PCA9555BSHP Equivalent & Substitute Parts

Part Overview

The PCA9555BSHP is a 16-bit I/O expander designed for I2C and SMBus communication at 400 kHz, manufactured by NXP USA Inc. This interface component operates across a supply voltage range of 2.3V to 5.5V and is housed in a 24-HVQFN surface mount package. The device is currently in active product status with 730 units available in stock. Substitute parts are identified when equivalent electrical and mechanical specifications align with the original component's functional requirements, enabling seamless integration in applications requiring 16-bit I/O expansion with I2C/SMBus protocol support.

Substiute Parts

PCA9555BSHP

NXP USA Inc.In Stock: 750PCA9555BSHP Datasheet

Current PartRFQ

TCA9535MRGER

Texas InstrumentsIn Stock: 60447TCA9535MRGER Datasheet

MFR RecommendedRFQ

TCA9535MRGER

Texas InstrumentsIn Stock: 60447TCA9535MRGER Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the PCA9555BSHP are identified based on strict equivalence across the following critical parameters:

Number of I/O: 16-bit configuration required for functional compatibility Interface Protocol: I2C and SMBus support at 400 kHz mandatory Output Type: Push-Pull output configuration Interrupt Output: Presence of interrupt output capability Features: Power-On Reset (POR) functionality Package Type: 24-VFQFN Exposed Pad surface mount configuration Operating Temperature Range: -40°C to 85°C minimum requirement Current Output Specifications: 10mA and 25mA source/sink capability

The TCA9535MRGER manufactured by Texas Instruments meets all substitution criteria. While the TCA9535MRGER supports a lower minimum supply voltage of 1.65V compared to the PCA9555BSHP's 2.3V minimum, this represents an expanded operational envelope that maintains full compatibility in applications designed for the original part's 2.3V to 5.5V range.

Parameter Comparison

Engineering Selection Recommendations

Both the PCA9555BSHP and TCA9535MRGER maintain active product status with full ROHS3 compliance and REACH unaffected classification. Selection between these components should be based on supply chain availability and moisture handling requirements. The PCA9555BSHP offers unlimited moisture sensitivity level (MSL 1), while the TCA9535MRGER specifies a one-year moisture sensitivity window (MSL 2). The TCA9535MRGER provides extended supply voltage support at the lower end (1.65V minimum versus 2.3V), which may offer operational flexibility in low-voltage applications while maintaining full compatibility with standard 2.3V to 5.5V designs. Both components are suitable for direct substitution in I2C and SMBus-based I/O expansion applications requiring 16-bit interface capability.

Frequently Asked Questions (FAQ)

Q: Can the TCA9535MRGER directly replace the PCA9555BSHP in existing designs?

A: Yes. Both components share identical I/O count (16-bit), interface protocol (I2C/SMBus 400 kHz), output configuration (Push-Pull), interrupt capability, and package type (24-VFQFN Exposed Pad). The TCA9535MRGER's expanded lower voltage limit (1.65V) does not affect compatibility in applications designed for the PCA9555BSHP's 2.3V to 5.5V range.

Q: What is the significance of the different Moisture Sensitivity Levels?

A: The PCA9555BSHP carries MSL 1 (Unlimited), indicating no time-based moisture absorption restrictions. The TCA9535MRGER carries MSL 2 (1 Year), requiring component use within one year of packaging opening under controlled humidity conditions. Storage and handling procedures must align with the selected component's MSL classification.

Q: Are there any differences in current output specifications?

A: No. Both the PCA9555BSHP and TCA9535MRGER provide identical source and sink current capabilities of 10mA and 25mA, ensuring equivalent drive capability for connected loads.

Q: Do both parts support the same operating temperature range?

A: Yes. Both components operate across -40°C to 85°C, meeting identical thermal specifications for industrial and commercial applications.

Q: What packaging considerations apply to both components?

A: Both components utilize 24-VFQFN surface mount packages with exposed pads. PCB layout, thermal management, and soldering procedures remain consistent between the two parts.