FX614P3 Equivalent & Substitute Parts

Part Overview

The FX614P3 is a Bell 202 compatible modem IC manufactured by CML Microcircuits, designed for 1.2k FSK data transmission. This component operates across a 3V to 5.5V supply voltage range and is packaged in a 16-pin DIP configuration for through-hole mounting applications.

The FX614P3 is classified as obsolete. Locating equivalent or substitute components is necessary for system redesigns, production continuity, and long-term supply chain management when original inventory becomes unavailable.

Substiute Parts

FX614P3

CML MicrocircuitsIn Stock: 1187FX614P3 Datasheet

Current PartRFQ

FX614D4

CML MicrocircuitsIn Stock: 10492FX614D4 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the FX614P3 is determined by the following core parameters:

• Data Format & Protocol: FSK, Bell 202 compatibility
• Baud Rate: 1.2k operation
• Supply Voltage Range: 3V ~ 5.5V
• Functional Equivalence: Modem IC for identical application requirements

The FX614D4 qualifies as a substitute based on matching all functional and electrical parameters. The primary difference is the package type: the FX614D4 uses surface-mount 16-SOIC packaging instead of through-hole 16-DIP. This substitution requires PCB redesign and assembly process modification but maintains full electrical and protocol compatibility.

Parameter Comparison

Engineering Selection Recommendations

The FX614D4 is the manufacturer-recommended substitute for the FX614P3. Both components share identical electrical specifications, protocol support, and supply voltage requirements, ensuring functional compatibility at the circuit level.

Selection between these parts depends on assembly and PCB design constraints:

• FX614P3 (Through-Hole DIP): Suitable for existing through-hole PCB designs. Obsolete status limits future availability.
• FX614D4 (Surface-Mount SOIC): Recommended for new PCB layouts or redesigns. Surface-mount packaging enables higher density and automated assembly. Classified as "Not For New Designs," indicating limited long-term support from the manufacturer.

Both components carry identical export classification (EAR99), HTSUS coding, and moisture sensitivity ratings. No compliance or regulatory differences exist between the two parts.

Frequently Asked Questions (FAQ)

Q: Can the FX614D4 directly replace the FX614P3 without circuit modification?

A: Electrical substitution is direct—both parts operate identically at the functional level with matching supply voltage, data format, and baud rate specifications. However, physical substitution requires PCB redesign due to different package types (DIP versus SOIC) and mounting methods (through-hole versus surface-mount).

Q: What is the significance of the "Not For New Designs" status on the FX614D4?

A: This designation indicates the manufacturer does not recommend the FX614D4 for new product development. Both the FX614P3 and FX614D4 are legacy components. For new designs, evaluate alternative modem IC solutions from current product lines.

Q: Are there pin-compatible alternatives between DIP and SOIC packages?

A: The FX614D4 shares the same pin count (16) and functional pinout as the FX614P3, but physical package dimensions differ. Pin-to-pin electrical compatibility exists; mechanical compatibility requires adapter solutions or PCB redesign.

Q: Do supply voltage and environmental specifications differ between these parts?

A: No. Both components operate across 3V to 5.5V, carry MSL rating 1 (unlimited moisture sensitivity), and share identical export and tariff classifications.