FLC01-200H Equivalent & Substitute Parts

Part Overview

The FLC01-200H is a Fire Lighting Circuit integrated circuit manufactured by STMicroelectronics in TO-251-3 (IPak) through-hole packaging. This component is classified as obsolete, indicating discontinued production and limited availability in the market. The FLC01-200H maintains full compliance with ROHS3 and REACH regulations, with an unlimited moisture sensitivity level (MSL 1). Due to its obsolete status and finite inventory, identification of functionally equivalent substitute components is necessary for ongoing design support and production continuity.

Substiute Parts

FLC01-200H
STMicroelectronicsIn Stock: 965FLC01-200H Datasheet
FLC01-200H
Current Part
FLC01-200B-TR
STMicroelectronicsIn Stock: 5471FLC01-200B-TR Datasheet
FLC01-200B-TR
MFR Recommended

Key Parameters

Parameter Value
Manufacturer STMicroelectronics
Base Product Number FLC01
Type Fire Lighting Circuit
Package / Case TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type Through Hole
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)
REACH Status REACH Unaffected
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the FLC01-200H is determined by the following critical parameters:

Functional Equivalence: Both the main part and substitute share the identical base product number (FLC01) and functional classification (Fire Lighting Circuit), confirming equivalent electrical performance and pin configuration.

Manufacturer Consistency: Both components are manufactured by STMicroelectronics, ensuring design continuity and compatibility with original specifications.

Regulatory Compliance: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying environmental and regulatory requirements without modification.

Moisture Sensitivity: Both components carry MSL 1 (Unlimited), indicating identical moisture handling and storage requirements.

Key Substitution Difference: The primary distinction between the FLC01-200H and its substitute lies in packaging and mounting technology. The FLC01-200H utilizes through-hole mounting in TO-251-3 format, while the substitute employs surface-mount technology in DPAK (TO-252-3) format. This difference requires PCB redesign and assembly process modification.

Parameter Comparison

Parameter FLC01-200H (Main Part) FLC01-200B-TR (Substitute)
Manufacturer STMicroelectronics STMicroelectronics
Base Product Number FLC01 FLC01
Type Fire Lighting Circuit Fire Lighting Circuit
Mounting Type Through Hole Surface Mount
Package / Case TO-251-3 Short Leads, IPak, TO-251AA TO-252-3, DPAK (2 Leads + Tab), SC-63
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
Product Status Obsolete Active
Inventory Availability 938 Pcs 5400 Pcs

Engineering Selection Recommendations

For Obsolescence Management: The FLC01-200B-TR is the manufacturer-recommended substitute for the FLC01-200H. The substitute maintains active product status with significantly higher inventory availability (5400 units versus 938 units), providing superior long-term supply security.

For Regulatory Compliance: Both components satisfy ROHS3 and REACH requirements without distinction. Selection between these parts does not impact regulatory compliance status.

For Functional Performance: Electrical equivalence is confirmed through identical base product number and Fire Lighting Circuit classification. Both components deliver identical functional performance in their respective package formats.

For Production Continuity: The FLC01-200B-TR is suitable for new designs and production transitions. Existing through-hole designs utilizing the FLC01-200H require PCB layout and assembly process modification to accommodate the surface-mount DPAK package.

Frequently Asked Questions (FAQ)

Q: Are the FLC01-200H and FLC01-200B-TR electrically identical?

A: Yes. Both components share the identical base product number (FLC01) and functional classification (Fire Lighting Circuit), confirming equivalent electrical performance, pin configuration, and functional behavior.

Q: What is the primary difference between these two parts?

A: The primary difference is packaging and mounting technology. The FLC01-200H uses through-hole mounting in TO-251-3 (IPak) format, while the FLC01-200B-TR uses surface-mount technology in DPAK (TO-252-3) format. This requires PCB redesign and assembly process modification.

Q: Can I use the FLC01-200B-TR as a direct replacement on existing PCBs designed for the FLC01-200H?

A: No. The different package formats (TO-251-3 through-hole versus DPAK surface-mount) require PCB layout modification and assembly process changes. Direct board-level substitution is not possible without redesign.

Q: Why is the FLC01-200H classified as obsolete?

A: The FLC01-200H is discontinued by the manufacturer. The FLC01-200B-TR represents the active product continuation in an alternative package format.

Q: Do both parts have the same moisture sensitivity requirements?

A: Yes. Both components carry MSL 1 (Unlimited), indicating identical moisture handling, storage, and shelf-life characteristics.

Q: Are there any regulatory compliance differences between these parts?

A: No. Both components maintain ROHS3 compliance and REACH unaffected status. Regulatory requirements are identical.

Q: Which part should I specify for new designs?

A: The FLC01-200B-TR should be specified for new designs. It maintains active product status, offers superior inventory availability, and represents the manufacturer's current product offering for this functional class.

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