MTFC8GAKAJCN-4M IT Equivalent & Substitute Parts

Part Overview

The MTFC8GAKAJCN-4M IT is a 64Gbit NAND Flash memory IC manufactured by Micron Technology Inc., designed for embedded multimedia card (MMC) applications. This component features a 153-VFBGA package with 8G x 8 memory organization and operates across a supply voltage range of 2.7V to 3.6V. The product is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new design implementations.

Substiute Parts

MTFC8GAKAJCN-4M IT

Micron Technology Inc.In Stock: 20241MTFC8GAKAJCN-4M IT Datasheet

Current PartRFQ

ASFC8G31M-51BIN

Alliance Memory, Inc.In Stock: 1003ASFC8G31M-51BIN Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the MTFC8GAKAJCN-4M IT is determined by strict alignment across the following critical parameters:

• Memory Capacity: 64Gbit (non-negotiable)
• Memory Organization: 8G x 8 configuration
• Interface Standard: MMC protocol compliance
• Package Specification: 153-VFBGA footprint (11.5x13mm)
• Voltage Compatibility: 2.7V ~ 3.6V supply range
• Temperature Range: -40°C ~ 85°C operational envelope
• Technology: FLASH - NAND architecture
• Compliance: ROHS3 and REACH requirements

The ASFC8G31M-51BIN from Alliance Memory, Inc. meets all substitution criteria, maintaining identical memory capacity, organization, interface protocol, package footprint, voltage specifications, and temperature range. Both components are ROHS3 compliant and REACH unaffected.

Parameter Comparison

Engineering Selection Recommendations

The ASFC8G31M-51BIN qualifies as a direct functional equivalent to the MTFC8GAKAJCN-4M IT based on matching electrical specifications, package dimensions, and compliance certifications. The substitute part maintains active product status, ensuring continued availability and supply chain reliability. Both components satisfy ROHS3 compliance and REACH requirements, supporting regulatory obligations in target applications. The identical MSL rating of 3 (168 Hours) ensures equivalent moisture handling protocols during storage and assembly operations.

Frequently Asked Questions (FAQ)

Q: Can the ASFC8G31M-51BIN directly replace the MTFC8GAKAJCN-4M IT in existing designs?

A: Yes. Both components share identical memory capacity (64Gbit), organization (8G x 8), MMC interface protocol, package footprint (153-VFBGA, 11.5x13mm), voltage range (2.7V ~ 3.6V), and operating temperature specifications (-40°C ~ 85°C). No circuit modifications are required.

Q: What is the significance of the package designation difference (VFBGA vs. FBGA)?

A: Both designations reference the same 153-ball fine-pitch ball grid array package with identical 11.5x13mm dimensions. The nomenclature variation reflects manufacturer-specific labeling conventions and does not affect physical or electrical compatibility.

Q: Are there compliance differences between the main part and substitute?

A: No. Both components are ROHS3 compliant and REACH unaffected. Moisture sensitivity levels are identical at MSL 3 (168 Hours), ensuring equivalent handling requirements during manufacturing and assembly.

Q: Why is the main part classified as obsolete?

A: Obsolete status indicates the MTFC8GAKAJCN-4M IT is no longer manufactured by Micron Technology Inc. The ASFC8G31M-51BIN maintains active production status, providing a viable alternative for new designs and legacy system support.

Q: Are there performance differences between these components?

A: The ASFC8G31M-51BIN specifies a clock frequency of 200 MHz. The MTFC8GAKAJCN-4M IT does not provide clock frequency specification in available documentation. Both components operate within identical voltage and temperature parameters, ensuring functional compatibility in MMC-based applications.