SM671PED-ADST Equivalent & Substitute Parts

Part Overview

The SM671PED-ADST is a FLASH NAND (TLC) memory IC manufactured by Silicon Motion, Inc., featuring 1Tbit capacity with UFS3.1 interface in a 153-BGA package. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and procurement planning. The part operates across the industrial temperature range of -40°C to 85°C and complies with ROHS3 standards.

Substiute Parts

SM671PED-ADST

Silicon Motion, Inc.In Stock: 967SM671PED-ADST Datasheet

Current PartRFQ

SM671PED-AFST

Silicon Motion, Inc.In Stock: 1089SM671PED-AFST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM671PED-ADST is determined by strict alignment across the following critical parameters:

• Memory Capacity & Organization: 1Tbit capacity with 128G x 8 organization
• Memory Technology: FLASH - NAND (TLC) architecture
• Interface Standard: UFS3.1 protocol support
• Physical Package: 153-BGA (11.5x13) form factor and 153-TFBGA case designation
• Operating Temperature Range: -40°C to 85°C
• Mounting Configuration: Surface Mount technology
• Compliance Standards: ROHS3 compliance and MSL 3 rating

The SM671PED-AFST meets all substitution criteria within this parameter set, maintaining identical electrical and mechanical specifications while differing in product status classification.

Parameter Comparison

Engineering Selection Recommendations

The SM671PED-AFST serves as a direct functional equivalent to the SM671PED-ADST. Both components share identical electrical specifications, memory capacity, interface protocol, and physical packaging. The primary distinction is product lifecycle status: the SM671PED-ADST is classified as obsolete, while the SM671PED-AFST maintains active status with current manufacturer support.

For new designs or system refreshes, the SM671PED-AFST is the appropriate selection due to its active product status and ongoing availability. Both parts maintain ROHS3 compliance and identical MSL ratings, ensuring equivalent handling and storage requirements. The substitute part is suitable for direct replacement in existing applications where the SM671PED-ADST is no longer procurable.

Frequently Asked Questions (FAQ)

Q: Can SM671PED-AFST directly replace SM671PED-ADST in existing designs?

A: Yes. Both parts are identical across all electrical and mechanical parameters, including memory capacity (1Tbit), interface standard (UFS3.1), package type (153-BGA 11.5x13), and operating temperature range (-40°C to 85°C). Direct substitution is supported without design modification.

Q: What is the significance of the product status difference?

A: The SM671PED-ADST is classified as obsolete, indicating discontinued manufacturing and limited availability. The SM671PED-AFST maintains active status, ensuring current production, manufacturer support, and reliable procurement channels.

Q: Are there any differences in compliance or handling requirements?

A: No. Both parts carry identical ROHS3 compliance certification and Moisture Sensitivity Level 3 (168 Hours) rating. Storage, handling, and environmental requirements are equivalent.

Q: What parameters define substitution eligibility for this component category?

A: Substitution requires matching across memory capacity (1Tbit), memory organization (128G x 8), technology (FLASH - NAND TLC), interface protocol (UFS3.1), physical package (153-BGA 11.5x13), operating temperature range (-40°C to 85°C), and compliance standards (ROHS3, MSL 3).

Q: Is the 153-BGA package footprint identical between both parts?

A: Yes. Both components use the 153-TFBGA case designation with supplier device package specification of 153-BGA (11.5x13), ensuring identical PCB layout and assembly compatibility.