MIC4605-1YMT-T5 Equivalent & Substitute Parts

Part Overview

The MIC4605-1YMT-T5 is a half-bridge gate driver IC manufactured by Microchip Technology, designed for driving N-channel MOSFETs in half-bridge configurations. This device operates with a supply voltage range of 5.5V to 16V and delivers 1A peak output current for both source and sink operations. The part is classified as obsolete, making identification of suitable substitute components essential for ongoing design support and production continuity.

Substiute Parts

MIC4605-1YMT-T5
Microchip TechnologyIn Stock: 1156MIC4605-1YMT-T5 Datasheet
MIC4605-1YMT-T5
Current Part
LM5109ASD/NOPB
Texas InstrumentsIn Stock: 16185LM5109ASD/NOPB Datasheet
LM5109ASD/NOPB
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number MIC4605-1YMT-T5
Manufacturer Microchip Technology
Category Power Management (PMIC)
Description IC GATE DRVR HALF-BRIDGE 10TDFN
Driven Configuration Half-Bridge
Number of Drivers 2
Gate Type N-Channel MOSFET
Voltage - Supply 5.5V ~ 16V
Current - Peak Output (Source, Sink) 1A, 1A
Input Type TTL, Non-Inverting
High Side Voltage - Max (Bootstrap) 108 V
Rise / Fall Time (Typ) 20ns, 20ns
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 10-UFDFN Exposed Pad
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the MIC4605-1YMT-T5 is determined by the following critical parameters:

  • Driven Configuration: Half-bridge topology with independent channel control
  • Number of Drivers: Dual-channel gate driver requirement
  • Gate Type: N-channel MOSFET drive capability
  • Supply Voltage Range: Minimum 5.5V operation required; substitute must support the application supply voltage
  • Peak Output Current: 1A source and sink capability
  • Input Logic Type: TTL/CMOS compatible non-inverting inputs
  • Bootstrap Voltage Rating: 108V maximum high-side voltage support
  • Operating Temperature Range: -40°C to 125°C junction temperature
  • Package Compatibility: Surface mount technology with exposed pad thermal management

The LM5109ASD/NOPB from Texas Instruments qualifies as a functional substitute based on matching half-bridge configuration, dual independent channels, N-channel MOSFET drive capability, compatible logic inputs, and identical bootstrap voltage rating. Supply voltage range differences and package form factor changes require design verification within the specific application context.

Parameter Comparison

Parameter MIC4605-1YMT-T5 LM5109ASD/NOPB
Manufacturer Microchip Technology Texas Instruments
Driven Configuration Half-Bridge Half-Bridge
Channel Type Independent Independent
Number of Drivers 2 2
Gate Type N-Channel MOSFET N-Channel MOSFET
Voltage - Supply 5.5V ~ 16V 8V ~ 14V
Logic Voltage - VIL, VIH 0.8V, 2.2V 0.8V, 2.2V
Current - Peak Output (Source, Sink) 1A, 1A 1A, 1A
Input Type TTL, Non-Inverting Non-Inverting
High Side Voltage - Max (Bootstrap) 108 V 108 V
Rise / Fall Time (Typ) 20ns, 20ns 15ns, 15ns
Operating Temperature -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ)
Package / Case 10-UFDFN Exposed Pad 8-WDFN Exposed Pad
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

The LM5109ASD/NOPB is an active product from Texas Instruments with ROHS3 compliance and unlimited moisture sensitivity rating, providing long-term supply chain stability compared to the obsolete MIC4605-1YMT-T5. Both devices maintain identical logic threshold levels, peak output current specifications, and bootstrap voltage ratings.

Key considerations for selection:

  • Supply Voltage: The LM5109ASD/NOPB operates within 8V to 14V, which is a subset of the MIC4605-1YMT-T5 range (5.5V to 16V). Applications requiring operation below 8V or above 14V cannot use the LM5109ASD/NOPB as a direct substitute.
  • Switching Speed: The LM5109ASD/NOPB exhibits faster rise and fall times (15ns versus 20ns), which may require PCB layout and timing verification in existing designs.
  • Package Form Factor: The transition from 10-UFDFN to 8-WSON requires PCB redesign and thermal management re-evaluation.
  • Compliance Status: Both parts maintain ROHS3 compliance and unlimited MSL ratings, supporting equivalent environmental and reliability requirements.

Frequently Asked Questions (FAQ)

Q: Can the LM5109ASD/NOPB replace the MIC4605-1YMT-T5 in all applications?

A: Substitution is valid only when the application supply voltage operates within the 8V to 14V range. Applications requiring 5.5V minimum supply voltage or 16V maximum supply voltage cannot use the LM5109ASD/NOPB without additional power conditioning or voltage regulation.

Q: What are the implications of the faster switching times in the LM5109ASD/NOPB?

A: The LM5109ASD/NOPB provides 15ns rise and fall times compared to 20ns in the MIC4605-1YMT-T5. Faster switching may reduce gate charge delay but requires verification of PCB trace impedance, signal integrity, and EMI performance in the target application.

Q: Are there package compatibility concerns?

A: Yes. The MIC4605-1YMT-T5 uses a 10-pin UFDFN package while the LM5109ASD/NOPB uses an 8-pin WSON package. PCB layout, thermal via placement, and component footprint must be redesigned. Pin-to-pin functional mapping must be verified against both datasheets.

Q: Do both parts support identical logic input levels?

A: Yes. Both devices specify logic threshold levels of VIL = 0.8V and VIH = 2.2V, ensuring compatible TTL/CMOS input signal compatibility.

Q: What is the significance of the product status difference?

A: The MIC4605-1YMT-T5 is obsolete, indicating no further manufacturing or support from Microchip Technology. The LM5109ASD/NOPB is active, providing ongoing availability, technical support, and supply chain continuity for new designs and production requirements.

Q: Are thermal management considerations different between these parts?

A: Both devices feature exposed pad packages for thermal dissipation. The 8-WSON package of the LM5109ASD/NOPB has a smaller footprint than the 10-UFDFN, potentially affecting thermal performance. Thermal analysis specific to the application PCB layout is required.

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