DS14287 Real Time Clock IC - Equivalent & Substitute Parts

Part Overview

The DS14287 is a Real Time Clock (RTC) IC with integrated Clock/Calendar functionality, manufactured by Analog Devices Inc./Maxim Integrated. This device provides 114 bytes of NVSRAM (Non-Volatile Static RAM) with parallel interface connectivity in a 24-DIP through-hole package. The DS14287 is classified as obsolete, making identification of functionally equivalent substitute components necessary for ongoing system support and new design implementations.

Substiute Parts

DS14287
Analog Devices Inc./Maxim IntegratedIn Stock: 1354DS14287 Datasheet
DS14287
Current Part
DS1687-5+
Analog Devices Inc./Maxim IntegratedIn Stock: 1365DS1687-5+ Datasheet
DS1687-5+
MFR Recommended
BQ3285S-SB2
Texas InstrumentsIn Stock: 1987BQ3285S-SB2 Datasheet
BQ3285S-SB2
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number DS14287
Manufacturer Analog Devices Inc./Maxim Integrated
Product Category Clock/Timing - Real Time Clock (RTC)
Device Type Clock/Calendar with Alarm
Memory Size 114 Bytes NVSRAM
Interface Type Parallel
Time Format HH:MM:SS (12/24 hour)
Date Format YY-MM-DD-dd
Supply Voltage 4.5V ~ 5.5V
Battery Voltage 2.5V ~ 3.6V
Operating Temperature 0°C ~ 70°C
Package Type 24-DIP Module (0.600", 15.24mm)
Mounting Type Through Hole
Product Status Obsolete
RoHS Compliance Non-compliant

Substitute Part Grouping Explanation

Substitution of the DS14287 is determined by the following critical parameters:

Primary Compatibility Criteria:

  • Parallel interface architecture
  • Time format support (HH:MM:SS with 12/24 hour capability)
  • Date format support (YY-MM-DD-dd)
  • Supply voltage range (4.5V ~ 5.5V nominal operation)
  • Battery backup voltage compatibility (minimum 2.5V)
  • Operating temperature range (0°C ~ 70°C)
  • Alarm and Square Wave Output functionality
  • NVSRAM presence for non-volatile data storage

Secondary Considerations:

  • Package form factor (through-hole vs. surface mount affects PCB integration)
  • Memory capacity (114B minimum for functional equivalence)
  • Product status and compliance certifications

Two substitute parts meet the functional and electrical requirements of the DS14287:

  1. DS1687-5+ (Analog Devices Inc./Maxim Integrated) - Manufacturer-recommended substitute with enhanced memory (242B) and Y2K support, maintaining identical package footprint and electrical interface.

  2. BQ3285S-SB2 (Texas Instruments) - Functionally equivalent with matching feature set and memory capacity, available in surface-mount 24-SOIC package as an alternative to through-hole mounting.

Parameter Comparison

Parameter DS14287 (Main) DS1687-5+ (Substitute) BQ3285S-SB2 (Substitute)
Manufacturer Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated Texas Instruments
Product Status Obsolete Active Active
Memory Size (NVSRAM) 114 Bytes 242 Bytes 114 Bytes
Interface Parallel Parallel Parallel
Time Format HH:MM:SS (12/24 hr) HH:MM:SS (12/24 hr) HH:MM:SS (12/24 hr)
Date Format YY-MM-DD-dd YY-MM-DD-dd YY-MM-DD-dd
Supply Voltage 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V
Battery Voltage 2.5V ~ 3.6V 2.5V ~ 3.7V 2.5V ~ 4.0V
Operating Temperature 0°C ~ 70°C 0°C ~ 70°C 0°C ~ 70°C
Features Alarm, Daylight Savings, Leap Year, NVSRAM, Square Wave Output Alarm, NVSRAM, Square Wave Output, Y2K Alarm, Daylight Savings, Leap Year, NVSRAM, Square Wave Output
Package Type 24-DIP (0.600", 15.24mm) 24-DIP (0.600", 15.24mm) 24-SOIC (0.295", 7.50mm)
Mounting Type Through Hole Through Hole Surface Mount
RoHS Compliance Non-compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

DS1687-5+ Selection Criteria:

  • Direct replacement for through-hole PCB designs without layout modification
  • Identical 24-DIP package footprint ensures pin-for-pin compatibility
  • Active product status with ROHS3 compliance for new designs and long-term availability
  • Enhanced memory capacity (242B vs. 114B) provides additional non-volatile storage without electrical interface changes
  • Manufacturer-recommended substitute from the same product family

BQ3285S-SB2 Selection Criteria:

  • Suitable for surface-mount PCB designs or redesigns incorporating SMD technology
  • Functionally equivalent feature set including Daylight Savings and Leap Year support
  • Active product status with ROHS3 compliance
  • Alternative sourcing option from Texas Instruments for supply chain diversification
  • Requires PCB layout modification due to 24-SOIC package format versus 24-DIP

Compliance Considerations: Both substitute parts achieve ROHS3 compliance, addressing environmental and regulatory requirements that the obsolete DS14287 does not meet. Selection between DS1687-5+ and BQ3285S-SB2 depends on PCB form factor requirements and manufacturing process capabilities.

Frequently Asked Questions (FAQ)

Q: Can the DS1687-5+ directly replace the DS14287 without PCB modification? A: Yes. The DS1687-5+ maintains the identical 24-DIP through-hole package footprint and pin configuration as the DS14287. No PCB layout changes are required for direct substitution.

Q: What is the primary functional difference between DS1687-5+ and BQ3285S-SB2? A: Both devices provide equivalent RTC and Clock/Calendar functionality with parallel interface operation. The primary difference is package type: DS1687-5+ uses 24-DIP through-hole mounting, while BQ3285S-SB2 uses 24-SOIC surface-mount packaging. DS1687-5+ offers 242 bytes of memory versus 114 bytes in BQ3285S-SB2.

Q: Are the substitute parts compatible with the DS14287 power supply specifications? A: Yes. Both substitute parts operate within the same supply voltage range (4.5V ~ 5.5V) and support battery backup operation. Battery voltage ranges are slightly extended in the substitutes (up to 3.7V and 4.0V respectively versus 3.6V in the original), providing improved compatibility with common battery types.

Q: Which substitute should be selected for new product designs? A: DS1687-5+ is recommended for new designs requiring through-hole mounting. BQ3285S-SB2 is appropriate for designs utilizing surface-mount technology. Both achieve ROHS3 compliance, supporting modern manufacturing and environmental standards.

Q: Does the increased memory in DS1687-5+ (242B vs. 114B) affect software compatibility? A: The additional memory in DS1687-5+ is non-volatile storage beyond the core RTC functionality. Existing software utilizing the DS14287's 114-byte memory space operates identically on DS1687-5+. The additional 128 bytes provide expanded capacity for user applications without affecting core timekeeping operation.

Q: What is the impact of the different package types on system integration? A: Through-hole packages (DS14287, DS1687-5+) require PCB holes and are suitable for manual assembly or wave soldering. Surface-mount packages (BQ3285S-SB2) require SMD assembly equipment and reflow soldering. Package selection depends on manufacturing capabilities and PCB design requirements.

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