FGA50N60LS Equivalent & Substitute Parts

Part Overview

The FGA50N60LS is a 600V, 100A IGBT manufactured by onsemi in a TO-3P package rated for 240W maximum power dissipation. This device is classified as obsolete, necessitating identification of equivalent substitute components for ongoing design support and procurement continuity. The part operates across a temperature range of -55°C to 150°C and features standard input configuration with gate charge of 167 nC.

Substiute Parts

FGA50N60LS
onsemiIn Stock: 1670FGA50N60LS Datasheet
FGA50N60LS
Current Part
IXGH36N60B3
IXYSIn Stock: 5693IXGH36N60B3 Datasheet
IXGH36N60B3
Similar
IXXH50N60B3D1
IXYSIn Stock: 1386IXXH50N60B3D1 Datasheet
IXXH50N60B3D1
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Key Parameters

Parameter Value Unit
Voltage - Collector Emitter Breakdown (Max) 600 V
Current - Collector (Ic) (Max) 100 A
Current - Collector Pulsed (Icm) 150 A
Power - Max 240 W
Vce(on) (Max) @ Vge, Ic 1.8V @ 15V, 50A V
Gate Charge 167 nC
Switching Energy (on/off) 1.1mJ / 3.2mJ mJ
Td (on/off) @ 25°C 54ns / 146ns ns
Operating Temperature Range -55 to 150 °C
Mounting Type Through Hole -
Package / Case TO-3P-3 -
Input Type Standard -
Product Status Obsolete -

Substitute Part Grouping Explanation

Substitution of the FGA50N60LS is determined by electrical and mechanical compatibility across the following critical parameters:

Voltage Rating: All substitute parts must maintain 600V collector-emitter breakdown voltage to ensure equivalent voltage stress capability.

Current Rating: Substitute parts must support the application's maximum collector current requirements. The FGA50N60LS operates at 100A continuous current; substitutes with equal or greater current ratings are acceptable.

Power Dissipation: Maximum power rating must meet or exceed the thermal requirements of the application. The FGA50N60LS is rated for 240W.

Input Configuration: All substitutes utilize standard input type, maintaining gate drive compatibility.

Switching Characteristics: Gate charge, switching delay times (Td on/off), and switching energy values influence circuit performance and must be evaluated for application-specific timing and efficiency requirements.

Package Type: Mechanical compatibility requires through-hole mounting. Package variants (TO-3P versus TO-247) represent different physical footprints and thermal characteristics.

Operating Temperature: All substitutes support the -55°C to 150°C junction temperature range.

Parameter Comparison

Parameter FGA50N60LS (onsemi) IXGH36N60B3 (IXYS) IXXH50N60B3D1 (IXYS)
Voltage - Collector Emitter Breakdown (Max) 600 V 600 V 600 V
Current - Collector (Ic) (Max) 100 A 92 A 120 A
Current - Collector Pulsed (Icm) 150 A 200 A 200 A
Power - Max 240 W 250 W 600 W
Vce(on) (Max) @ Vge, Ic 1.8V @ 15V, 50A 1.8V @ 15V, 30A 1.8V @ 15V, 36A
Gate Charge 167 nC 80 nC 70 nC
Td (on/off) @ 25°C 54ns / 146ns 19ns / 125ns 27ns / 100ns
Input Type Standard Standard Standard
Operating Temperature Range -55 to 150 °C -55 to 150 °C Not specified
Mounting Type Through Hole Through Hole Through Hole
Package / Case TO-3P-3 TO-247-3 TO-247-3
Product Status Obsolete Active Active

Engineering Selection Recommendations

IXGH36N60B3 (IXYS GenX3™ Series)

This substitute provides 600V voltage rating with 92A continuous current capability. The 250W power rating exceeds the FGA50N60LS specification. The IXGH36N60B3 features reduced gate charge (80 nC versus 167 nC) and faster switching times, resulting in lower switching losses. This device is RoHS3 compliant and maintains active product status. The TO-247 package differs mechanically from the TO-3P, requiring PCB layout modification. This substitute is suitable for applications where the 92A current rating is sufficient and package redesign is acceptable.

IXXH50N60B3D1 (IXYS GenX3™/XPT™ Series)

This substitute provides 600V voltage rating with 120A continuous current capability, exceeding the FGA50N60LS 100A specification. The 600W power rating provides substantial thermal margin. The IXXH50N60B3D1 features lower gate charge (70 nC) and faster switching times compared to the original part. This device is RoHS3 compliant and maintains active product status. The TO-247 package requires PCB layout modification. This substitute is suitable for applications requiring equal or greater current capacity and offers superior thermal performance.

Both substitute parts maintain 600V voltage rating, standard input configuration, and through-hole mounting. Both are manufactured by IXYS and carry active product status with current availability. Selection between substitutes depends on application current requirements and thermal design constraints.

Frequently Asked Questions (FAQ)

Q: Can the IXGH36N60B3 replace the FGA50N60LS in all applications?

A: The IXGH36N60B3 provides equivalent voltage rating (600V) and input configuration (standard). However, the 92A continuous current rating is lower than the FGA50N60LS 100A specification. This substitute is suitable only for applications where maximum collector current does not exceed 92A. The TO-247 package requires mechanical redesign compared to the original TO-3P footprint.

Q: What are the advantages of the IXXH50N60B3D1 over the FGA50N60LS?

A: The IXXH50N60B3D1 provides higher continuous current (120A versus 100A), significantly higher power rating (600W versus 240W), lower gate charge (70 nC versus 167 nC), and faster switching times. These characteristics result in reduced switching losses and improved thermal performance. The device maintains active product status with current manufacturing support.

Q: Does package change from TO-3P to TO-247 affect electrical performance?

A: Package change does not alter electrical performance specifications. However, TO-3P and TO-247 packages have different physical dimensions, thermal characteristics, and PCB mounting requirements. Circuit board layout, heatsink interface, and thermal management design must be re-evaluated for the new package type.

Q: Are both substitute parts RoHS compliant?

A: Both IXYS substitute parts (IXGH36N60B3 and IXXH50N60B3D1) are RoHS3 compliant. The original FGA50N60LS RoHS status is not specified in the provided data.

Q: What is the significance of gate charge differences between these parts?

A: Gate charge (167 nC for FGA50N60LS, 80 nC for IXGH36N60B3, 70 nC for IXXH50N60B3D1) affects gate drive circuit design and switching energy. Lower gate charge reduces driver power requirements and switching losses. Gate drive circuits must be evaluated to confirm compatibility with the reduced gate charge of substitute parts.

Q: Can switching time differences impact circuit operation?

A: Switching times (Td on/off) influence circuit timing and electromagnetic interference characteristics. The FGA50N60LS exhibits 54ns turn-on and 146ns turn-off delay. Substitute parts show faster switching characteristics. Applications with timing-critical control loops or EMI-sensitive designs must evaluate whether faster switching times affect system performance or require filter modifications.

Q: What inventory status should influence part selection?

A: The FGA50N60LS is obsolete with 1630 pieces in stock. Both substitute parts maintain active product status with current availability (IXGH36N60B3: 5625 pieces; IXXH50N60B3D1: 1286 pieces). Active product status ensures long-term supply continuity and manufacturing support.

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