SM671PXD-ADST Equivalent & Substitute Parts

Part Overview

The SM671PXD-ADST is a FLASH NAND (TLC) Memory IC manufactured by Silicon Motion, Inc., with 1Tbit capacity and UFS3.1 interface in a 153-BGA package. This component is classified as obsolete, making equivalent substitute parts necessary for ongoing system support and procurement planning. The part operates across an industrial temperature range of -25°C to 85°C and complies with ROHS3 standards.

Substiute Parts

SM671PXD-ADST

Silicon Motion, Inc.In Stock: 899SM671PXD-ADST Datasheet

Current PartRFQ

SM671PXD-AFST

Silicon Motion, Inc.In Stock: 1224SM671PXD-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM671PXD-ADST is determined by strict alignment of the following critical parameters:

• Memory Capacity: 1Tbit (128G x 8 organization)
• Memory Technology: FLASH - NAND (TLC)
• Memory Interface: UFS3.1
• Package Type: 153-TFBGA (11.5x13mm physical dimensions)
• Operating Temperature Range: -25°C ~ 85°C
• Mounting Configuration: Surface Mount
• Compliance Standards: ROHS3 Compliant, MSL 3

Substitute parts must match all parameters listed above to ensure functional and mechanical compatibility within the original application context.

Parameter Comparison

Engineering Selection Recommendations

The SM671PXD-AFST qualifies as a direct substitute for the SM671PXD-ADST based on complete parameter alignment across all critical electrical and mechanical specifications. Both components share identical memory capacity, technology, interface protocol, package configuration, and compliance certifications.

The primary distinction is product status: SM671PXD-ADST is obsolete while SM671PXD-AFST maintains active status. For new designs or ongoing procurement, SM671PXD-AFST is the appropriate selection. Both parts comply with ROHS3 standards and maintain equivalent MSL ratings, ensuring consistent handling and storage requirements.

Frequently Asked Questions (FAQ)

Q: Can SM671PXD-AFST replace SM671PXD-ADST in existing applications?

A: Yes. Both parts share identical electrical specifications (1Tbit capacity, UFS3.1 interface, FLASH NAND TLC technology), mechanical packaging (153-TFBGA, 11.5x13mm), and operating temperature range (-25°C ~ 85°C). No design modifications are required.

Q: What is the significance of the product status difference?

A: SM671PXD-ADST is classified as obsolete, indicating discontinued manufacturing. SM671PXD-AFST maintains active status, ensuring ongoing availability and supply chain continuity for new procurement and production requirements.

Q: Are there any compliance or handling differences between these parts?

A: No. Both components are ROHS3 compliant and carry identical MSL 3 ratings (168 hours), requiring the same moisture control and storage protocols during handling and assembly.

Q: Does the package designation 153-TFBGA (11.5x13) apply to both parts?

A: Yes. Both SM671PXD-ADST and SM671PXD-AFST use the identical 153-TFBGA package with 11.5x13mm physical dimensions, ensuring PCB footprint and assembly compatibility.

Q: What memory organization do these parts support?

A: Both parts support 128G x 8 memory organization within the 1Tbit total capacity, maintaining identical functional architecture for system integration.