AT91SAM7SE256-CU Equivalent & Substitute Parts

Part Overview

The AT91SAM7SE256-CU is an ARM7® SAM7SE series microcontroller IC featuring 16/32-bit architecture, 55MHz operation, and 256KB FLASH memory in a 144-BGA (13x13) package. This part is classified as obsolete, making identification of compatible substitutes essential for ongoing system support and new design implementations. The SAM7SE series provides integrated connectivity options including EBI/EMI, I2C, SPI, SSC, UART/USART, and USB interfaces, along with peripheral functions such as brown-out detection, power-on reset, PWM, and watchdog timer capabilities.

Substiute Parts

AT91SAM7SE256-CU

Microchip TechnologyIn Stock: 1558AT91SAM7SE256-CU Datasheet

Current PartRFQ

AT91SAM7SE256B-CU

Microchip TechnologyIn Stock: 2299AT91SAM7SE256B-CU Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the AT91SAM7SE256-CU is determined by strict equivalence across the following critical parameters:

• Core processor architecture (ARM7®)
• Core size (16/32-Bit)
• Operating frequency (55MHz)
• Program memory capacity and type (256KB FLASH)
• RAM capacity (32K x 8)
• Supply voltage range (1.65V ~ 1.95V)
• I/O count (88 pins)
• Connectivity interfaces (EBI/EMI, I2C, SPI, SSC, UART/USART, USB)
• Peripheral feature set (Brown-out Detect/Reset, POR, PWM, WDT)
• Data converter specifications (A/D 8x10b)
• Operating temperature range (-40°C ~ 85°C)
• Surface mount configuration
• Compliance certifications (ROHS3, REACH Unaffected)

The AT91SAM7SE256B-CU qualifies as a direct substitute based on identical electrical and functional specifications across all parameters listed above. Package geometry differences (144-BGA 13x13 versus 144-LFBGA 10x10) represent the primary physical distinction and must be evaluated within the context of specific PCB layout and thermal management requirements.

Parameter Comparison

Engineering Selection Recommendations

The AT91SAM7SE256B-CU is a direct functional equivalent to the AT91SAM7SE256-CU. Both parts maintain identical electrical specifications, memory configurations, peripheral feature sets, and compliance certifications (ROHS3 Compliant, REACH Unaffected).

The primary distinction is product status: the original AT91SAM7SE256-CU is classified as obsolete, while the AT91SAM7SE256B-CU maintains active status with confirmed inventory availability (2200 pcs). This status difference, combined with identical functional parameters, establishes the AT91SAM7SE256B-CU as the appropriate selection for new designs and ongoing system support.

Package geometry differs between the two parts (144-BGA 13x13 versus 144-LFBGA 10x10). PCB layout modifications are required to accommodate the smaller footprint of the 144-LFBGA (10x10) package. Thermal management characteristics and signal integrity considerations must be evaluated within the specific application context.

Frequently Asked Questions (FAQ)

Q: Can AT91SAM7SE256B-CU directly replace AT91SAM7SE256-CU in existing designs?

A: Electrical and functional compatibility is complete. Physical PCB layout modification is required due to package geometry differences (13x13 versus 10x10 BGA footprint). Thermal and signal routing characteristics must be re-evaluated for the smaller package.

Q: What are the key parameters that determine substitution eligibility?

A: Substitution is based on matching core processor (ARM7®), core size (16/32-Bit), operating frequency (55MHz), memory configuration (256KB FLASH, 32KB RAM), supply voltage (1.65V ~ 1.95V), I/O count (88), connectivity interfaces, peripheral features, and operating temperature range (-40°C ~ 85°C).

Q: Are there compliance or certification differences between these parts?

A: Both parts are ROHS3 Compliant and REACH Unaffected. MSL ratings are identical (3, 168 Hours). No compliance or certification differences exist.

Q: Why is the original part listed as obsolete?

A: The AT91SAM7SE256-CU has reached end-of-life status. The AT91SAM7SE256B-CU represents the active continuation within the SAM7SE product line with identical specifications.

Q: What packaging considerations apply to the 144-LFBGA (10x10) format?

A: The 144-LFBGA (10x10) package is smaller than the original 144-BGA (13x13). PCB design files, assembly processes, and thermal management strategies require modification. Solder reflow profiles and inspection procedures may differ due to package density.