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HSMP-3860-TR2G Equivalent & Substitute Parts
Part Overview
The HSMP-3860-TR2G is an RF Diode PIN - Single manufactured by Broadcom Limited, rated for 50V peak reverse voltage with 1A maximum current in a SOT-23-3 package. This part is classified as Obsolete, making identification of functionally equivalent alternatives essential for ongoing design support and procurement continuity. Substitute parts must maintain compatibility across electrical performance, thermal characteristics, and physical packaging constraints.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Diode Type | PIN - Single |
| Voltage - Peak Reverse (Max) | 50V |
| Current - Max | 1 A |
| Capacitance @ Vr, F | 0.2pF @ 50V, 1MHz |
| Resistance @ If, F | 1.5Ohm @ 100mA, 100MHz |
| Operating Temperature | 150°C (TJ) |
| Package / Case | TO-236-3, SC-59, SOT-23-3 |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution eligibility for the HSMP-3860-TR2G is determined by the following criteria:
Electrical Compatibility Requirements:
- Diode Type: PIN - Single (functional category match)
- Voltage - Peak Reverse (Max): Must equal or exceed 50V
- Current - Max: Must equal or exceed 1A
- Resistance @ If, F: Must be within acceptable operating range (1.5Ohm @ 100mA, 100MHz reference)
- Capacitance @ Vr, F: Must support RF switching performance at specified frequency
Thermal & Environmental Requirements:
- Operating Temperature: Must support minimum 150°C (TJ)
- Moisture Sensitivity Level: MSL 1 or equivalent
Physical Requirements:
- Package compatibility: SOT-23-3 or equivalent footprint
The identified substitute parts meet these criteria with the following considerations:
CLA4606-085LF exceeds voltage and current ratings (75V, 1.5A) with improved thermal performance (175°C) and higher power dissipation capability (3W), suitable for applications requiring enhanced margin.
SMP1302-001LF provides significantly higher voltage rating (200V) with reduced power dissipation (250mW) in identical SOT-23-3 packaging, applicable where voltage headroom is prioritized.
Parameter Comparison
| Parameter | HSMP-3860-TR2G | CLA4606-085LF | SMP1302-001LF |
|---|---|---|---|
| Manufacturer | Broadcom Limited | Skyworks Solutions Inc. | Skyworks Solutions Inc. |
| Diode Type | PIN - Single | PIN - Single | PIN - Single |
| Voltage - Peak Reverse (Max) | 50V | 75V | 200V |
| Current - Max | 1 A | 1.5 A | Not specified |
| Capacitance @ Vr, F | 0.2pF @ 50V, 1MHz | 0.38pF @ 6V, 1MHz | 0.3pF @ 30V, 1MHz |
| Resistance @ If, F | 1.5Ohm @ 100mA, 100MHz | 2Ohm @ 10mA, 100MHz | 1.5Ohm @ 100mA, 100MHz |
| Power Dissipation (Max) | Not specified | 3 W | 250 mW |
| Operating Temperature | 150°C (TJ) | 175°C (TJ) | -65°C ~ 150°C (TA) |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | 2-VDFN Exposed Pad, 3-QFN (2x2) | TO-236-3, SC-59, SOT-23-3 |
| Product Status | Obsolete | Active | Obsolete |
| RoHS Status | Not specified | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
CLA4606-085LF is the primary recommended substitute for new designs and procurement. This part is Active status with ROHS3 compliance, providing superior electrical performance margins (75V/1.5A versus 50V/1A) and enhanced thermal capability (175°C junction temperature). The 3-QFN package requires PCB layout modification from the original SOT-23-3 footprint. This substitute is suitable for applications where component longevity and regulatory compliance are prioritized.
SMP1302-001LF provides an alternative for applications requiring higher voltage rating (200V) while maintaining SOT-23-3 package compatibility. However, this part is also Obsolete status, limiting its utility for long-term supply chain stability. ROHS3 compliance is confirmed. This option is applicable only where existing SOT-23-3 layouts must be preserved and voltage headroom is a critical design parameter.
For applications requiring immediate substitution with minimal redesign, CLA4606-085LF is the preferred choice despite package differences, as it offers Active product status and superior performance characteristics.
Frequently Asked Questions (FAQ)
Q: Can CLA4606-085LF be used as a direct pin-for-pin replacement for HSMP-3860-TR2G?
A: No. CLA4606-085LF uses a 3-QFN (2x2) package versus the SOT-23-3 package of the original part. PCB layout and footprint redesign is required. However, electrical performance is fully compatible and exceeds original specifications.
Q: What are the key electrical differences between the substitute parts?
A: CLA4606-085LF provides higher voltage (75V) and current (1.5A) ratings with 3W power dissipation capability. SMP1302-001LF provides the highest voltage rating (200V) but with lower power dissipation (250mW). Both maintain the 1.5Ohm resistance characteristic at 100MHz.
Q: Why is CLA4606-085LF recommended over SMP1302-001LF?
A: CLA4606-085LF has Active product status, ensuring long-term availability and supply chain support. SMP1302-001LF is Obsolete, presenting the same procurement challenges as the original HSMP-3860-TR2G. Both are ROHS3 compliant.
Q: Are there thermal performance differences between these parts?
A: Yes. CLA4606-085LF operates to 175°C junction temperature with 3W power dissipation capability. SMP1302-001LF operates to 150°C ambient temperature with 250mW power dissipation. CLA4606-085LF provides superior thermal margin for high-power RF applications.
Q: What is the capacitance impact of substitution?
A: CLA4606-085LF exhibits 0.38pF @ 6V versus the original 0.2pF @ 50V. SMP1302-001LF exhibits 0.3pF @ 30V. Capacitance variation affects RF switching speed and frequency response. Circuit simulation is required to confirm performance in specific RF applications.
Q: Are all substitute parts MSL 1 rated?
A: Yes. All parts listed, including the original HSMP-3860-TR2G, carry MSL 1 (Unlimited) moisture sensitivity rating, indicating no special moisture control requirements during storage or handling.
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