BZD27C22P RVG Equivalent & Substitute Parts

Part Overview

The BZD27C22P RVG is an active-status Zener diode manufactured by Taiwan Semiconductor Corporation, rated for 22.05 V nominal Zener voltage with 1 W maximum power dissipation. This component operates in surface mount configuration using the DO-219AB package (Sub SMA form factor). The part is ROHS3 compliant and REACH unaffected, suitable for applications requiring voltage regulation and transient suppression in electronic circuits. Substitute parts are identified when equivalent electrical performance and mechanical compatibility are maintained across the specified parameter range.

Substiute Parts

BZD27C22P RVG
Taiwan Semiconductor CorporationIn Stock: 793BZD27C22P RVG Datasheet
BZD27C22P RVG
Current Part
BZD27C22P R3G
Taiwan Semiconductor CorporationIn Stock: 7080BZD27C22P R3G Datasheet
BZD27C22P R3G
Parametric Equivalent

Key Parameters

Parameter Value Unit
Voltage - Zener (Nom) 22.05 V
Power - Max 1 W
Impedance (Max) 15 Ohms
Current - Reverse Leakage @ Vr 1 µA @ 16 V
Voltage - Forward (Vf) (Max) @ If 1.2 V @ 200 mA
Operating Temperature Range -55 to 175 °C (TJ)
Package / Case DO-219AB Sub SMA
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the BZD27C22P RVG is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Criteria:

  • Nominal Zener voltage: 22.05 V
  • Maximum power rating: 1 W
  • Maximum impedance: 15 Ohms
  • Reverse leakage current: 1 µA @ 16 V
  • Forward voltage: 1.2 V @ 200 mA
  • Operating temperature range: -55°C to 175°C

Mechanical Equivalence Criteria:

  • Package type: DO-219AB (Sub SMA)
  • Mounting configuration: Surface Mount
  • Supplier device package: Sub SMA

Compliance Equivalence Criteria:

  • RoHS3 compliance status
  • Moisture Sensitivity Level: 1 (Unlimited)
  • REACH unaffected status

The substitute part BZD27C22P R3G maintains identical electrical performance and mechanical compatibility. The primary distinction is packaging format (Tape & Reel versus bulk) and tolerance specification (±5% versus ±5.66%), both of which remain within acceptable substitution parameters for this component category.

Parameter Comparison

Parameter BZD27C22P RVG (Main) BZD27C22P R3G (Substitute) Match Status
Manufacturer Taiwan Semiconductor Corporation Taiwan Semiconductor Corporation Identical
Category Diodes, Zener Diodes, Zener Identical
Voltage - Zener (Nom) 22.05 V 22.05 V Identical
Tolerance ±5.66% ±5% Tighter on Substitute
Power - Max 1 W 1 W Identical
Impedance (Max) 15 Ohms 15 Ohms Identical
Current - Reverse Leakage @ Vr 1 µA @ 16 V 1 µA @ 16 V Identical
Voltage - Forward (Vf) (Max) @ If 1.2 V @ 200 mA 1.2 V @ 200 mA Identical
Operating Temperature -55°C ~ 175°C (TJ) -55°C ~ 175°C (TJ) Identical
Package / Case DO-219AB DO-219AB Identical
Mounting Type Surface Mount Surface Mount Identical
Packaging Format Bulk Tape & Reel (TR) Different Format
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited) Identical
REACH Status REACH Unaffected REACH Unaffected Identical

Engineering Selection Recommendations

Primary Selection (BZD27C22P RVG): The BZD27C22P RVG is the specified main part number with active product status. This part is suitable for applications requiring standard bulk packaging and meets all regulatory compliance requirements (ROHS3, REACH unaffected). Inventory availability is 748 pieces.

Substitute Selection (BZD27C22P R3G): The BZD27C22P R3G is a direct electrical and mechanical equivalent with identical performance across all critical parameters. This substitute offers tighter tolerance specification (±5% versus ±5.66%) and is available in Tape & Reel packaging format. Inventory availability is 7035 pieces. Selection between main and substitute parts should be based on packaging requirements and procurement logistics rather than electrical performance, as both maintain identical functional characteristics and compliance status.

Both parts are active-status components from the same manufacturer, ensuring consistent quality and supply chain reliability.

Frequently Asked Questions (FAQ)

Q: Can BZD27C22P R3G be used as a direct replacement for BZD27C22P RVG?

A: Yes. Both parts maintain identical electrical specifications across all critical parameters: 22.05 V nominal Zener voltage, 1 W maximum power, 15 Ohms maximum impedance, and identical operating temperature range (-55°C to 175°C). Both use the DO-219AB package in surface mount configuration. The primary difference is packaging format (Tape & Reel versus bulk) and tolerance specification (±5% versus ±5.66%), neither of which affects functional compatibility.

Q: What is the difference between the packaging formats?

A: BZD27C22P RVG is supplied in bulk packaging, while BZD27C22P R3G is supplied in Tape & Reel (TR) format. Both contain identical components in the same DO-219AB package. Tape & Reel format is typically used for automated assembly processes, while bulk packaging is used for manual assembly or smaller production runs. The choice between formats depends on manufacturing process requirements rather than component performance.

Q: Does the tolerance difference affect substitution?

A: No. The BZD27C22P R3G features ±5% tolerance, which is tighter than the ±5.66% tolerance of the BZD27C22P RVG. Tighter tolerance specifications do not create compatibility issues; they represent improved precision. Both parts operate within the same functional range for Zener voltage regulation applications.

Q: Are both parts RoHS3 compliant?

A: Yes. Both BZD27C22P RVG and BZD27C22P R3G are ROHS3 compliant and REACH unaffected. Both maintain Moisture Sensitivity Level 1 (Unlimited), indicating no moisture sensitivity restrictions during storage or handling.

Q: What is the base product number for these parts?

A: Both parts share the base product number BZD27, which identifies the Zener diode series. The suffix designations (RVG and R3G) indicate packaging and tolerance variations within this series.

Q: Can these parts be used interchangeably in PCB assembly?

A: Yes, from an electrical and mechanical standpoint. Both parts use identical DO-219AB Sub SMA packages and surface mount configuration. Assembly equipment compatibility depends on the specific tape format specifications for the R3G variant, which should be confirmed with manufacturing process parameters.

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