

onsemiIn Stock: 8780MBRF20200CTG Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the STPS30170CFP are selected based on the following critical parameters that determine functional compatibility:

Mandatory Matching Parameters:

• Diode Configuration: 1 Pair Common Cathode
• Technology: Schottky
• Voltage - DC Reverse (Vr) (Max): 170 V or higher
• Speed: Fast Recovery ≤ 500ns, > 200mA (Io)

Flexible Parameters (Allow Variation):

• Current - Average Rectified (Io): May exceed 15 A
• Mounting Type: Through Hole or Surface Mount
• Package / Case: Alternative packages acceptable
• Product Status: Active status preferred for obsolete parts

The STPS40170CG-TR provides higher current capability (20 A) in an active product status but requires surface-mount assembly. The MBRF20200CTG maintains through-hole mounting compatibility with higher voltage rating (200 V) and active product status, though with reduced current capacity (10 A) and different manufacturer origin.

Parameter Comparison

Engineering Selection Recommendations

STPS40170CG-TR (STMicroelectronics): This substitute is suitable for applications requiring higher current capacity (20 A versus 15 A) while maintaining identical reverse voltage rating (170 V) and forward voltage characteristics (920 mV @ 20 A). The part is manufactured by the same supplier as the original component and maintains ROHS3 compliance. The transition from through-hole TO-220-3 Full Pack to surface-mount D2PAK packaging requires PCB redesign. This option is recommended for new designs where surface-mount assembly is feasible and higher current capability provides design margin.

MBRF20200CTG (onsemi): This substitute maintains through-hole mounting compatibility with the original TO-220-3 Full Pack package, eliminating PCB redesign requirements. The part offers higher reverse voltage rating (200 V versus 170 V), providing additional voltage margin in applications with transient overvoltage conditions. However, the reduced current rating (10 A versus 15 A) limits applicability to designs with lower current requirements. The maximum junction temperature is reduced to 150°C compared to 175°C. This option is recommended for through-hole assembly requirements where current demand does not exceed 10 A and higher voltage rating is beneficial.

Both substitute parts maintain Schottky technology, fast recovery speed characteristics, and ROHS3 compliance. Product status is active for both alternatives, ensuring long-term availability compared to the obsolete original part.

Frequently Asked Questions (FAQ)

Q: Can STPS40170CG-TR directly replace STPS30170CFP without circuit modification?

A: Electrical substitution is valid; the STPS40170CG-TR maintains identical reverse voltage (170 V) and forward voltage characteristics (920 mV) with higher current capacity (20 A). However, packaging differs: STPS40170CG-TR uses surface-mount D2PAK while STPS30170CFP uses through-hole TO-220-3 Full Pack. PCB layout redesign is required for mounting compatibility.

Q: Is MBRF20200CTG suitable for applications originally designed for STPS30170CFP?

A: MBRF20200CTG is electrically compatible for applications where current demand does not exceed 10 A. The higher reverse voltage rating (200 V) provides additional margin. Through-hole TO-220-3 Full Pack packaging matches the original, eliminating PCB redesign. The reduced maximum junction temperature (150°C versus 175°C) must be verified against thermal design requirements.

Q: What are the key differences between the two substitute options?

A: STPS40170CG-TR offers higher current (20 A) and same-manufacturer sourcing but requires surface-mount assembly. MBRF20200CTG maintains through-hole compatibility and offers higher voltage rating but provides lower current capacity (10 A) and different manufacturer origin.

Q: Are all three parts ROHS3 compliant?

A: Yes, STPS30170CFP, STPS40170CG-TR, and MBRF20200CTG are all ROHS3 compliant. All parts are REACH unaffected and classified under ECCN EAR99.

Q: Which substitute is recommended for new production designs?

A: Selection depends on assembly capability and application requirements. For surface-mount capable facilities with current requirements up to 20 A, STPS40170CG-TR is recommended due to active product status and same-manufacturer sourcing. For through-hole assembly or current requirements below 10 A, MBRF20200CTG is recommended.

Q: What is the impact of reverse leakage current differences between substitutes?

A: STPS30170CFP specifies 20 µA @ 170 V, STPS40170CG-TR specifies 30 µA @ 170 V, and MBRF20200CTG specifies 1 mA @ 200 V. Higher leakage current in MBRF20200CTG may impact low-power standby performance in sensitive applications.