ATXMEGA192D3-MN Equivalent & Substitute Parts

Part Overview

The ATXMEGA192D3-MN is an AVR XMEGA D3 series microcontroller manufactured by Microchip Technology. This 8/16-bit embedded processor operates at 32MHz with 192KB flash memory and is housed in a 64-QFN (9x9) surface mount package. The device is currently in active production status and is RoHS3 compliant. Finding equivalent substitute parts may be necessary due to inventory availability, packaging requirements, or supply chain considerations while maintaining identical functional and electrical specifications.

Key Parameters

Parameter	Value
Manufacturer Part Number	ATXMEGA192D3-MN
Manufacturer	Microchip Technology
Series	AVR® XMEGA® D3
Core Processor	AVR
Core Size	8/16-Bit
Speed	32MHz
Program Memory Size	192KB (96K x 16)
Program Memory Type	FLASH
EEPROM Size	2K x 8
RAM Size	16K x 8
Voltage Supply (Vcc/Vdd)	1.6V ~ 3.6V
Data Converters	A/D 16x12b
Number of I/O	50
Connectivity	I2C, IrDA, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT
Oscillator Type	Internal
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package / Case	64-VFQFN Exposed Pad
Supplier Device Package	64-QFN (9x9)
Product Status	Active
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)

Substitute Part Grouping Explanation

The ATXMEGA192D3-MH qualifies as a direct substitute for the ATXMEGA192D3-MN based on the following critical parameters:

Identical Electrical Specifications:

Core processor architecture (AVR)
Core size (8/16-Bit)
Operating frequency (32MHz)
Program memory capacity (192KB FLASH)
EEPROM size (2K x 8)
RAM size (16K x 8)
Voltage supply range (1.6V ~ 3.6V)
Data converter configuration (A/D 16x12b)
I/O count (50 pins)
Connectivity interfaces (I2C, IrDA, SPI, UART/USART)
Peripheral features (Brown-out Detect/Reset, POR, PWM, WDT)
Oscillator type (Internal)
Package form factor (64-QFN 9x9, 64-VFQFN Exposed Pad)

Difference: The primary distinction is the packaging format. The ATXMEGA192D3-MN is supplied in tube packaging, while the ATXMEGA192D3-MH is supplied in tray packaging. Additionally, the operating temperature range for the ATXMEGA192D3-MH extends to -40°C ~ 85°C, which is narrower than the main part's -40°C ~ 105°C range.

Parameter Comparison

Parameter	ATXMEGA192D3-MN	ATXMEGA192D3-MH	Match Status
Manufacturer	Microchip Technology	Microchip Technology	Identical
Series	AVR® XMEGA® D3	AVR® XMEGA® D3	Identical
Core Processor	AVR	AVR	Identical
Core Size	8/16-Bit	8/16-Bit	Identical
Speed	32MHz	32MHz	Identical
Program Memory Size	192KB (96K x 16)	192KB (96K x 16)	Identical
EEPROM Size	2K x 8	2K x 8	Identical
RAM Size	16K x 8	16K x 8	Identical
Voltage Supply (Vcc/Vdd)	1.6V ~ 3.6V	1.6V ~ 3.6V	Identical
Data Converters	A/D 16x12b	A/D 16x12b	Identical
Number of I/O	50	50	Identical
Connectivity	I2C, IrDA, SPI, UART/USART	I2C, IrDA, SPI, UART/USART	Identical
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT	Identical
Oscillator Type	Internal	Internal	Identical
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 85°C (TA)	Different
Mounting Type	Surface Mount	Surface Mount	Identical
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad	Identical
Supplier Device Package	64-QFN (9x9)	64-QFN (9x9)	Identical
Product Status	Active	Active	Identical
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	Identical
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)	Identical

Engineering Selection Recommendations

Both the ATXMEGA192D3-MN and ATXMEGA192D3-MH are active production devices manufactured by Microchip Technology with identical RoHS3 compliance and MSL ratings. The selection between these parts should be based on the following criteria:

Choose ATXMEGA192D3-MN when:

Applications require operation at temperatures above 85°C
Tube packaging is specified for automated assembly processes

Choose ATXMEGA192D3-MH when:

Tray packaging is preferred for component handling and storage
Operating temperature requirements do not exceed 85°C
Higher inventory availability is a consideration

Both devices are electrically and functionally equivalent for applications operating within the -40°C to 85°C temperature range and share identical pin configurations, memory specifications, and peripheral functionality.

Frequently Asked Questions (FAQ)

Q: Are the ATXMEGA192D3-MN and ATXMEGA192D3-MH pin-compatible? A: Yes. Both devices use the 64-QFN (9x9) package with 64-VFQFN Exposed Pad configuration. Pin assignments, electrical characteristics, and functional behavior are identical.

Q: What is the difference between tube and tray packaging? A: Tube packaging (ATXMEGA192D3-MN) is a cylindrical container used for manual handling and smaller quantity orders. Tray packaging (ATXMEGA192D3-MH) is a flat format designed for automated pick-and-place assembly equipment and higher volume production runs.

Q: Can I use ATXMEGA192D3-MH in an application designed for ATXMEGA192D3-MN? A: Yes, provided the application's maximum operating temperature does not exceed 85°C. The ATXMEGA192D3-MH has a narrower operating temperature range (-40°C ~ 85°C) compared to the ATXMEGA192D3-MN (-40°C ~ 105°C). If your application requires operation above 85°C, the ATXMEGA192D3-MN is required.

Q: Are there any differences in memory specifications? A: No. Both parts have identical program memory (192KB FLASH), EEPROM (2K x 8), and RAM (16K x 8) configurations.

Q: Do both parts support the same communication interfaces? A: Yes. Both devices support I2C, IrDA, SPI, and UART/USART connectivity with identical peripheral configurations including Brown-out Detect/Reset, POR, PWM, and WDT.

Q: Are both parts RoHS compliant? A: Yes. Both ATXMEGA192D3-MN and ATXMEGA192D3-MH are RoHS3 compliant with MSL rating of 3 (168 Hours).

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