STPS10170CB Equivalent & Substitute Parts

Part Overview

The STPS10170CB is a Schottky diode array manufactured by STMicroelectronics, configured as 1 pair common cathode with a maximum reverse voltage rating of 170 V and average rectified current of 5 A per diode. The device is housed in a TO-252-3 DPAK surface mount package. This part is classified as obsolete, necessitating identification of active equivalent components for new designs and ongoing production requirements. Substitute parts must maintain functional compatibility through matching diode configuration, package type, and electrical performance within acceptable operating parameters.

Substiute Parts

STPS10170CB

STMicroelectronicsIn Stock: 2225STPS10170CB Datasheet

Current PartRFQ

RB088BM150FHTL

Rohm SemiconductorIn Stock: 3259RB088BM150FHTL Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the STPS10170CB is based on the following critical parameters that must be maintained or exceeded:

Configuration Match: The substitute part must feature a 1 pair common cathode diode array configuration to ensure pin-compatible operation within existing circuit designs.

Package Compatibility: The substitute must use the TO-252-3 DPAK surface mount package to maintain mechanical and thermal compatibility with printed circuit board layouts.

Schottky Technology: The substitute must employ Schottky diode technology to preserve the fast recovery characteristics and low forward voltage drop inherent to the original design.

Electrical Performance: The substitute must support the application voltage and current requirements. Reverse voltage rating must be sufficient for the circuit operating conditions. Average rectified current capacity must meet or exceed application demands.

Fast Recovery Specification: The substitute must maintain fast recovery characteristics (≤ 500ns, > 200mA) to preserve switching performance in rectification and protection circuits.

Compliance Standards: The substitute must maintain RoHS3 compliance and surface mount manufacturing compatibility.

Parameter Comparison

Engineering Selection Recommendations

The RB088BM150FHTL from Rohm Semiconductor is an active substitute for the obsolete STPS10170CB. Both components share identical diode configuration, package type, and fast recovery Schottky technology.

Voltage Consideration: The RB088BM150FHTL has a maximum reverse voltage rating of 150 V compared to the STPS10170CB's 170 V rating. This substitute is suitable for applications where the circuit operating voltage does not exceed 150 V. For circuits requiring operation above 150 V, alternative parts with higher voltage ratings must be evaluated.

Current Capability: The RB088BM150FHTL provides 10 A average rectified current per diode, exceeding the STPS10170CB's 5 A rating. This enhanced current capacity provides design margin for applications within the 150 V voltage constraint.

Forward Voltage: The RB088BM150FHTL exhibits a lower forward voltage drop (880 mV @ 5 A) compared to the STPS10170CB (920 mV @ 5 A), resulting in reduced power dissipation.

Product Status: The RB088BM150FHTL is classified as active with AEC-Q101 automotive qualification, ensuring ongoing availability and manufacturing support. Both components maintain ROHS3 compliance.

Temperature Rating: The STPS10170CB supports a maximum junction temperature of 175°C, while the RB088BM150FHTL is rated to 150°C. Thermal design must account for this reduced temperature margin in the substitute part.

Frequently Asked Questions (FAQ)

Q: Can the RB088BM150FHTL directly replace the STPS10170CB in all applications?

A: Direct replacement is possible only in applications where the circuit operating voltage does not exceed 150 V. The STPS10170CB's 170 V rating provides higher voltage margin. If the circuit operates above 150 V, the RB088BM150FHTL is not suitable, and alternative parts must be selected.

Q: What is the significance of the diode configuration "1 Pair Common Cathode"?

A: This configuration indicates two diodes sharing a common cathode connection. Pin compatibility and circuit function depend on this specific configuration. Substitutes must maintain identical configuration to ensure proper operation without circuit redesign.

Q: Are both parts pin-compatible in the TO-252-3 DPAK package?

A: Yes. Both the STPS10170CB and RB088BM150FHTL use the TO-252-3 DPAK package with identical pinout (2 leads plus tab). No PCB layout modifications are required for mechanical substitution.

Q: How does the forward voltage difference affect circuit performance?

A: The RB088BM150FHTL's lower forward voltage (880 mV vs. 920 mV @ 5 A) results in reduced power dissipation and improved efficiency. This difference is typically 4% lower, which may improve thermal performance in power-sensitive applications.

Q: What does "Fast Recovery ≤ 500ns, > 200mA (Io)" mean?

A: This specification indicates the diode exhibits fast recovery characteristics with recovery time not exceeding 500 nanoseconds for reverse currents greater than 200 milliamps. Both parts meet this specification, ensuring compatible switching performance in rectification and protection circuits.

Q: Why is the STPS10170CB classified as obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. The RB088BM150FHTL, classified as active, represents a current production alternative with equivalent functionality within its specified voltage range.

Q: Does the RB088BM150FHTL's AEC-Q101 qualification affect substitution?

A: AEC-Q101 qualification indicates automotive-grade reliability testing and is an additional quality assurance measure. This qualification does not prevent use in non-automotive applications and provides enhanced reliability documentation for applications requiring automotive-grade components.

Q: What is the impact of the 25°C difference in maximum junction temperature?

A: The RB088BM150FHTL's 150°C maximum junction temperature is 25°C lower than the STPS10170CB's 175°C rating. Thermal design must ensure the substitute part operates within this lower temperature limit. Applications with high ambient temperatures or significant power dissipation require thermal analysis to confirm compatibility.