ATSAMA5D22A-CUR Equivalent & Substitute Parts

Part Overview

The ATSAMA5D22A-CUR is an ARM Cortex-A5 microprocessor from Microchip Technology's SAMA5D2 series, operating at 500MHz with 32-bit architecture in a 196-TFBGA package. This embedded processor integrates multimedia co-processing, graphics acceleration, and comprehensive security features including ARM TrustZone, cryptography, and secure memory. The part is currently listed as obsolete, necessitating identification of active equivalent alternatives for new designs and ongoing production requirements.

Substiute Parts

ATSAMA5D22A-CUR
Microchip TechnologyIn Stock: 818ATSAMA5D22A-CUR Datasheet
ATSAMA5D22A-CUR
Current Part
ATSAMA5D22C-CUR
Microchip TechnologyIn Stock: 1080ATSAMA5D22C-CUR Datasheet
ATSAMA5D22C-CUR
Direct
ATSAMA5D23A-CUR
Microchip TechnologyIn Stock: 1176ATSAMA5D23A-CUR Datasheet
ATSAMA5D23A-CUR
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Microchip Technology
Series SAMA5D2
Core Processor ARM Cortex-A5
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 500MHz
Package Type 196-TFBGA (11x11)
Voltage - I/O 3.3V
Operating Temperature Range -40°C ~ 85°C (TA)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution for the ATSAMA5D22A-CUR is determined by strict equivalence across the following critical parameters:

  • Processor Architecture: ARM Cortex-A5 core with identical instruction set
  • Clock Speed: 500MHz operation
  • Package Configuration: 196-TFBGA (11x11) form factor
  • I/O Voltage: 3.3V supply
  • Temperature Range: -40°C to 85°C operational envelope
  • Peripheral Integration: Identical RAM controllers (LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI), display controllers, Ethernet (10/100Mbps), USB 2.0 + HSIC, and interface protocols (I2C, SMC, SPI, UART, USART, QSPI)
  • Security Features: ARM TrustZone, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
  • Compliance: ROHS3, REACH Unaffected, identical ECCN and HTSUS codes

The identified substitutes maintain full electrical and functional compatibility with the original part while differing in product status and packaging configuration.

Parameter Comparison

Parameter ATSAMA5D22A-CUR (Main) ATSAMA5D22C-CUR (Direct) ATSAMA5D23A-CUR (MFR Recommended)
Manufacturer Microchip Technology Microchip Technology Microchip Technology
Series SAMA5D2 SAMA5D2 SAMA5D2
Core Processor ARM Cortex-A5 ARM Cortex-A5 ARM Cortex-A5
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit
Speed 500MHz 500MHz 500MHz
Co-Processors/DSP Multimedia, NEON™ MPE Multimedia, NEON™ MPE Multimedia, NEON™ MPE
RAM Controllers LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration Yes Yes Yes
Display & Interface Controllers Keyboard, LCD, Touchscreen Keyboard, LCD, Touchscreen Keyboard, LCD, Touchscreen
Ethernet 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps (1)
USB USB 2.0 + HSIC USB 2.0 + HSIC USB 2.0 + HSIC
Voltage - I/O 3.3V 3.3V 3.3V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 196-TFBGA, CSBGA 196-TFBGA, CSBGA 196-TFBGA, CSBGA
Supplier Device Package 196-TFBGA (11x11) 196-TFBGA (11x11) 196-TFBGA (11x11)
Additional Interfaces I2C, SMC, SPI, UART, USART, QSPI I2C, SMC, SPI, UART, USART, QSPI I2C, SMC, SPI, UART, USART, QSPI
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected
ECCN 5A992C 5A992C 5A992C
HTSUS 8542.31.0001 8542.31.0001 8542.31.0001
Product Status Obsolete Active Active
Packaging Configuration Bulk Tape & Reel (TR) Bulk

Engineering Selection Recommendations

The ATSAMA5D22A-CUR is obsolete and should be replaced in new designs. Both substitute parts maintain complete electrical and functional equivalence:

ATSAMA5D22C-CUR is the direct functional equivalent with active product status. This part differs only in packaging configuration, supplied in Tape & Reel format suitable for automated assembly processes. Selection of this part is appropriate for production environments requiring standard component packaging.

ATSAMA5D23A-CUR is the manufacturer-recommended alternative, also with active product status. This part maintains identical electrical specifications and peripheral integration. Selection of this part aligns with Microchip Technology's current product recommendations for the SAMA5D2 series.

Both substitutes satisfy ROHS3 compliance, REACH requirements, and export control classifications identical to the original part. Inventory availability and supply chain considerations should guide final selection between the two active alternatives.

Frequently Asked Questions (FAQ)

Q: Can ATSAMA5D22C-CUR directly replace ATSAMA5D22A-CUR in existing designs?

A: Yes. The parts are electrically and functionally identical. The only difference is packaging configuration: ATSAMA5D22C-CUR is supplied in Tape & Reel format while ATSAMA5D22A-CUR is supplied in bulk. PCB layout, schematic integration, and firmware compatibility remain unchanged.

Q: What is the difference between ATSAMA5D22C-CUR and ATSAMA5D23A-CUR?

A: Both parts are functionally equivalent substitutes for the obsolete ATSAMA5D22A-CUR. ATSAMA5D22C-CUR is supplied in Tape & Reel packaging; ATSAMA5D23A-CUR is supplied in bulk packaging. Electrical specifications, performance characteristics, and peripheral integration are identical.

Q: Are the substitute parts compatible with existing PCB designs?

A: Yes. Both substitute parts use the identical 196-TFBGA (11x11) package footprint, 3.3V I/O voltage, and operating temperature range. No PCB redesign is required.

Q: Do the substitute parts support the same security features?

A: Yes. Both ATSAMA5D22C-CUR and ATSAMA5D23A-CUR include identical security implementations: ARM TrustZone, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, and Secure RTC.

Q: What memory controller options are available in the substitute parts?

A: Both substitutes support LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, and QSPI memory controllers, identical to the original part.

Q: Are there compliance or export restrictions on the substitute parts?

A: No. Both substitutes maintain ROHS3 compliance, REACH Unaffected status, and identical ECCN (5A992C) and HTSUS (8542.31.0001) classifications as the original part.

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