FIN1532MTC Equivalent & Substitute Parts

Part Overview

The FIN1532MTC is a 0/4 Receiver LVDS interface IC manufactured by onsemi in a 16-TSSOP surface mount package. This component is classified as obsolete, making equivalent and substitute parts necessary for ongoing system support and new design implementations. The FIN1532MTC operates at 400 Mbps data rate with a supply voltage range of 4.5V to 5.5V and temperature range of -40°C to 85°C.

Substiute Parts

FIN1532MTC

onsemiIn Stock: 934FIN1532MTC Datasheet

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AM26LS32ACPW

Texas InstrumentsIn Stock: 3167AM26LS32ACPW Datasheet

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AM26LS32ACPWR

Texas InstrumentsIn Stock: 3861AM26LS32ACPWR Datasheet

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DS90C032BTM/NOPB

Texas InstrumentsIn Stock: 1230DS90C032BTM/NOPB Datasheet

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DS90C032TM/NOPB

Texas InstrumentsIn Stock: 2004DS90C032TM/NOPB Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution for the FIN1532MTC is determined by the following critical parameters:

Protocol Compatibility: The FIN1532MTC implements LVDS (Low-Voltage Differential Signaling) protocol. Substitute parts must support LVDS to maintain functional equivalence.

Electrical Specifications: Supply voltage range (4.5V ~ 5.5V) and operating temperature range (-40°C ~ 85°C) define the operational envelope. Substitute parts must meet or exceed these specifications.

Package and Pinout: The 16-TSSOP package with 0.173" width is the primary mechanical constraint. Parts in alternative packages (such as 16-SOIC) require PCB layout modifications.

Receiver Configuration: The 0/4 receiver configuration (4 receivers, 0 drivers) must be maintained in direct substitutes.

Substitute parts are grouped into two categories:

Category 1 - Direct Package Match (16-TSSOP): Parts maintaining identical package form factor and pinout compatibility.

Category 2 - Alternative Package (16-SOIC): Parts with equivalent electrical function but different package geometry, requiring PCB redesign.

Parameter Comparison

Engineering Selection Recommendations

For Direct Replacement (Same PCB Layout)

The DS90C032BTM/NOPB and DS90C032TM/NOPB are not suitable for direct PCB replacement due to package geometry differences (16-SOIC vs. 16-TSSOP). These parts require PCB redesign.

The AM26LS32ACPW and AM26LS32ACPWR maintain the 16-TSSOP package form factor. However, these parts implement RS422/RS423 protocol rather than LVDS, representing a functional protocol change. Both parts are obsolete or have limited active status. The AM26LS32ACPWR is currently active with ROHS3 compliance and represents the most viable option if protocol substitution is acceptable for the application.

For New Designs or PCB Redesign Scenarios

The DS90C032BTM/NOPB and DS90C032TM/NOPB provide LVDS protocol equivalence with the FIN1532MTC, matching supply voltage (4.5V ~ 5.5V) and operating temperature range (-40°C ~ 85°C). Both parts are active products with ROHS3 compliance. The DS90C032TM/NOPB offers higher inventory availability (1900 Pcs) compared to DS90C032BTM/NOPB (1186 Pcs).

Compliance Considerations

All substitute parts maintain REACH Unaffected status and EAR99 ECCN classification. The DS90C032 series and AM26LS32ACPWR provide ROHS3 compliance, supporting modern regulatory requirements.

Frequently Asked Questions (FAQ)

Q: Can AM26LS32ACPW or AM26LS32ACPWR be used as direct pin-for-pin replacements for FIN1532MTC?

A: Both parts maintain the 16-TSSOP package and 0/4 receiver configuration. However, they implement RS422/RS423 protocol instead of LVDS. Protocol compatibility with the receiving system must be verified before substitution. The AM26LS32ACPWR is the preferred option due to active product status.

Q: What are the key differences between DS90C032BTM/NOPB and DS90C032TM/NOPB?

A: Both parts are functionally equivalent LVDS receivers in 16-SOIC packages with identical electrical specifications. The primary difference is packaging format (Tube for both). DS90C032TM/NOPB has higher inventory availability. Both require PCB layout modification from the original FIN1532MTC design.

Q: Why do the DS90C032 parts use a different package than the FIN1532MTC?

A: The FIN1532MTC uses 16-TSSOP (0.173" width), while DS90C032 parts use 16-SOIC (0.154" width). These are distinct package geometries requiring different PCB footprints. Package selection depends on available PCB real estate and design constraints.

Q: Are all substitute parts RoHS compliant?

A: The DS90C032BTM/NOPB, DS90C032TM/NOPB, and AM26LS32ACPWR are ROHS3 compliant. The AM26LS32ACPW RoHS status is ROHS3 compliant. The original FIN1532MTC RoHS status is not specified in available documentation.

Q: What is the impact of operating temperature range differences?

A: The FIN1532MTC and DS90C032 series support -40°C to 85°C operation. The AM26LS32 series supports 0°C to 70°C, a narrower range. System thermal requirements must be evaluated when considering AM26LS32 substitution.

Q: Which substitute part offers the best long-term availability?

A: The AM26LS32ACPWR is classified as Active product status, indicating ongoing manufacturing and support. The DS90C032 series (both variants) are also Active. The AM26LS32ACPW is Obsolete. For new designs, Active status parts are preferred for supply chain stability.