MPC8343VRAGD Equivalent & Substitute Parts

Part Overview

The MPC8343VRAGD is a PowerPC e300 microprocessor IC from the MPC83xx series, featuring a single 32-bit core operating at 400MHz in a 620-HBGA (29x29) package. This embedded processor integrates DDR/DDR2 RAM controllers, triple 10/100/1000Mbps Ethernet ports, dual USB 2.0 interfaces with PHY, and additional connectivity through DUART, I2C, PCI, and SPI interfaces. The device operates across 1.8V, 2.5V, and 3.3V I/O voltage levels with an operating temperature range of 0°C to 105°C.

The MPC8343VRAGD is classified as obsolete. Equivalent substitute parts are necessary for new designs, production continuations, and system upgrades where active product availability and extended lifecycle support are required.

Substiute Parts

MPC8343VRAGD

NXP USA Inc.In Stock: 1260MPC8343VRAGD Datasheet

Current PartRFQ

MPC8343VRAGDB

NXP SemiconductorsIn Stock: 1373MPC8343VRAGDB Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the MPC8343VRAGD is determined by strict equivalence across the following critical parameters:

Core Architecture & Performance: PowerPC e300 single-core 32-bit processor at 400MHz Memory Interface: DDR and DDR2 RAM controller support Connectivity: Triple Gigabit Ethernet (10/100/1000Mbps), dual USB 2.0 with PHY, DUART, I2C, PCI, and SPI Electrical Specifications: I/O voltage support across 1.8V, 2.5V, and 3.3V; operating temperature 0°C to 105°C Physical Form Factor: 620-HBGA (29x29) ball grid array package with exposed pad Compliance: ROHS3 compliance and REACH unaffected status

The MPC8343VRAGDB maintains identical functional specifications, core architecture, performance characteristics, and package form factor as the original part, qualifying it as a direct equivalent substitute.

Parameter Comparison

Engineering Selection Recommendations

The MPC8343VRAGDB is the direct equivalent substitute for the MPC8343VRAGD. Both parts maintain identical electrical, functional, and mechanical specifications across all critical parameters. The primary distinction is product lifecycle status: the MPC8343VRAGD is obsolete, while the MPC8343VRAGDB is active.

For new designs and production continuations, the MPC8343VRAGDB is the appropriate selection. Both parts carry ROHS3 compliance and REACH unaffected status, meeting current environmental and regulatory requirements. The 620-HBGA (29x29) package form factor is consistent between both parts, ensuring PCB layout and assembly compatibility without design modification.

Frequently Asked Questions (FAQ)

Q: Can the MPC8343VRAGDB directly replace the MPC8343VRAGD in existing designs? A: Yes. The MPC8343VRAGDB is functionally and mechanically equivalent to the MPC8343VRAGD. No design changes are required for PCB layout, assembly, or firmware integration.

Q: What is the primary reason for substitution? A: The MPC8343VRAGD is classified as obsolete. The MPC8343VRAGDB is the active equivalent part from NXP Semiconductors, ensuring continued availability and lifecycle support.

Q: Are the package dimensions identical? A: Yes. Both parts use the 620-HBGA (29x29) ball grid array package with exposed pad. PCB footprints and assembly processes are identical.

Q: Do both parts support the same voltage and temperature specifications? A: Yes. Both parts operate across 1.8V, 2.5V, and 3.3V I/O voltage levels and maintain the same 0°C to 105°C operating temperature range.

Q: Are there differences in compliance certifications? A: Both parts are ROHS3 compliant and REACH unaffected. Compliance status is equivalent between the two parts.

Q: What connectivity interfaces are supported? A: Both parts provide triple 10/100/1000Mbps Ethernet ports, dual USB 2.0 interfaces with PHY, DUART, I2C, PCI, and SPI connectivity.