PDZ36B-QF Equivalent & Substitute Parts

Part Overview

The PDZ36B-QF is a Zener diode manufactured by Nexperia USA Inc., classified as a surface mount semiconductor component in the diode category. This part is rated for 36 V nominal Zener voltage with 400 mW maximum power dissipation and is packaged in SOD-323 form factor. The component is currently in active product status and carries automotive-grade qualification under AEC-Q101 standards.

Equivalent and substitute parts are identified to address supply chain requirements, packaging format preferences, and inventory availability while maintaining identical electrical and mechanical specifications.

Substiute Parts

PDZ36B-QF
Nexperia USA Inc.In Stock: 783PDZ36B-QF Datasheet
PDZ36B-QF
Current Part
PDZ36B,115
Nexperia USA Inc.In Stock: 6268PDZ36B,115 Datasheet
PDZ36B,115
Parametric Equivalent

Key Parameters

Parameter Value Unit
Voltage - Zener (Nom) 36 V
Tolerance ±2 %
Power - Max 400 mW
Impedance (Max) 60 Ohms
Current - Reverse Leakage @ Vr 50 nA @ 27 V nA
Voltage - Forward (Vf) (Max) @ If 1.1 V @ 100 mA V
Operating Temperature 150 °C (TJ)
Package / Case SC-76, SOD-323
Mounting Type Surface Mount
Grade Automotive
Qualification AEC-Q101
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitute parts for the PDZ36B-QF are identified based on electrical parameter equivalence and mechanical compatibility. The primary substitution criterion is the maintenance of identical electrical specifications: 36 V nominal Zener voltage, ±2% tolerance, 400 mW maximum power rating, 60 Ohms maximum impedance, and identical forward and reverse leakage characteristics.

The substitute part PDZ36B,115 shares all critical electrical parameters with the main part number. Both components are manufactured by Nexperia USA Inc., carry AEC-Q101 automotive qualification, and are packaged in SOD-323 form factor. The distinction between these part numbers lies in packaging format: PDZ36B-QF is supplied in Tape & Reel (TR) format, while PDZ36B,115 is supplied in Cut Tape (CT) and Digi-Reel® format.

Substitution is valid when the application requirements permit alternative packaging formats and when inventory or supply chain considerations necessitate the use of the alternate part number.

Parameter Comparison

Parameter PDZ36B-QF PDZ36B,115 Match
Manufacturer Nexperia USA Inc. Nexperia USA Inc. Yes
Category Diodes, Zener Diodes, Zener Yes
Voltage - Zener (Nom) 36 V 36 V Yes
Tolerance ±2% ±2% Yes
Power - Max 400 mW 400 mW Yes
Impedance (Max) 60 Ohms 60 Ohms Yes
Current - Reverse Leakage @ Vr 50 nA @ 27 V 50 nA @ 27 V Yes
Voltage - Forward (Vf) (Max) @ If 1.1 V @ 100 mA 1.1 V @ 100 mA Yes
Operating Temperature 150°C (TJ) 150°C (TJ) Yes
Package / Case SC-76, SOD-323 SC-76, SOD-323 Yes
Mounting Type Surface Mount Surface Mount Yes
Supplier Device Package SOD-323 SOD-323 Yes
RoHS Status ROHS3 Compliant ROHS3 Compliant Yes
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited) Yes
REACH Status REACH Unaffected REACH Unaffected Yes
Product Status Active Active Yes
Packaging Format Tape & Reel (TR) Cut Tape (CT) & Digi-Reel® Different

Engineering Selection Recommendations

Both PDZ36B-QF and PDZ36B,115 are active products manufactured by Nexperia USA Inc. with identical electrical and mechanical specifications. Selection between these part numbers is determined by packaging format requirements and supply chain availability.

PDZ36B-QF in Tape & Reel format is suitable for high-volume automated assembly operations requiring continuous reel feeding. PDZ36B,115 in Cut Tape and Digi-Reel® format provides flexibility for lower-volume applications or mixed-component assembly scenarios.

Both parts carry AEC-Q101 automotive qualification and ROHS3 compliance, making them suitable for automotive and industrial applications with equivalent regulatory standing. The electrical performance, thermal characteristics, and reliability metrics are identical across both part numbers.

Frequently Asked Questions (FAQ)

Q: Can PDZ36B,115 be used as a direct replacement for PDZ36B-QF in production assembly?

A: Yes, PDZ36B,115 is electrically and mechanically equivalent to PDZ36B-QF. The substitute part maintains identical Zener voltage (36 V), power rating (400 mW), impedance (60 Ohms), and all other electrical parameters. The difference is packaging format: PDZ36B-QF uses Tape & Reel format while PDZ36B,115 uses Cut Tape and Digi-Reel® format. Assembly equipment compatibility with the packaging format must be confirmed.

Q: Are there any compliance or certification differences between these part numbers?

A: No. Both PDZ36B-QF and PDZ36B,115 carry identical certifications: AEC-Q101 automotive qualification, ROHS3 compliance, and REACH Unaffected status. Regulatory and compliance standing is equivalent.

Q: What is the difference between Tape & Reel and Cut Tape packaging?

A: Tape & Reel (TR) format supplies components on a continuous reel suitable for automated pick-and-place assembly systems. Cut Tape (CT) and Digi-Reel® format provides components in tape segments or alternative reel configurations, offering flexibility for lower-volume or mixed-assembly operations. The component itself is identical; only the delivery format differs.

Q: Are the electrical characteristics identical between PDZ36B-QF and PDZ36B,115?

A: Yes. Both parts have identical Zener voltage (36 V ±2%), maximum power dissipation (400 mW), impedance (60 Ohms maximum), reverse leakage current (50 nA @ 27 V), forward voltage (1.1 V @ 100 mA), and operating temperature rating (150°C junction temperature).

Q: Can these parts be used interchangeably in automotive applications?

A: Yes. Both parts are automotive-grade components with AEC-Q101 qualification. They are functionally and electrically interchangeable in automotive circuit designs. Packaging format selection should be based on assembly process requirements.

Q: What is the SOD-323 package specification?

A: SOD-323 is a surface mount semiconductor package designation (also referenced as SC-76). Both PDZ36B-QF and PDZ36B,115 use this identical package form factor, ensuring mechanical compatibility in PCB layouts and assembly processes.

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