Equivalent & Substitute Parts for DF36054HV

Part Overview

The DF36054HV is a 16-bit H8/300H Tiny microcontroller manufactured by Renesas Electronics Corporation, featuring 32KB FLASH memory and a 64-QFP package. This device is classified as obsolete, making equivalent and substitute parts necessary for ongoing system support and new design implementations. The part operates at 20MHz with integrated peripherals including CANbus, SCI, SSU connectivity, PWM, and watchdog timer functionality across 45 I/O pins.

Substiute Parts

DF36054HV
Renesas Electronics CorporationIn Stock: 984DF36054HV Datasheet
DF36054HV
Current Part
S9S12P32J0MLH
NXP USA Inc.In Stock: 8300S9S12P32J0MLH Datasheet
S9S12P32J0MLH
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Key Parameters

Parameter DF36054HV
Core Processor H8/300H
Core Size 16-Bit
Speed 20MHz
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
RAM Size 2K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Number of I/O 45
Package Type 64-BQFP (14x14)
Connectivity CANbus, SCI, SSU
Peripherals PWM, WDT
Operating Temperature -20°C ~ 75°C
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the DF36054HV is evaluated based on the following critical parameters:

  • Core Memory Configuration: Both parts must maintain 32KB FLASH and 2K x 8 RAM minimum specifications
  • 16-Bit Architecture: Core size must remain 16-bit for instruction set compatibility
  • Package Compatibility: Physical footprint and pin count must accommodate existing PCB layouts
  • Voltage Supply Range: Operating voltage window must overlap with the original 3V ~ 5.5V specification
  • Connectivity and Peripherals: CANbus, SCI, and PWM functionality must be present
  • Compliance Standards: RoHS3 compliance required for regulatory alignment

The S9S12P32J0MLH qualifies as a substitute based on matching core memory (32KB FLASH, 2K x 8 RAM), 16-bit architecture, surface mount technology, and RoHS3 compliance. Differences in processor family (HCS12 vs. H8/300H), operating speed (32MHz vs. 20MHz), and package footprint (64-LQFP 10x10 vs. 64-BQFP 14x14) represent design trade-offs requiring evaluation within specific application contexts.

Parameter Comparison

Parameter DF36054HV (Renesas) S9S12P32J0MLH (NXP)
Core Size 16-Bit 16-Bit
Program Memory Size 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
RAM Size 2K x 8 2K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 1.72V ~ 5.5V
Speed 20MHz 32MHz
Number of I/O 45 49
Package Type 64-BQFP (14x14) 64-LQFP (10x10)
Connectivity CANbus, SCI, SSU CANbus, SCI, SPI
Peripherals PWM, WDT LVD, POR, PWM, WDT
Operating Temperature -20°C ~ 75°C -40°C ~ 125°C
RoHS Status ROHS3 Compliant ROHS3 Compliant
Product Status Obsolete Active

Engineering Selection Recommendations

The S9S12P32J0MLH represents an active product alternative to the obsolete DF36054HV, with both devices maintaining ROHS3 compliance and equivalent core memory architecture. Selection between these parts depends on specific application requirements:

DF36054HV Considerations: Obsolete status limits long-term availability. Existing inventory of 963 pieces supports near-term production needs only. Processor-specific firmware and peripheral driver implementations tied to the H8/300H architecture cannot be directly ported to substitute devices.

S9S12P32J0MLH Considerations: Active product status ensures sustained availability and supply chain stability. The HCS12 processor family requires firmware redesign and peripheral reconfiguration. Enhanced operating temperature range (-40°C ~ 125°C) and lower minimum voltage threshold (1.72V) provide broader environmental operating margins. Package footprint reduction (64-LQFP 10x10 vs. 64-BQFP 14x14) requires PCB layout modification. Increased I/O count (49 vs. 45) and additional peripherals (LVD, POR) offer functional expansion opportunities.

Frequently Asked Questions (FAQ)

Q: Can the S9S12P32J0MLH directly replace the DF36054HV without firmware changes?

A: No. While both devices share 16-bit architecture and equivalent memory specifications, the processor families (HCS12 vs. H8/300H) employ different instruction sets, peripheral register maps, and interrupt handling mechanisms. Firmware redesign is required.

Q: What are the package footprint implications of substitution?

A: The DF36054HV uses a 64-BQFP package measuring 14x14mm, while the S9S12P32J0MLH uses a 64-LQFP package measuring 10x10mm. This 28% reduction in footprint requires PCB layout redesign, including trace routing and component placement modifications.

Q: Are both devices suitable for the same voltage supply designs?

A: The S9S12P32J0MLH operates across a wider voltage range (1.72V ~ 5.5V) compared to the DF36054HV (3V ~ 5.5V). Designs operating below 3V require the S9S12P32J0MLH. Designs within the 3V ~ 5.5V window are compatible with both devices.

Q: What connectivity differences exist between these parts?

A: The DF36054HV integrates CANbus, SCI, and SSU connectivity. The S9S12P32J0MLH provides CANbus, SCI, and SPI connectivity. Applications requiring SSU must retain the DF36054HV or implement alternative interface solutions.

Q: How do operating temperature ranges affect application suitability?

A: The DF36054HV operates from -20°C to 75°C, while the S9S12P32J0MLH extends to -40°C to 125°C. Applications requiring operation below -20°C or above 75°C must use the S9S12P32J0MLH.

Q: What is the significance of the S9S12P32J0MLH having additional peripherals?

A: The S9S12P32J0MLH includes Low Voltage Detect (LVD) and Power-On Reset (POR) functions not present in the DF36054HV. These peripherals provide enhanced power supply monitoring and system reset management, beneficial for applications requiring robust power management.

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