LPC2124FBD64,151 Equivalent & Substitute Parts

Part Overview

The LPC2124FBD64,151 is an ARM7® LPC2100 series microcontroller IC featuring 16/32-bit architecture, 60MHz operation, and 256KB FLASH memory in a 64-LQFP package. This device is classified as Obsolete, necessitating identification of equivalent substitute parts for ongoing production and maintenance applications. The substitute part maintains identical electrical and mechanical specifications while differing in packaging configuration and product lifecycle status.

Key Parameters

Parameter	Value
Core Processor	ARM7®
Core Size	16/32-Bit
Speed	60MHz
Program Memory Size	256KB (256K x 8)
Program Memory Type	FLASH
RAM Size	16K x 8
Voltage Supply (Vcc/Vdd)	1.65V ~ 3.6V
Data Converters	A/D 4x10b
Number of I/O	46
Connectivity	I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals	POR, PWM, WDT
Package / Case	64-LQFP (10x10)
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the LPC2124FBD64,151 with LPC2124FBD64/01,15 is based on strict equivalence of the following critical parameters:

Core Processor: ARM7® (identical)
Core Size: 16/32-Bit (identical)
Speed: 60MHz (identical)
Program Memory: 256KB FLASH (identical)
RAM: 16K x 8 (identical)
Voltage Supply: 1.65V ~ 3.6V (identical)
Data Converters: A/D 4x10b (identical)
Number of I/O: 46 (identical)
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART (identical)
Peripherals: POR, PWM, WDT (identical)
Package / Case: 64-LQFP (10x10) (identical)
Operating Temperature: -40°C ~ 85°C (TA) (identical)
Mounting Type: Surface Mount (identical)
RoHS Status: ROHS3 Compliant (identical)
MSL: 1 (Unlimited) (identical)

The substitute part differs only in packaging configuration (Tray vs. standard packaging) and product lifecycle designation.

Parameter Comparison

Parameter	LPC2124FBD64,151	LPC2124FBD64/01,15	Match
Manufacturer	NXP USA Inc.	NXP USA Inc.	✓
Series	LPC2100	LPC2100	✓
Core Processor	ARM7®	ARM7®	✓
Core Size	16/32-Bit	16/32-Bit	✓
Speed	60MHz	60MHz	✓
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)	✓
Program Memory Type	FLASH	FLASH	✓
RAM Size	16K x 8	16K x 8	✓
Voltage Supply (Vcc/Vdd)	1.65V ~ 3.6V	1.65V ~ 3.6V	✓
Data Converters	A/D 4x10b	A/D 4x10b	✓
Number of I/O	46	46	✓
Connectivity	I2C, Microwire, SPI, SSI, SSP, UART/USART	I2C, Microwire, SPI, SSI, SSP, UART/USART	✓
Peripherals	POR, PWM, WDT	POR, PWM, WDT	✓
Package / Case	64-LQFP (10x10)	64-LQFP (10x10)	✓
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	✓
Mounting Type	Surface Mount	Surface Mount	✓
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	✓
MSL	1 (Unlimited)	1 (Unlimited)	✓
Product Status	Obsolete	Not For New Designs	Different
Packaging Configuration	Standard	Tray	Different

Engineering Selection Recommendations

The LPC2124FBD64/01,15 is a direct functional equivalent to the LPC2124FBD64,151. Both parts are ROHS3 compliant and carry identical REACH and ECCN classifications. The substitute part is designated "Not For New Designs," indicating it remains available for legacy system support and maintenance applications. Selection between these parts should be based on packaging requirements and supply chain availability. The Tray packaging of the substitute part may affect procurement logistics and handling procedures but does not alter electrical or mechanical compatibility.

Frequently Asked Questions (FAQ)

Q: Are the LPC2124FBD64,151 and LPC2124FBD64/01,15 pin-compatible?

A: Yes. Both parts use the 64-LQFP (10x10) package with identical pin assignments, I/O count (46), and electrical characteristics.

Q: What is the difference between these two part numbers?

A: The primary differences are packaging configuration (Tray vs. standard) and product lifecycle status (Obsolete vs. Not For New Designs). All electrical and mechanical specifications are identical.

Q: Can I use LPC2124FBD64/01,15 as a direct replacement in existing designs?

A: Yes. The substitute part maintains full electrical and mechanical equivalence, including voltage supply range (1.65V ~ 3.6V), operating temperature (-40°C ~ 85°C), memory configuration (256KB FLASH, 16KB RAM), and all connectivity interfaces (I2C, SPI, UART/USART, etc.).

Q: Are there any compliance or certification differences?

A: No. Both parts carry identical RoHS3 compliance, REACH status, and MSL ratings. ECCN and HTSUS classifications are the same.

Q: Does the Tray packaging affect circuit board assembly?

A: Tray packaging affects component handling and storage procedures but does not alter electrical performance or PCB integration. Standard surface mount assembly processes remain applicable.

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