Request Quote
(Ships tomorrow)
SM667GX4-AC Equivalent & Substitute Parts
Part Overview
The SM667GX4-AC is a Ferri-eMMC BGA 100-B embedded memory IC manufactured by Silicon Motion, Inc. This component is classified as a Memory IC with FLASH - NAND (SLC) technology. The part is currently listed as Obsolete, making identification of compatible substitute components essential for ongoing system support and new design implementations. Obsolete status necessitates sourcing equivalent alternatives that maintain functional and mechanical compatibility with existing applications.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | SM667GX4-AC |
| Manufacturer | Silicon Motion, Inc. |
| Category | Memory |
| Description | FERRI-EMMC BGA 100-B EMMC 4.5 SL |
| Product Status | Obsolete |
| Package Type | 100-BGA |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991B1A |
| HTSUS Code | 8524.61.0000 |
Substitute Part Grouping Explanation
Substitution of the SM667GX4-AC is determined by the following critical parameters:
- Manufacturer: Silicon Motion, Inc. (same manufacturer ensures design continuity)
- Memory Category: FLASH - NAND (SLC) technology
- Package Type: 100-BGA form factor
- Interface Standard: eMMC protocol compatibility
- Compliance Certifications: RoHS3 and REACH status alignment
- Moisture Sensitivity Level: MSL 3 classification for handling and storage requirements
The SM662GXB BESS qualifies as a manufacturer-recommended substitute based on matching these core parameters within the Ferri-eMMC product series.
Parameter Comparison
| Parameter | SM667GX4-AC (Main Part) | SM662GXB BESS (Substitute) |
|---|---|---|
| Manufacturer | Silicon Motion, Inc. | Silicon Motion, Inc. |
| Category | Memory | Memory |
| Memory Type | Non-Volatile | Non-Volatile |
| Memory Format | FLASH | FLASH |
| Technology | FLASH - NAND (SLC) | FLASH - NAND (SLC) |
| Memory Interface | eMMC | eMMC |
| Package / Case | 100-BGA | 100-LBGA |
| Supplier Device Package | 100-BGA | 100-BGA (14x18) |
| Product Status | Obsolete | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| REACH Status | REACH Unaffected | REACH Unaffected |
| ECCN | 3A991B1A | 3A991B1A |
| Series | - | Ferri-eMMC® |
Engineering Selection Recommendations
The SM662GXB BESS is the manufacturer-recommended substitute for the obsolete SM667GX4-AC. Selection of this alternative is supported by:
- Active Product Status: The SM662GXB BESS maintains Active status, ensuring continued availability and manufacturing support from Silicon Motion, Inc.
- Regulatory Compliance Alignment: Both parts maintain identical RoHS3 and REACH certifications, satisfying regulatory requirements for new designs and legacy system support.
- Identical MSL Classification: Matching MSL 3 (168 Hours) specification ensures equivalent handling, storage, and assembly process compatibility.
- Consistent Export Classification: Both parts share the same ECCN code (3A991B1A), maintaining export compliance requirements.
- Series Continuity: The SM662GXB BESS belongs to the Ferri-eMMC® product series, confirming design lineage and functional compatibility within the Silicon Motion memory IC portfolio.
Frequently Asked Questions (FAQ)
Q: Why is the SM667GX4-AC listed as Obsolete? A: The SM667GX4-AC has reached end-of-life status within Silicon Motion's product portfolio. The SM662GXB BESS represents the active continuation within the Ferri-eMMC series.
Q: Are the 100-BGA and 100-LBGA packages mechanically compatible? A: Both packages conform to the 100-BGA (14x18) form factor specification. The LBGA designation indicates a low-profile variant within the same 100-ball BGA footprint, maintaining mechanical and electrical compatibility.
Q: Does the substitute part maintain the same eMMC interface protocol? A: Yes. Both the SM667GX4-AC and SM662GXB BESS implement the eMMC interface standard, ensuring protocol-level compatibility with host systems designed for eMMC memory devices.
Q: Are there differences in memory capacity between these parts? A: The SM662GXB BESS specifies 80Gbit memory capacity with 10G x 8 organization. The SM667GX4-AC specifications do not include explicit memory capacity data in the provided parameters.
Q: What are the handling requirements for both parts? A: Both parts are classified as MSL 3 (168 Hours), requiring storage at controlled humidity levels and adherence to standard surface-mount assembly processes for BGA components.
Q: Can the SM662GXB BESS be used in legacy designs originally specified for the SM667GX4-AC? A: Yes. The substitute part maintains functional and mechanical compatibility through matching package specifications, interface protocols, compliance certifications, and manufacturer lineage within the Ferri-eMMC product series.
Alternative Parts
SJ6012L2TP
Littelfuse Inc.
6 Alternative Parts
JMK107BBJ476MA-RE
Taiyo Yuden
10 Alternative Parts
GMK107BBJ475MA-T
Taiyo Yuden
5 Alternative Parts
SJ6020N2ARP
Littelfuse Inc.
3 Alternative Parts
SJ6025R2ATP
Littelfuse Inc.
4 Alternative Parts
2474-05L
API Delevan Inc.
1 Alternative Parts
4590R-684K
API Delevan Inc.
1 Alternative Parts
CM6560R-334
API Delevan Inc.
1 Alternative Parts
CM6460-104
API Delevan Inc.
1 Alternative Parts
5526-12
API Delevan Inc.
1 Alternative Parts
