Equivalent & Substitute Parts for DF36057GFPV

Part Overview

The DF36057GFPV is a 16-bit H8/300H Tiny microcontroller manufactured by Renesas Electronics Corporation, featuring 56KB FLASH memory and a 64-LFQFP package. This device is classified as obsolete, making identification of functionally compatible alternatives essential for ongoing system support and new design considerations. The H8/300H architecture and its specific peripheral configuration require careful evaluation when selecting substitute components to ensure system compatibility.

Substiute Parts

DF36057GFPV
Renesas Electronics CorporationIn Stock: 1173DF36057GFPV Datasheet
DF36057GFPV
Current Part
MC9S12P64VLH
NXP USA Inc.In Stock: 908MC9S12P64VLH Datasheet
MC9S12P64VLH
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Key Parameters

Parameter DF36057GFPV
Manufacturer Renesas Electronics Corporation
Core Processor H8/300H
Core Size 16-Bit
Speed 20MHz
Program Memory Size 56KB FLASH
RAM Size 3K x 8
Number of I/O 45
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Package Type 64-LFQFP (10x10)
Mounting Type Surface Mount
Operating Temperature -20°C ~ 75°C
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the DF36057GFPV is constrained by the following critical parameters:

Package Compatibility: The 64-LFQFP (10x10) surface mount package is the primary physical constraint. Substitute parts must maintain identical pin count and footprint dimensions to ensure PCB compatibility without redesign.

Core Architecture: The H8/300H processor family defines the instruction set and peripheral interface. Substitutes from different processor families (such as HCS12) represent architectural changes that require firmware validation and may necessitate software modifications.

Memory Configuration: The 56KB FLASH and 3KB RAM define the addressable memory space. Substitute parts with larger memory allocations may be compatible if firmware does not exceed the original specifications.

Electrical Specifications: The 3V ~ 5.5V supply voltage range and operating temperature of -20°C ~ 75°C establish the environmental operating envelope.

Connectivity and Peripherals: CANbus, SCI, SSU connectivity and LVD, POR, PWM, WDT peripherals are functional requirements that must be present in substitute components.

The MC9S12P64VLH is identified as a substitute based on matching package geometry (64-LQFP 10x10), 16-bit core architecture, and compatible peripheral feature set, despite originating from a different processor family (HCS12 vs. H8/300H).

Parameter Comparison

Parameter DF36057GFPV MC9S12P64VLH
Manufacturer Renesas Electronics Corporation NXP USA Inc.
Core Size 16-Bit 16-Bit
Speed 20MHz 32MHz
Program Memory Size 56KB FLASH 64KB FLASH
RAM Size 3K x 8 4K x 8
EEPROM Size Not specified 4K x 8
Number of I/O 45 49
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 1.72V ~ 5.5V
Data Converters A/D 8x10b A/D 10x12b
Connectivity CANbus, SCI, SSU CANbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Operating Temperature -20°C ~ 75°C -40°C ~ 105°C
Package Type 64-LFQFP (10x10) 64-LQFP (10x10)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)

Engineering Selection Recommendations

Product Status Consideration: The DF36057GFPV is classified as obsolete, while the MC9S12P64VLH maintains active product status with ongoing manufacturer support and availability. This distinction is significant for long-term supply chain planning and technical support access.

Compliance and Certification: Both components are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements. Both maintain identical MSL ratings of 3 (168 Hours), indicating equivalent moisture sensitivity handling requirements.

Package and Footprint: Both devices utilize 64-pin LQFP packages with 10x10mm dimensions, enabling direct PCB footprint compatibility without layout redesign.

Architectural Differences: The MC9S12P64VLH represents a different processor family (HCS12 vs. H8/300H). This substitution requires firmware compatibility assessment, as instruction set architecture and peripheral register definitions differ between families.

Performance Enhancements: The MC9S12P64VLH provides increased clock speed (32MHz vs. 20MHz), expanded memory (64KB FLASH and 4KB RAM vs. 56KB FLASH and 3KB RAM), and enhanced analog capabilities (10x12-bit A/D vs. 8x10-bit A/D). These enhancements support applications requiring higher performance without architectural constraints.

Frequently Asked Questions (FAQ)

Q: Can the MC9S12P64VLH be used as a direct pin-for-pin replacement for the DF36057GFPV?

A: Both devices share identical 64-pin LQFP package geometry (10x10mm), enabling direct PCB footprint compatibility. However, pin function assignments differ between the H8/300H and HCS12 processor families. Schematic and firmware validation is required to confirm functional compatibility for specific applications.

Q: What are the primary differences between these microcontrollers?

A: The DF36057GFPV uses the H8/300H processor architecture with 56KB FLASH and operates at 20MHz. The MC9S12P64VLH uses the HCS12 processor architecture with 64KB FLASH and operates at 32MHz. Both maintain 16-bit core architecture, compatible peripheral sets (CANbus, SCI, PWM, WDT), and identical package dimensions. The MC9S12P64VLH offers expanded memory and performance capabilities.

Q: Are there supply chain advantages to selecting the MC9S12P64VLH?

A: Yes. The MC9S12P64VLH maintains active product status with current manufacturer support, whereas the DF36057GFPV is obsolete. This provides improved long-term availability, technical documentation access, and potential cost stability through established distribution channels.

Q: What firmware modifications are necessary when switching from DF36057GFPV to MC9S12P64VLH?

A: Firmware modifications depend on application-specific requirements. The instruction set architectures differ between H8/300H and HCS12 families, requiring code review and potential recompilation. Peripheral register definitions and interrupt handling mechanisms also differ. Applications utilizing only standard C library functions may require minimal changes, while assembly-language or hardware-specific code requires comprehensive validation.

Q: Do both devices support the same operating temperature range?

A: No. The DF36057GFPV operates from -20°C to 75°C, while the MC9S12P64VLH operates from -40°C to 105°C. The MC9S12P64VLH provides extended low-temperature capability and significantly extended high-temperature operation, suitable for industrial and automotive applications requiring broader thermal ranges.

Q: Are the voltage supply requirements compatible?

A: Both devices operate within overlapping voltage ranges. The DF36057GFPV requires 3V ~ 5.5V, while the MC9S12P64VLH operates from 1.72V ~ 5.5V. The MC9S12P64VLH supports lower minimum voltage operation, enabling compatibility with battery-powered and low-voltage applications.

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