SM667GX4-AC Equivalent & Substitute Parts

Part Overview

The SM667GX4-AC is a Ferri-eMMC BGA 100-B embedded memory IC manufactured by Silicon Motion, Inc. This component is classified as a Memory IC with FLASH - NAND (SLC) technology. The part is currently listed as Obsolete, making identification of compatible substitute components essential for ongoing system support and new design implementations. Obsolete status necessitates sourcing equivalent alternatives that maintain functional and mechanical compatibility with existing applications.

Substiute Parts

SM667GX4-AC
Silicon Motion, Inc.In Stock: 881SM667GX4-AC Datasheet
SM667GX4-AC
Current Part
SM662GXB BESS
Silicon Motion, Inc.In Stock: 1252SM662GXB BESS Datasheet
SM662GXB BESS
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number SM667GX4-AC
Manufacturer Silicon Motion, Inc.
Category Memory
Description FERRI-EMMC BGA 100-B EMMC 4.5 SL
Product Status Obsolete
Package Type 100-BGA
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS Code 8524.61.0000

Substitute Part Grouping Explanation

Substitution of the SM667GX4-AC is determined by the following critical parameters:

  • Manufacturer: Silicon Motion, Inc. (same manufacturer ensures design continuity)
  • Memory Category: FLASH - NAND (SLC) technology
  • Package Type: 100-BGA form factor
  • Interface Standard: eMMC protocol compatibility
  • Compliance Certifications: RoHS3 and REACH status alignment
  • Moisture Sensitivity Level: MSL 3 classification for handling and storage requirements

The SM662GXB BESS qualifies as a manufacturer-recommended substitute based on matching these core parameters within the Ferri-eMMC product series.

Parameter Comparison

Parameter SM667GX4-AC (Main Part) SM662GXB BESS (Substitute)
Manufacturer Silicon Motion, Inc. Silicon Motion, Inc.
Category Memory Memory
Memory Type Non-Volatile Non-Volatile
Memory Format FLASH FLASH
Technology FLASH - NAND (SLC) FLASH - NAND (SLC)
Memory Interface eMMC eMMC
Package / Case 100-BGA 100-LBGA
Supplier Device Package 100-BGA 100-BGA (14x18)
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991B1A 3A991B1A
Series - Ferri-eMMC®

Engineering Selection Recommendations

The SM662GXB BESS is the manufacturer-recommended substitute for the obsolete SM667GX4-AC. Selection of this alternative is supported by:

  • Active Product Status: The SM662GXB BESS maintains Active status, ensuring continued availability and manufacturing support from Silicon Motion, Inc.
  • Regulatory Compliance Alignment: Both parts maintain identical RoHS3 and REACH certifications, satisfying regulatory requirements for new designs and legacy system support.
  • Identical MSL Classification: Matching MSL 3 (168 Hours) specification ensures equivalent handling, storage, and assembly process compatibility.
  • Consistent Export Classification: Both parts share the same ECCN code (3A991B1A), maintaining export compliance requirements.
  • Series Continuity: The SM662GXB BESS belongs to the Ferri-eMMC® product series, confirming design lineage and functional compatibility within the Silicon Motion memory IC portfolio.

Frequently Asked Questions (FAQ)

Q: Why is the SM667GX4-AC listed as Obsolete? A: The SM667GX4-AC has reached end-of-life status within Silicon Motion's product portfolio. The SM662GXB BESS represents the active continuation within the Ferri-eMMC series.

Q: Are the 100-BGA and 100-LBGA packages mechanically compatible? A: Both packages conform to the 100-BGA (14x18) form factor specification. The LBGA designation indicates a low-profile variant within the same 100-ball BGA footprint, maintaining mechanical and electrical compatibility.

Q: Does the substitute part maintain the same eMMC interface protocol? A: Yes. Both the SM667GX4-AC and SM662GXB BESS implement the eMMC interface standard, ensuring protocol-level compatibility with host systems designed for eMMC memory devices.

Q: Are there differences in memory capacity between these parts? A: The SM662GXB BESS specifies 80Gbit memory capacity with 10G x 8 organization. The SM667GX4-AC specifications do not include explicit memory capacity data in the provided parameters.

Q: What are the handling requirements for both parts? A: Both parts are classified as MSL 3 (168 Hours), requiring storage at controlled humidity levels and adherence to standard surface-mount assembly processes for BGA components.

Q: Can the SM662GXB BESS be used in legacy designs originally specified for the SM667GX4-AC? A: Yes. The substitute part maintains functional and mechanical compatibility through matching package specifications, interface protocols, compliance certifications, and manufacturer lineage within the Ferri-eMMC product series.

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