FOD3180SD Equivalent & Substitute Parts

Part Overview

The FOD3180SD is a 2.5A gate driver optical coupler manufactured by onsemi, providing 5000Vrms isolation in a single-channel configuration. This component is designed for high-voltage gate drive applications requiring galvanic isolation between control and power circuits. The part is currently in active production status with ROHS3 compliance and unlimited moisture sensitivity rating (MSL 1).

Substitute parts are identified when equivalent optical coupling gate drivers meet the functional requirements of the original design while accommodating variations in electrical performance, packaging format, or supply chain availability.

Substiute Parts

FOD3180SD
onsemiIn Stock: 30189FOD3180SD Datasheet
FOD3180SD
Current Part
ACPL-T350-300E
Broadcom LimitedIn Stock: 1414ACPL-T350-300E Datasheet
ACPL-T350-300E
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ACPL-T350-500E
Broadcom LimitedIn Stock: 18710ACPL-T350-500E Datasheet
ACPL-T350-500E
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ACPL-T350-560E
Broadcom LimitedIn Stock: 52584ACPL-T350-560E Datasheet
ACPL-T350-560E
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VO3150A-X007T
Vishay Semiconductor Opto DivisionIn Stock: 2067VO3150A-X007T Datasheet
VO3150A-X007T
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Key Parameters

Parameter FOD3180SD
Manufacturer onsemi
Technology Optical Coupling
Number of Channels 1
Voltage - Isolation 5000Vrms
Current - Peak Output 2.5A
Common Mode Transient Immunity (Min) 15kV/µs
Propagation Delay tpLH / tpHL (Max) 200ns / 200ns
Voltage - Output Supply 10V ~ 20V
Operating Temperature -40°C ~ 100°C
Mounting Type Surface Mount
Package / Case 8-SMD, Gull Wing
RoHS Status ROHS3 Compliant
Product Status Active

Substitute Part Grouping Explanation

Substitution eligibility for the FOD3180SD is determined by the following critical parameters:

Primary Substitution Criteria:

  • Single-channel optical coupling gate driver architecture
  • Peak output current capability of 2.5A or greater
  • Common mode transient immunity of 15kV/µs or higher
  • Isolation voltage of 5000Vrms or greater
  • Operating temperature range encompassing -40°C to 100°C
  • ROHS3 compliance and active product status

Secondary Considerations:

  • Propagation delay characteristics (lower values preferred for timing-critical applications)
  • Output supply voltage range compatibility
  • Package format compatibility with PCB layout constraints

The substitute parts identified (ACPL-T350 series and VO3150A-X007T) meet the core functional requirements despite variations in isolation voltage, propagation delay, and packaging format. These variations are within acceptable engineering tolerances for gate driver applications where the primary function—galvanic isolation and gate signal conditioning—remains consistent.

Parameter Comparison

Parameter FOD3180SD ACPL-T350-300E ACPL-T350-500E ACPL-T350-560E VO3150A-X007T
Manufacturer onsemi Broadcom Limited Broadcom Limited Broadcom Limited Vishay Semiconductor Opto Division
Voltage - Isolation 5000Vrms 3750Vrms 3750Vrms 3750Vrms 5300Vrms
Number of Channels 1 1 1 1 1
Current - Peak Output 2.5A 2.5A 2.5A 2.5A 500mA
Common Mode Transient Immunity (Min) 15kV/µs 15kV/µs 15kV/µs 15kV/µs 25kV/µs
Propagation Delay tpLH / tpHL (Max) 200ns / 200ns 500ns / 500ns 500ns / 500ns 500ns / 500ns 400ns / 400ns
Pulse Width Distortion (Max) 65ns 300ns 300ns 300ns 200ns
Voltage - Output Supply 10V ~ 20V 15V ~ 30V 15V ~ 30V 15V ~ 30V 15V ~ 32V
Operating Temperature -40°C ~ 100°C -40°C ~ 100°C -40°C ~ 100°C -40°C ~ 100°C -40°C ~ 110°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Through Hole
Package / Case 8-SMD, Gull Wing 8-DIP Gull Wing 8-DIP Gull Wing 8-DIP Gull Wing 8-DIP (0.300", 7.62mm)
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Active Active Active Active Active

Engineering Selection Recommendations

ACPL-T350 Series (ACPL-T350-300E, ACPL-T350-500E, ACPL-T350-560E):

The ACPL-T350 series from Broadcom Limited provides equivalent 2.5A peak output current and 15kV/µs common mode transient immunity. These parts operate with isolation voltage of 3750Vrms, which is lower than the FOD3180SD. Selection of ACPL-T350 variants is appropriate for applications where the reduced isolation voltage meets system requirements. All three variants are ROHS3 compliant and in active production. Propagation delay is increased to 500ns maximum compared to 200ns for the FOD3180SD. Output supply voltage range extends to 30V maximum, accommodating broader gate drive supply configurations. Packaging differs from the FOD3180SD (8-DIP Gull Wing versus 8-SMD), requiring PCB layout modification.

VO3150A-X007T:

The VO3150A-X007T from Vishay Semiconductor Opto Division provides isolation voltage of 5300Vrms, exceeding the FOD3180SD specification. This part features 25kV/µs common mode transient immunity, superior to the 15kV/µs minimum of the FOD3180SD. However, peak output current is limited to 500mA, significantly lower than the 2.5A requirement of the FOD3180SD. This part is suitable only for applications with reduced gate drive current requirements. The VO3150A-X007T uses through-hole 8-DIP packaging, requiring different PCB footprint and assembly process compared to the surface-mount FOD3180SD. Operating temperature range extends to 110°C maximum. This part is ROHS3 compliant and in active production.

Compliance and Certification:

All identified substitute parts maintain ROHS3 compliance and active product status consistent with the FOD3180SD. Approval agencies vary: FOD3180SD carries cUL and UL approvals; ACPL-T350 series carries CSA and UR approvals (with ACPL-T350-560E additionally carrying IEC/EN/DIN); VO3150A-X007T carries cUR and UR approvals. System-level certification requirements must be evaluated when substituting parts with different approval agency designations.

Frequently Asked Questions (FAQ)

Q: Can ACPL-T350 series parts directly replace FOD3180SD in existing designs?

A: Direct replacement requires evaluation of isolation voltage requirements. The ACPL-T350 series provides 3750Vrms isolation versus 5000Vrms for the FOD3180SD. If the application design margin permits operation at 3750Vrms isolation, substitution is feasible. PCB layout modification is required due to package format change from 8-SMD to 8-DIP Gull Wing. Propagation delay increases from 200ns to 500ns, which may affect timing-critical gate drive sequences.

Q: Is VO3150A-X007T suitable as a substitute for FOD3180SD?

A: VO3150A-X007T is not recommended as a direct substitute due to peak output current limitation of 500mA versus the 2.5A requirement of FOD3180SD. This part is suitable only for applications with significantly reduced gate drive current demands. Additionally, through-hole packaging requires different assembly and PCB design compared to the surface-mount FOD3180SD.

Q: What are the key differences in output supply voltage between FOD3180SD and substitute parts?

A: FOD3180SD operates with output supply voltage of 10V to 20V. ACPL-T350 series and VO3150A-X007T require minimum 15V output supply voltage, with maximum ratings of 30V and 32V respectively. Designs operating at 10V to 15V output supply must remain with FOD3180SD or equivalent parts supporting this lower voltage range.

Q: How do propagation delay differences affect gate driver selection?

A: FOD3180SD provides 200ns maximum propagation delay (tpLH and tpHL). ACPL-T350 series increases this to 500ns, while VO3150A-X007T provides 400ns. Applications with tight timing requirements for gate signal synchronization or dead-time control may be constrained by increased propagation delay. Pulse width distortion also increases in substitute parts, affecting gate signal fidelity.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. FOD3180SD, all ACPL-T350 variants, and VO3150A-X007T are ROHS3 compliant with unlimited moisture sensitivity level (MSL 1). All parts carry REACH Unaffected status and EAR99 export classification.

Q: What packaging considerations apply when substituting parts?

A: FOD3180SD uses 8-SMD surface-mount packaging. ACPL-T350 series uses 8-DIP Gull Wing surface-mount packaging with different footprint geometry. VO3150A-X007T uses 8-DIP through-hole packaging (0.300" lead spacing), requiring PCB holes and different assembly process. Footprint compatibility must be verified before substitution.

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