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R5F100MLDFB#10 Equivalent & Substitute Parts
Part Overview
The R5F100MLDFB#10 is a 16-bit embedded microcontroller from Renesas Electronics Corporation, part of the RL78/G13 series. This device integrates 512KB of FLASH program memory, 32KB of RAM, and 8KB of EEPROM, operating at 32MHz with a supply voltage range of 1.6V to 5.5V. The microcontroller features integrated connectivity options including CSI, I2C, LINbus, and UART/USART, along with peripheral functions such as DMA, LVD, POR, PWM, and WDT. The device is housed in an 80-LFQFP (12x12mm) surface mount package and maintains Active product status with full RoHS3 compliance.
Equivalent and substitute parts are necessary to address supply chain variations, packaging preferences, and inventory availability while maintaining identical electrical and functional performance within the RL78/G13 microcontroller family.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Renesas Electronics Corporation |
| Series | RL78/G13 |
| Core Processor | RL78 |
| Core Size | 16-Bit |
| Operating Speed | 32MHz |
| Program Memory Size | 512KB (512K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 8K x 8 |
| RAM Size | 32K x 8 |
| Supply Voltage Range | 1.6V ~ 5.5V |
| Number of I/O | 64 |
| Data Converters | A/D 17x8/10b |
| Connectivity | CSI, I2C, LINbus, UART/USART |
| Peripherals | DMA, LVD, POR, PWM, WDT |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 80-LQFP |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) |
| Product Status | Active |
Substitute Part Grouping Explanation
Substitution within the R5F100MLDFB#10 family is determined by strict electrical and mechanical parameter equivalence. All substitute parts maintain identical core specifications: 16-bit RL78 processor architecture, 32MHz operating frequency, 512KB FLASH memory, 32KB RAM, 8KB EEPROM, 64 I/O pins, and identical connectivity and peripheral configurations.
The primary differentiation among substitute parts is the physical package form factor. The R5F100MLDFB#10 and R5F100MLAFB#30 utilize the 80-LFQFP (12x12mm) package, while R5F100MLAFA#30 and R5F100MLDFA#30 utilize the 80-LQFP (14x14mm) package. Both package types are classified as 80-LQFP in the Package/Case designation and are mechanically and electrically interchangeable within their respective footprint specifications.
All substitute parts share identical electrical characteristics, compliance certifications (RoHS3, REACH Unaffected), and moisture sensitivity ratings (MSL 3, 168 Hours). The suffix designations (#10 and #30) indicate different packaging tape configurations and do not affect functional equivalence.
Parameter Comparison
| Parameter | R5F100MLDFB#10 | R5F100MLAFA#30 | R5F100MLAFB#30 | R5F100MLDFA#30 | R5F100MLDFB#30 |
|---|---|---|---|---|---|
| Manufacturer | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Series | RL78/G13 | RL78/G13 | RL78/G13 | RL78/G13 | RL78/G13 |
| Core Processor | RL78 | RL78 | RL78 | RL78 | RL78 |
| Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
| Operating Speed | 32MHz | 32MHz | 32MHz | 32MHz | 32MHz |
| Program Memory Size | 512KB (512K x 8) | 512KB (512K x 8) | 512KB (512K x 8) | 512KB (512K x 8) | 512KB (512K x 8) |
| Program Memory Type | FLASH | FLASH | FLASH | FLASH | FLASH |
| EEPROM Size | 8K x 8 | 8K x 8 | 8K x 8 | 8K x 8 | 8K x 8 |
| RAM Size | 32K x 8 | 32K x 8 | 32K x 8 | 32K x 8 | 32K x 8 |
| Supply Voltage Range | 1.6V ~ 5.5V | 1.6V ~ 5.5V | 1.6V ~ 5.5V | 1.6V ~ 5.5V | 1.6V ~ 5.5V |
| Number of I/O | 64 | 64 | 64 | 64 | 64 |
| Data Converters | A/D 17x8/10b | A/D 17x8/10b | A/D 17x8/10b | A/D 17x8/10b | A/D 17x8/10b |
| Connectivity | CSI, I2C, LINbus, UART/USART | CSI, I2C, LINbus, UART/USART | CSI, I2C, LINbus, UART/USART | CSI, I2C, LINbus, UART/USART | CSI, I2C, LINbus, UART/USART |
| Peripherals | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Supplier Device Package | 80-LFQFP (12x12) | 80-LQFP (14x14) | 80-LFQFP (12x12) | 80-LQFP (14x14) | 80-LFQFP (12x12) |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) | 3 (168 Hours) | 3 (168 Hours) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Active | Active | Active | Active | Active |
Engineering Selection Recommendations
All substitute parts listed maintain full electrical and functional equivalence to the R5F100MLDFB#10. Selection among these alternatives is based on package form factor requirements and inventory availability.
For 80-LFQFP (12x12mm) package applications: R5F100MLDFB#10, R5F100MLAFB#30, and R5F100MLDFB#30 are directly interchangeable. The primary distinction is the packaging tape configuration (#10 versus #30 suffix). R5F100MLDFB#30 offers higher current inventory (1831 Pcs) compared to R5F100MLDFB#10 (944 Pcs).
For 80-LQFP (14x14mm) package applications: R5F100MLAFA#30 and R5F100MLDFA#30 provide equivalent functionality with a larger physical footprint. R5F100MLAFA#30 maintains the highest inventory level (1800 Pcs).
All parts maintain Active product status with identical RoHS3 compliance and REACH unaffected certifications, ensuring long-term availability and regulatory compliance. Selection should be based on printed circuit board layout constraints and supply chain requirements.
Frequently Asked Questions (FAQ)
Q: Are all listed substitute parts electrically identical to the R5F100MLDFB#10?
A: Yes. All substitute parts share identical electrical specifications including processor architecture, clock speed, memory configuration, I/O count, connectivity options, and peripheral functions. Electrical performance and firmware compatibility are equivalent across all listed parts.
Q: What is the difference between the 80-LFQFP (12x12mm) and 80-LQFP (14x14mm) packages?
A: The primary difference is physical footprint size. The 80-LFQFP (12x12mm) package is more compact, while the 80-LQFP (14x14mm) package has a larger form factor. Both packages contain 80 pins with identical pin assignments and electrical characteristics. Package selection depends on printed circuit board layout and available board space.
Q: Can I substitute R5F100MLDFB#10 with R5F100MLAFA#30 on an existing PCB?
A: Substitution requires PCB redesign. The R5F100MLAFA#30 uses the 80-LQFP (14x14mm) package, while R5F100MLDFB#10 uses the 80-LFQFP (12x12mm) package. The different footprints are not compatible with the same PCB layout. If your PCB is designed for the 12x12mm package, use R5F100MLAFB#30 or R5F100MLDFB#30 instead.
Q: What do the suffix designations (#10 and #30) indicate?
A: The suffix designations refer to packaging tape and reel configurations used for automated assembly. These designations do not affect the electrical performance or functional characteristics of the microcontroller. Parts with different suffixes are functionally equivalent.
Q: Are all substitute parts RoHS3 compliant?
A: Yes. All listed substitute parts maintain RoHS3 compliance and REACH unaffected status, identical to the R5F100MLDFB#10. Regulatory compliance is consistent across the entire substitute parts list.
Q: Which substitute part has the highest current inventory?
A: R5F100MLAFA#30 maintains the highest inventory level at 1800 Pcs. For the 80-LFQFP (12x12mm) package variant, R5F100MLDFB#30 offers 1831 Pcs in stock.
Q: Can firmware developed for R5F100MLDFB#10 run on substitute parts without modification?
A: Yes. All substitute parts use the identical RL78 processor core and memory architecture. Firmware compiled for the R5F100MLDFB#10 executes without modification on all listed substitute parts, provided the physical package footprint is accommodated in the PCB design.
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