IXFN30N110P N-Channel MOSFET Equivalent & Substitute Parts

Part Overview

The IXFN30N110P is an N-Channel MOSFET manufactured by IXYS, rated for 1100V drain-to-source voltage with 25A continuous drain current at 25°C. This device is housed in a SOT-227B (miniBLOC) chassis mount package and is part of the HiPerFET™ series. The part is classified as obsolete, making identification of functionally equivalent alternatives necessary for ongoing design support and procurement continuity. Substitute parts must maintain compatibility across voltage rating, current capacity, thermal performance, and package form factor to ensure direct replacement capability in existing applications.

Substiute Parts

IXFN30N110P
IXYSIn Stock: 791IXFN30N110P Datasheet
IXFN30N110P
Current Part
APT10035JFLL
Microchip TechnologyIn Stock: 1177APT10035JFLL Datasheet
APT10035JFLL
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APT10035JLL
Microchip TechnologyIn Stock: 1258APT10035JLL Datasheet
APT10035JLL
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Key Parameters

Parameter Value Unit
FET Type N-Channel
Drain to Source Voltage (Vdss) 1100 V
Current - Continuous Drain (Id) @ 25°C 25 A (Tc)
Rds On (Max) @ Id, Vgs 360 mOhm @ 15A, 10V
Power Dissipation (Max) 695 W (Tc)
Operating Temperature Range -55 to 150 °C (TJ)
Mounting Type Chassis Mount
Package / Case SOT-227-4, miniBLOC
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the IXFN30N110P is determined by the following critical parameters:

Voltage Rating Compatibility: The main part operates at 1100V Vdss. Substitute parts must maintain voltage ratings sufficient for the application. The identified substitutes (APT10035JFLL and APT10035JLL) operate at 1000V Vdss, representing a 100V reduction in maximum voltage specification.

Current Capacity: Both substitute parts maintain the 25A continuous drain current specification, ensuring equivalent current handling capability.

Package and Mounting: All parts utilize SOT-227-4 miniBLOC chassis mount packaging, providing mechanical and thermal interface compatibility.

On-State Resistance (Rds On): The main part specifies 360 mOhm maximum at 15A and 10V gate-source voltage. Substitute parts specify 370 mOhm (APT10035JFLL) and 350 mOhm (APT10035JLL) at 14A and 10V, representing comparable on-state performance within acceptable engineering tolerances.

Thermal Performance: The main part dissipates 695W maximum at case temperature. Substitute parts dissipate 520W maximum, indicating reduced thermal capacity.

Product Status: The main part is obsolete. Both substitute parts are active products from Microchip Technology, ensuring ongoing availability and technical support.

Parameter Comparison

Parameter IXFN30N110P APT10035JFLL APT10035JLL Unit
Manufacturer IXYS Microchip Technology Microchip Technology
FET Type N-Channel N-Channel N-Channel
Drain to Source Voltage (Vdss) 1100 1000 1000 V
Current - Continuous Drain (Id) @ 25°C 25 25 25 A (Tc)
Rds On (Max) @ Id, Vgs 360 @ 15A, 10V 370 @ 14A, 10V 350 @ 14A, 10V mOhm
Vgs(th) (Max) @ Id 6.5 @ 1mA 5 @ 2.5mA 5 @ 2.5mA V
Gate Charge (Qg) (Max) @ Vgs 235 @ 10V 186 @ 10V 186 @ 10V nC
Input Capacitance (Ciss) (Max) @ Vds 13600 @ 25V 5185 @ 25V 5185 @ 25V pF
Power Dissipation (Max) 695 520 520 W (Tc)
Operating Temperature Range -55 to 150 -55 to 150 -55 to 150 °C (TJ)
Mounting Type Chassis Mount Chassis Mount Chassis Mount
Package / Case SOT-227-4, miniBLOC SOT-227-4, miniBLOC SOT-227-4, miniBLOC
Product Status Obsolete Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

Substitution Feasibility: The APT10035JFLL and APT10035JLL are functionally equivalent substitutes for the obsolete IXFN30N110P within applications where the 100V reduction in Vdss (from 1100V to 1000V) is acceptable. Both substitute parts are active products with current manufacturing support, ensuring long-term availability and technical documentation access.

Compliance Status: All three parts maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements for new designs and procurement. The substitute parts from Microchip Technology provide equivalent environmental and safety certifications.

Thermal Considerations: Applications requiring the full 695W thermal dissipation capability of the IXFN30N110P should evaluate whether the 520W maximum dissipation of the substitute parts meets thermal design requirements. The reduction in power dissipation capacity may necessitate thermal management review in high-power applications.

On-State Performance: The substitute parts exhibit lower on-state resistance (350–370 mOhm) compared to the main part (360 mOhm), resulting in reduced conduction losses. Gate charge and input capacitance are significantly lower in the substitute parts, potentially improving switching performance and reducing drive circuit requirements.

Package Compatibility: All parts utilize identical SOT-227-4 miniBLOC chassis mount packaging, enabling direct mechanical and thermal interface compatibility without PCB redesign.

Frequently Asked Questions (FAQ)

Q: Can APT10035JFLL and APT10035JLL be used interchangeably as substitutes for IXFN30N110P?

A: Both Microchip Technology parts are functionally equivalent substitutes. The primary difference between APT10035JFLL and APT10035JLL is packaging format (tube vs. alternative tube specification). Both maintain identical electrical specifications and are suitable for direct replacement in applications where 1000V Vdss rating is sufficient.

Q: What is the significance of the 100V voltage rating reduction from 1100V to 1000V?

A: The voltage rating reduction must be evaluated against application requirements. If the circuit operates below 1000V, the substitute parts are fully compatible. Applications requiring operation at voltages between 1000V and 1100V require circuit redesign or alternative component selection.

Q: Are the on-state resistance specifications of the substitute parts acceptable?

A: The substitute parts specify 350–370 mOhm on-state resistance, compared to 360 mOhm for the main part. These values are within comparable engineering tolerances and represent acceptable substitution. The lower values in the substitute parts may reduce conduction losses.

Q: How do the thermal characteristics compare?

A: The main part dissipates 695W maximum at case temperature, while substitute parts dissipate 520W maximum. This 175W reduction in thermal capacity must be evaluated against application thermal requirements. Applications operating near the thermal limits of the main part require thermal management assessment.

Q: Are the gate charge and input capacitance differences significant?

A: The substitute parts exhibit substantially lower gate charge (186 nC vs. 235 nC) and input capacitance (5185 pF vs. 13600 pF). These reductions may improve switching speed and reduce gate drive circuit power requirements, representing potential performance benefits in switching applications.

Q: Do all parts share identical package and mounting specifications?

A: All three parts utilize SOT-227-4 miniBLOC chassis mount packaging, providing identical mechanical and thermal interface compatibility. Direct PCB mounting without modification is supported.

Q: What is the product status impact on long-term availability?

A: The IXFN30N110P is classified as obsolete, indicating discontinued manufacturing and limited future availability. The substitute parts (APT10035JFLL and APT10035JLL) are active products with ongoing manufacturing support, ensuring reliable long-term procurement and technical documentation access.

Q: Are regulatory and compliance certifications equivalent across all parts?

A: All three parts maintain ROHS3 compliance and REACH unaffected status. Regulatory requirements for new designs and procurement are satisfied by the substitute parts.

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