Renesas Electronics R5F564MLDDLJ#21 Equivalent & Substitute Parts

Part Overview

The R5F564MLDDLJ#21 is a 32-bit single-core RXv2 microcontroller from Renesas Electronics Corporation's RX600 series, operating at 120MHz with 4MB FLASH memory. This embedded microcontroller is designed for applications requiring robust connectivity options including CANbus, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, and USB interfaces. The device is currently in active production status with full RoHS3 compliance and REACH unaffected designation. Substitute parts are identified to provide design flexibility when primary inventory is constrained or when equivalent functionality is required for production continuity.

Key Parameters

Parameter	Value
Manufacturer Part Number	R5F564MLDDLJ#21
Manufacturer	Renesas Electronics Corporation
Series	RX600
Core Processor	RXv2
Core Size	32-Bit Single-Core
Speed	120MHz
Program Memory Size	4MB (4M x 8)
Program Memory Type	FLASH
EEPROM Size	64K x 8
RAM Size	552K x 8
Voltage Supply (Vcc/Vdd)	2.7V ~ 3.6V
Number of I/O	78
Package / Case	100-TFLGA (7x7)
Operating Temperature	-40°C ~ 85°C (TA)
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Product Status	Active

Substitute Part Grouping Explanation

Substitute parts for the R5F564MLDDLJ#21 are identified based on parametric equivalence within the RX600 microcontroller family. The substitution criteria are strictly limited to the following electrical and mechanical parameters:

Core processor architecture (RXv2)
Processing speed (120MHz)
Program memory capacity (4MB FLASH)
EEPROM size (64K x 8)
RAM capacity (552K x 8)
Supply voltage range (2.7V ~ 3.6V)
I/O pin count (78)
Package type (100-TFLGA 7x7)
Operating temperature range (-40°C ~ 85°C)
Connectivity interfaces (CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB)
Peripheral features (DMA, LVD, POR, PWM, WDT)
Data converter specifications (A/D 22x12b, D/A 1x12b)
Compliance certifications (RoHS3, REACH Unaffected)

Parts meeting all these parameters are classified as parametric equivalents and are suitable for direct substitution in applications where the R5F564MLDDLJ#21 is specified.

Parameter Comparison

Parameter	R5F564MLDDLJ#21	R5F564MLCDLJ#21	R5F564MLHDLJ#21
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Series	RX600	RX600	RX600
Core Processor	RXv2	RXv2	RXv2
Core Size	32-Bit Single-Core	32-Bit Single-Core	32-Bit Single-Core
Speed	120MHz	120MHz	120MHz
Program Memory Size	4MB (4M x 8)	4MB (4M x 8)	4MB (4M x 8)
Program Memory Type	FLASH	FLASH	FLASH
EEPROM Size	64K x 8	64K x 8	64K x 8
RAM Size	552K x 8	552K x 8	552K x 8
Voltage Supply (Vcc/Vdd)	2.7V ~ 3.6V	2.7V ~ 3.6V	2.7V ~ 3.6V
Number of I/O	78	78	78
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB	CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB	CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Data Converters	A/D 22x12b; D/A 1x12b	A/D 22x12b; D/A 1x12b	A/D 22x12b; D/A 1x12b
Oscillator Type	Internal	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Surface Mount	Surface Mount
Package / Case	100-TFLGA (7x7)	100-TFLGA (7x7)	100-TFLGA (7x7)
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)	3 (168 Hours)
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected
Product Status	Active	Active	Active

Engineering Selection Recommendations

All three parts—R5F564MLDDLJ#21, R5F564MLCDLJ#21, and R5F564MLHDLJ#21—are active production devices from Renesas Electronics Corporation with identical electrical specifications and mechanical packaging. Each part maintains full RoHS3 compliance and REACH unaffected status, meeting current regulatory requirements for embedded microcontroller applications.

Selection between these parts should be based on availability and supply chain considerations. All three devices are suitable for direct substitution in designs requiring RX600 series microcontrollers with 120MHz operation, 4MB FLASH memory, and the specified connectivity and peripheral feature set. No functional or performance differences exist between these parts based on the provided parametric data.

Frequently Asked Questions (FAQ)

Q: Can R5F564MLCDLJ#21 and R5F564MLHDLJ#21 be used interchangeably with R5F564MLDDLJ#21?

A: Yes. All three parts are parametric equivalents with identical core processor architecture, clock speed, memory configuration, I/O count, package type, and operating specifications. They are suitable for direct substitution in applications where the R5F564MLDDLJ#21 is specified.

Q: Are there any differences in the 100-TFLGA package between these parts?

A: No. All three parts use the identical 100-TFLGA (7x7) package with the same pin configuration, pitch, and mechanical dimensions. PCB layout and footprint design remain unchanged across all three part numbers.

Q: Do these parts have the same connectivity interfaces?

A: Yes. All three parts include identical connectivity options: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, and USB interfaces. Peripheral features including DMA, LVD, POR, PWM, and WDT are also identical.

Q: What is the significance of the different part number suffixes (D, C, H)?

A: The provided data does not specify the technical significance of these suffixes. Selection should be based on availability and supply chain requirements, as all parametric specifications are equivalent.

Q: Are all three parts RoHS3 compliant?

A: Yes. R5F564MLDDLJ#21, R5F564MLCDLJ#21, and R5F564MLHDLJ#21 are all RoHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards.

Q: What is the Moisture Sensitivity Level (MSL) for these parts?

A: All three parts have MSL 3 rating with a 168-hour floor life. Standard moisture control procedures during storage and handling are required to maintain device reliability.

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