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C8051F835-GS Equivalent & Substitute Parts
Part Overview
The C8051F835-GS is an 8-bit microcontroller from Silicon Labs' C8051F83x series, featuring an 8051 core processor operating at 25MHz with 4KB of FLASH program memory. This device is classified as Last Time Buy, indicating end-of-life status. The part is housed in a 16-SOIC surface mount package and supports standard embedded communication protocols including I2C, SPI, and UART/USART.
Finding equivalent or substitute parts becomes necessary when the C8051F835-GS reaches end-of-life and inventory becomes unavailable. Substitutes must maintain compatibility across core electrical parameters, supply voltage range, operating temperature, communication interfaces, and package form factor to ensure seamless integration into existing designs.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Core Processor | 8051 |
| Core Size | 8-Bit |
| Speed | 25MHz |
| Program Memory Size | 4KB (4K x 8) FLASH |
| RAM Size | 256 x 8 |
| Voltage Supply (Vcc/Vdd) | 1.8V ~ 3.6V |
| Connectivity | I2C, SPI, UART/USART |
| Number of I/O | 13 |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package | 16-SOIC (0.154", 3.90mm Width) |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution of the C8051F835-GS is evaluated based on the following critical parameters:
Electrical Compatibility: Supply voltage range (1.8V ~ 3.6V) must be maintained or exceeded. Operating temperature range must support the minimum requirement of -40°C ~ 85°C.
Functional Compatibility: The substitute must provide equivalent or greater program memory (minimum 4KB FLASH), RAM capacity (minimum 256 x 8), and I/O pin count (minimum 13 pins). Communication interfaces must include I2C, SPI, and UART/USART support.
Physical Compatibility: The substitute must be available in a 16-pin surface mount package. While package type may differ (SOIC vs. TSSOP), both are 16-pin surface mount configurations with compatible pinout assignments for core functions.
Compliance: RoHS3 compliance is required. Product status should indicate active availability or recent production.
The LPC811M001JDH16FP qualifies as a substitute based on these criteria, despite architectural differences (32-bit ARM Cortex-M0+ vs. 8-bit 8051), because it meets or exceeds all specified electrical, functional, and physical parameters.
Parameter Comparison
| Parameter | C8051F835-GS | LPC811M001JDH16FP |
|---|---|---|
| Manufacturer | Silicon Labs | NXP Semiconductors |
| Core Processor | 8051 | ARM® Cortex®-M0+ |
| Core Size | 8-Bit | 32-Bit Single-Core |
| Speed | 25MHz | 30MHz |
| Program Memory Size | 4KB FLASH | 8KB FLASH |
| RAM Size | 256 x 8 | 2K x 8 |
| Voltage Supply (Vcc/Vdd) | 1.8V ~ 3.6V | 1.8V ~ 3.6V |
| Connectivity | I2C, SPI, UART/USART | I2C, SPI, UART/USART |
| Number of I/O | 13 | 14 |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 105°C |
| Mounting Type | Surface Mount | Surface Mount |
| Package | 16-SOIC | 16-TSSOP |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Product Status | Last Time Buy | Active |
Engineering Selection Recommendations
The LPC811M001JDH16FP is available as an active product from NXP Semiconductors, whereas the C8051F835-GS is designated Last Time Buy. Both devices maintain ROHS3 compliance and identical supply voltage specifications (1.8V ~ 3.6V).
The LPC811M001JDH16FP provides superior specifications across program memory (8KB vs. 4KB), RAM capacity (2K x 8 vs. 256 x 8), processing speed (30MHz vs. 25MHz), and operating temperature range (-40°C ~ 105°C vs. -40°C ~ 85°C). The substitute offers one additional I/O pin (14 vs. 13) and maintains all required communication interfaces.
Package differences exist between the two devices: the C8051F835-GS uses 16-SOIC (0.154" width) while the LPC811M001JDH16FP uses 16-TSSOP (0.173" width). Both are 16-pin surface mount packages with compatible pinout assignments for core functionality, though PCB layout modifications may be required to accommodate the different package footprints.
Frequently Asked Questions (FAQ)
Q: Can the LPC811M001JDH16FP directly replace the C8051F835-GS without firmware changes?
A: The LPC811M001JDH16FP is architecturally different (ARM Cortex-M0+ vs. 8051 core), requiring firmware recompilation and potential code modifications. However, both devices support identical communication protocols (I2C, SPI, UART/USART) and maintain the same supply voltage range, making functional substitution feasible with appropriate software adaptation.
Q: Are there package compatibility concerns?
A: The C8051F835-GS uses 16-SOIC packaging while the LPC811M001JDH16FP uses 16-TSSOP packaging. Both are 16-pin surface mount configurations, but the physical footprints differ. PCB redesign or adapter solutions may be necessary for direct board-level substitution.
Q: Does the LPC811M001JDH16FP meet the same compliance requirements?
A: Yes. Both devices are ROHS3 compliant and share identical supply voltage specifications (1.8V ~ 3.6V). The LPC811M001JDH16FP supports an extended operating temperature range (-40°C ~ 105°C vs. -40°C ~ 85°C), providing additional margin for demanding applications.
Q: What is the memory advantage of the substitute part?
A: The LPC811M001JDH16FP provides 8KB of FLASH program memory and 2K x 8 RAM compared to the C8051F835-GS with 4KB FLASH and 256 x 8 RAM. This represents a 2x increase in program memory and an 8x increase in RAM capacity, supporting more complex firmware implementations.
Q: Is the LPC811M001JDH16FP actively manufactured?
A: Yes. The LPC811M001JDH16FP is classified as Active product status with high inventory availability (100,400 pieces), whereas the C8051F835-GS is Last Time Buy with limited remaining stock (1,070 pieces).
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