STF12NK80Z N-Channel 800V 10.5A MOSFET Equivalent & Substitute Parts

Part Overview

The STF12NK80Z is an N-Channel MOSFET manufactured by STMicroelectronics, rated for 800V drain-to-source voltage with 10.5A continuous drain current at 25°C. This device operates in the SuperMESH™ series and is housed in a TO-220FP through-hole package. The part is Active status with full RoHS3 compliance and unlimited moisture sensitivity rating.

Substitute parts are identified when equivalent electrical performance can be achieved within the specified parameter tolerances, maintaining compatibility with existing circuit designs while accommodating component availability or supply chain requirements.

Substiute Parts

STF12NK80Z
STMicroelectronicsIn Stock: 4164STF12NK80Z Datasheet
STF12NK80Z
Current Part
IPA80R650CEXKSA2
Infineon TechnologiesIn Stock: 60318IPA80R650CEXKSA2 Datasheet
IPA80R650CEXKSA2
Similar
TK6A60W,S4VX
Toshiba Semiconductor and StorageIn Stock: 20347TK6A60W,S4VX Datasheet
TK6A60W,S4VX
Similar
TK9A60D(STA4,Q,M)
Toshiba Semiconductor and StorageIn Stock: 944TK9A60D(STA4,Q,M) Datasheet
TK9A60D(STA4,Q,M)
Similar

Key Parameters

Parameter Value Unit
FET Type N-Channel
Drain to Source Voltage (Vdss) 800 V
Current - Continuous Drain (Id) @ 25°C 10.5 A
Rds On (Max) @ Id, Vgs 750 mOhm @ 5.25A, 10V
Gate Charge (Qg) (Max) @ Vgs 87 nC @ 10V
Power Dissipation (Max) 40 W
Operating Temperature Range -55 to 150 °C
Mounting Type Through Hole
Package / Case TO-220-3 Full Pack
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the STF12NK80Z is determined by the following critical parameters:

Primary Substitution Criteria:

  • Drain to Source Voltage (Vdss): 800V minimum
  • N-Channel FET topology
  • Through-hole mounting configuration
  • RoHS3 compliance
  • Operating temperature range compatibility

Secondary Compatibility Factors:

  • Continuous drain current (Id) at rated conditions
  • On-state resistance (Rds On) at specified gate voltage
  • Gate charge characteristics
  • Power dissipation capability
  • Package footprint compatibility (TO-220 family variants)

The identified substitute parts operate at reduced voltage ratings (600V) or reduced current ratings (8A), representing trade-offs in performance envelope. These substitutes maintain N-Channel topology and through-hole mounting but operate within different electrical specifications.

Parameter Comparison

Parameter STF12NK80Z (Main) IPA80R650CEXKSA2 TK6A60W,S4VX TK9A60D(STA4,Q,M)
Manufacturer STMicroelectronics Infineon Technologies Toshiba Semiconductor Toshiba Semiconductor
Vdss (V) 800 800 600 600
Id @ 25°C (A) 10.5 8 6.2 9
Rds On (Max) (mOhm) 750 @ 5.25A, 10V 650 @ 5.1A, 10V 750 @ 3.1A, 10V 830 @ 4.5A, 10V
Gate Charge Qg (nC) 87 @ 10V 45 @ 10V 12 @ 10V 24 @ 10V
Power Dissipation (W) 40 33 30 45
Operating Temperature (°C) -55 to 150 -40 to 150 to 150 to 150
Package TO-220FP TO-220-3F TO-220SIS TO-220SIS
Series SuperMESH™ CoolMOS™ DTMOSIV π-MOSVII
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

IPA80R650CEXKSA2 (Infineon Technologies)

This substitute maintains the 800V Vdss rating of the main part, providing direct voltage compatibility. The 8A continuous drain current represents a 23.8% reduction from the STF12NK80Z specification. On-state resistance is improved at 650mOhm versus 750mOhm. Gate charge is significantly lower at 45nC, reducing driver requirements. Power dissipation is reduced to 33W. The part is RoHS3 compliant with unlimited moisture sensitivity. Operating temperature minimum is -40°C versus -55°C for the main part. TO-220-3F package maintains through-hole compatibility with standard PCB layouts.

TK6A60W,S4VX (Toshiba Semiconductor and Storage)

This substitute operates at 600V Vdss, representing a 25% voltage derating from the main part specification. Continuous drain current is 6.2A, a 40.9% reduction. On-state resistance matches the main part at 750mOhm. Gate charge is significantly reduced to 12nC. Power dissipation is 30W. The part is RoHS3 compliant. Operating temperature maximum is 150°C. TO-220SIS package provides through-hole mounting. This substitute is suitable only for applications with 600V or lower voltage requirements.

TK9A60D(STA4,Q,M) (Toshiba Semiconductor and Storage)

This substitute operates at 600V Vdss, representing a 25% voltage derating. Continuous drain current is 9A, a 14.3% reduction from the main part. On-state resistance is higher at 830mOhm. Gate charge is 24nC. Power dissipation is 45W, exceeding the main part specification. The part is RoHS3 compliant. Operating temperature maximum is 150°C. TO-220SIS package provides through-hole mounting. This substitute is suitable only for applications with 600V or lower voltage requirements.

All substitute parts maintain RoHS3 compliance and REACH unaffected status, supporting regulatory requirements equivalent to the main part.

Frequently Asked Questions (FAQ)

Q: Can the IPA80R650CEXKSA2 be used as a direct replacement for the STF12NK80Z?

A: The IPA80R650CEXKSA2 maintains the 800V Vdss rating and through-hole TO-220 package configuration. However, the continuous drain current is reduced to 8A from 10.5A. Substitution is valid only when circuit design accommodates the lower current rating and the 33W power dissipation limit.

Q: What is the primary limitation of the Toshiba TK6A60W,S4VX and TK9A60D(STA4,Q,M) substitutes?

A: Both Toshiba devices operate at 600V Vdss, which is 200V lower than the STF12NK80Z specification. These substitutes are suitable only for applications designed for 600V maximum voltage operation. They cannot be used in circuits requiring the full 800V rating.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. The STF12NK80Z and all identified substitute parts (IPA80R650CEXKSA2, TK6A60W,S4VX, and TK9A60D(STA4,Q,M)) are RoHS3 compliant with REACH unaffected status.

Q: How do gate charge differences affect circuit design?

A: The IPA80R650CEXKSA2 has significantly lower gate charge at 45nC compared to 87nC for the main part, reducing gate driver power requirements. The Toshiba devices have even lower gate charge at 12nC and 24nC respectively. Lower gate charge enables faster switching but requires driver compatibility verification.

Q: Are the TO-220FP, TO-220-3F, and TO-220SIS packages mechanically interchangeable?

A: All three packages are TO-220 family variants with three leads and through-hole mounting. Pin configurations are compatible for standard drain-gate-source arrangements. PCB footprints are functionally equivalent for standard TO-220 layouts. Physical dimensions may vary slightly between variants; verify mechanical clearance in confined spaces.

Q: What is the impact of reduced continuous drain current in substitutes?

A: The IPA80R650CEXKSA2 at 8A, TK6A60W,S4VX at 6.2A, and TK9A60D(STA4,Q,M) at 9A all represent reductions from the 10.5A main part specification. Substitution is valid only when maximum circuit current demand does not exceed the substitute part rating. Thermal management and power dissipation calculations must be recalculated based on actual operating current.

Q: Can operating temperature range differences affect substitution decisions?

A: The STF12NK80Z operates from -55°C to 150°C. The IPA80R650CEXKSA2 operates from -40°C to 150°C, with a 15°C higher minimum temperature. The Toshiba devices specify operation to 150°C maximum without explicit minimum temperature. Substitution is valid when circuit operating temperature remains within the substitute part specification.

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