BU4069UB Equivalent & Substitute Parts

Part Overview

The BU4069UB is a 6-channel inverter logic IC manufactured by Rohm Semiconductor in a 14-DIP through-hole package. This device belongs to the 4000B CMOS logic series and is classified as obsolete. The BU4069UB operates across a supply voltage range of 3V to 16V with a maximum quiescent current of 4 µA and propagation delay of 40ns at 15V with 50pF load. Due to its obsolete status, equivalent substitute parts from active manufacturers are necessary for new designs and ongoing production requirements.

Substiute Parts

BU4069UB

Rohm SemiconductorIn Stock: 1450BU4069UB Datasheet

Current PartRFQ

CD4069UBE

Texas InstrumentsIn Stock: 27297CD4069UBE Datasheet

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CD4069UBM

Texas InstrumentsIn Stock: 1426CD4069UBM Datasheet

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CD4069UBM96

Texas InstrumentsIn Stock: 105324CD4069UBM96 Datasheet

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CD4069UBMT

Texas InstrumentsIn Stock: 1309CD4069UBMT Datasheet

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HEC4069UBT,112

NXP USA Inc.In Stock: 1196HEC4069UBT,112 Datasheet

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HEC4069UBT,118

NXP USA Inc.In Stock: 796HEC4069UBT,118 Datasheet

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HEF4069UBT,653

Nexperia USA Inc.In Stock: 10868HEF4069UBT,653 Datasheet

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MC14069UBDG

onsemiIn Stock: 5020MC14069UBDG Datasheet

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MC14069UBDR2G

onsemiIn Stock: 142660MC14069UBDR2G Datasheet

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TC4069UBF(EL,N,F)

Toshiba Semiconductor and StorageIn Stock: 18366TC4069UBF(EL,N,F) Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the BU4069UB is determined by strict adherence to the following electrical and mechanical parameters:

Core Functional Requirements:

• Logic Type: Inverter
• Number of Circuits: 6
• Number of Inputs: 1
• Voltage Supply Range: Must encompass or exceed 3V ~ 16V
• Input Logic Levels: Low 1V ~ 2.5V, High 4V ~ 12.5V
• Operating Temperature: Must support -40°C minimum

Mechanical Compatibility:

• Through-hole mounting in 14-DIP package for direct PCB replacement
• Surface-mount alternatives (14-SOIC, 14-SO, 14-SOP) available for redesigned applications

Electrical Performance:

• Output current capability: 3mA minimum per channel
• Propagation delay: 40ns or faster at 15V, 50pF load
• Quiescent current: 4 µA or lower

Substitute parts are grouped into two categories: direct through-hole replacements and surface-mount alternatives. All substitutes maintain the 6-channel inverter configuration with identical input/output logic levels and are members of the 4000B CMOS logic series.

Parameter Comparison

Engineering Selection Recommendations

Through-Hole Direct Replacement: CD4069UBE from Texas Instruments is the primary direct replacement for the BU4069UB. It maintains the 14-DIP package format for direct PCB substitution, operates across an extended voltage range (3V ~ 18V), and is in active production status. This part is ROHS3 compliant and offers superior operating temperature range (-55°C ~ 125°C) compared to the obsolete BU4069UB.

Surface-Mount Alternatives: For applications permitting PCB redesign, multiple surface-mount options are available:

• HEC4069UBT,112 and HEC4069UBT,118 (NXP USA Inc.) offer the fastest propagation delay at 25ns and maintain the -40°C lower temperature limit of the original part.
• HEF4069UBT,653 (Nexperia USA Inc.) provides 30ns propagation delay in 14-SOIC package with active product status.
• CD4069UBM and CD4069UBM96 (Texas Instruments) deliver extended voltage range (3V ~ 18V) and wide temperature operation (-55°C ~ 125°C).
• MC14069UBDR2G (onsemi) offers highest inventory availability (142,600 pcs) with extended voltage and temperature specifications.
• TC4069UBF(EL,N,F) (Toshiba) provides 14-SOP package option with active status and RoHS compliance.

All recommended substitutes are ROHS3 compliant and REACH unaffected, meeting modern environmental and regulatory requirements.

Frequently Asked Questions (FAQ)

Q: Can CD4069UBE directly replace BU4069UB without PCB modification? A: Yes. CD4069UBE is packaged in 14-PDIP, matching the BU4069UB's through-hole footprint. Pin configuration and electrical characteristics are compatible for direct socket substitution.

Q: What is the primary difference between through-hole and surface-mount substitutes? A: Through-hole packages (14-DIP, 14-PDIP) mount vertically through PCB holes and are suitable for existing designs. Surface-mount packages (14-SOIC, 14-SO, 14-SOP) require PCB redesign but offer smaller footprints and automated assembly compatibility.

Q: Are all substitutes electrically compatible with the BU4069UB? A: All listed substitutes maintain the 6-channel inverter configuration, identical input logic levels (Low: 1V ~ 2.5V, High: 4V ~ 12.5V), and minimum output current of 3mA per channel. Voltage supply ranges exceed the original 3V ~ 16V specification. Propagation delays range from 25ns to 55ns, all meeting or exceeding the original 40ns specification.

Q: Which substitute offers the best performance? A: HEC4069UBT,112 and HEC4069UBT,118 from NXP provide the fastest propagation delay at 25ns. For extended voltage range and temperature operation, CD4069UBE and MC14069UBDR2G are optimal choices.

Q: What is the inventory status of recommended substitutes? A: MC14069UBDR2G has the highest availability at 142,600 pcs. CD4069UBE offers 27,200 pcs. All recommended parts are in active production except CD4069UBMT, which is discontinued at DiGi Electronics.

Q: Are there package size considerations for surface-mount alternatives? A: Yes. 14-SOIC (0.154", 3.90mm width) is the most common surface-mount option. TC4069UBF uses 14-SOP (0.209", 5.30mm width), which is slightly wider. Verify PCB layout compatibility before selection.

Q: Do all substitutes meet RoHS compliance? A: Yes. All listed substitutes are ROHS3 compliant and REACH unaffected, meeting current environmental regulations.