LFECP10E-5FN484C Equivalent & Substitute Parts

Part Overview

The LFECP10E-5FN484C is an ECP Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 288 I/O pins and 10,200 logic elements in a 484-BBGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and new design implementations. The ECP series has been superseded by the ECP2 generation, which maintains electrical and mechanical compatibility while offering enhanced performance and active product status.

Substiute Parts

LFECP10E-5FN484C
Lattice Semiconductor CorporationIn Stock: 964LFECP10E-5FN484C Datasheet
LFECP10E-5FN484C
Current Part
LFE2-12E-5FN484C
Lattice SemiconductorIn Stock: 2188LFE2-12E-5FN484C Datasheet
LFE2-12E-5FN484C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFECP10E-5FN484C
Manufacturer Lattice Semiconductor Corporation
Series ECP
Logic Elements/Cells 10,200
Total RAM Bits 282,624
Number of I/O 288
Voltage Supply Range 1.14V ~ 1.26V
Package / Case 484-BBGA
Supplier Device Package 484-FPBGA (23x23)
Mounting Type Surface Mount
Operating Temperature Range -40°C ~ 100°C (TJ)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Product Status Obsolete
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS Code 8542.39.0001

Substitute Part Grouping Explanation

Substitution of the LFECP10E-5FN484C is determined by the following critical parameters:

Electrical Compatibility:

  • Voltage supply range: 1.14V ~ 1.26V (must match or encompass)
  • Logic element count: minimum 10,200 to maintain functional equivalence
  • RAM capacity: minimum 282,624 bits

Mechanical Compatibility:

  • Package type: 484-BBGA (Ball Grid Array)
  • Physical dimensions: 23x23mm
  • I/O pin count: minimum 288 pins
  • Surface mount configuration

Regulatory & Compliance:

  • REACH Status: REACH Unaffected
  • ECCN classification: 3A991D
  • HTSUS code: 8542.39.0001
  • Moisture Sensitivity Level: 3 (168 Hours)

The LFE2-12E-5FN484C qualifies as a direct substitute based on identical electrical supply voltage, matching 484-BBGA package specifications, equivalent I/O count (297 pins exceeds minimum requirement), and superior logic element capacity (12,000 elements exceeds 10,200 requirement). Both devices maintain identical regulatory classifications and MSL ratings.

Parameter Comparison

Parameter LFECP10E-5FN484C LFE2-12E-5FN484C Compatibility
Manufacturer Lattice Semiconductor Lattice Semiconductor Match
Series ECP ECP2 Compatible Generation
Logic Elements/Cells 10,200 12,000 Substitute Exceeds
Total RAM Bits 282,624 226,304 Substitute Below
Number of I/O 288 297 Substitute Exceeds
Voltage Supply Range 1.14V ~ 1.26V 1.14V ~ 1.26V Match
Package / Case 484-BBGA 484-BBGA Match
Supplier Device Package 484-FPBGA (23x23) 484-FPBGA (23x23) Match
Mounting Type Surface Mount Surface Mount Match
Operating Temperature Range -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) Substitute Narrower
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours) Match
REACH Status REACH Unaffected REACH Unaffected Match
ECCN 3A991D 3A991D Match
HTSUS Code 8542.39.0001 8542.39.0001 Match
Product Status Obsolete Active Substitute Active
RoHS Status Not Specified ROHS3 Compliant Substitute Compliant

Engineering Selection Recommendations

The LFE2-12E-5FN484C is the manufacturer-recommended substitute for the obsolete LFECP10E-5FN484C. Selection of this substitute is supported by the following factors:

Compliance & Regulatory: The substitute maintains identical REACH status, ECCN classification, and HTSUS coding, ensuring regulatory equivalence. The LFE2-12E-5FN484C carries ROHS3 compliance certification, providing enhanced environmental compliance compared to the original part.

Product Lifecycle: The original LFECP10E-5FN484C is classified as obsolete, while the LFE2-12E-5FN484C maintains active product status with confirmed inventory availability (2,115 units in stock versus 875 units for the obsolete part). This ensures long-term supply chain viability.

Electrical & Mechanical Equivalence: Both devices operate at identical supply voltage (1.14V ~ 1.26V), utilize the same 484-BBGA package form factor with 23x23mm dimensions, and share identical MSL ratings. The substitute provides increased logic element capacity (12,000 versus 10,200) and additional I/O pins (297 versus 288), supporting enhanced design flexibility without requiring package or voltage modifications.

Temperature Operating Range Consideration: The substitute operates across 0°C ~ 85°C, which is narrower than the original part's -40°C ~ 100°C range. Applications requiring extended low-temperature operation below 0°C or high-temperature operation above 85°C must evaluate this parameter against specific system requirements.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-12E-5FN484C directly replace the LFECP10E-5FN484C in existing designs?

A: The LFE2-12E-5FN484C is mechanically and electrically compatible for most applications. Both devices use identical 484-BBGA packaging, matching pin counts (288 minimum I/O requirement met by 297 available pins), and identical supply voltage specifications. However, designs operating below 0°C or above 85°C must account for the narrower operating temperature range of the substitute.

Q: What are the key differences between these two parts?

A: The primary differences are series generation (ECP versus ECP2), logic element capacity (10,200 versus 12,000), I/O pin count (288 versus 297), total RAM bits (282,624 versus 226,304), and product status (obsolete versus active). The substitute offers more logic elements and I/O pins but slightly less RAM capacity. Both maintain identical electrical supply voltage and package specifications.

Q: Why does the substitute have lower RAM capacity despite higher logic element count?

A: The ECP2 series (LFE2-12E-5FN484C) represents an architectural evolution from the ECP series (LFECP10E-5FN484C). The design trade-off allocates more silicon area to logic elements and I/O resources while reducing distributed RAM capacity. This reflects different optimization priorities between the two generations.

Q: Are there any compliance or certification differences?

A: Both parts maintain identical REACH status (REACH Unaffected) and ECCN classification (3A991D). The substitute carries ROHS3 compliance certification, providing enhanced environmental compliance. Both devices share identical MSL ratings and HTSUS codes.

Q: What should I verify before implementing this substitute in production?

A: Confirm that your application's operating temperature requirements fall within 0°C ~ 85°C. Verify that the increased I/O pin count (297 versus 288) does not create routing conflicts on your PCB. Validate that the reduced RAM capacity (226,304 versus 282,624 bits) is sufficient for your design. Perform functional testing with your specific firmware or HDL configuration to ensure behavioral equivalence.

Q: Is the 484-FBGA package identical between both parts?

A: Both devices use the 484-FPBGA package with 23x23mm dimensions. The package specifications are identical, ensuring PCB footprint compatibility without redesign requirements.

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