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3M 961106-6700-AR-TP Equivalent & Substitute Parts
Part Overview
The 3M 961106-6700-AR-TP is a rectangular connector header designed for surface mount applications with 6 positions at 0.100" (2.54mm) pitch. This component is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production support. The connector features male pins with gold-plated mating contacts, solder termination, and unshrouded design suitable for board-to-board applications. Samtec Inc. TSM series connectors provide direct functional equivalents with active product status and enhanced operating temperature range.
Substiute Parts
Key Parameters
| Parameter | Specification |
|---|---|
| Connector Type | Header |
| Contact Type | Male Pin |
| Number of Positions | 6 |
| Pitch - Mating | 0.100" (2.54mm) |
| Mounting Type | Surface Mount |
| Termination | Solder |
| Fastening Type | Push-Pull |
| Shrouding | Unshrouded |
| Contact Finish - Mating | Gold |
| Insulation Material | Thermoplastic |
| Operating Temperature | -25°C ~ 105°C |
| Material Flammability Rating | UL94 V-0 |
| Current Rating | 2A |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Samtec TSM-106 series connectors serve as functional equivalents to the 3M 961106-6700-AR-TP based on the following critical parameters:
Core Compatibility Parameters:
- 6-position male pin header configuration
- 0.100" (2.54mm) pitch mating
- Surface mount solder termination
- Push-pull fastening mechanism
- Unshrouded design
- Gold-plated mating contacts
- UL94 V-0 flammability rating
- Moisture Sensitivity Level 1
Variations Within TSM Series: The TSM-106 family includes variants differentiated by contact finish thickness on mating surfaces (3.00µin, 10.0µin, or 30.0µin gold plating), insulation material composition (Liquid Crystal Polymer vs. Thermoplastic), contact material (Phosphor Bronze vs. Copper Alloy), and packaging options (Tube, Tape & Reel, or standard). All variants maintain the same electrical and mechanical interface specifications required for direct substitution.
Enhanced Specifications: TSM-106 substitutes feature extended operating temperature range (-55°C ~ 125°C versus -25°C ~ 105°C), increased contact length (0.320" versus 0.260"), and RoHS3 compliance. These enhancements provide superior performance margins without compromising compatibility.
Parameter Comparison
| Parameter | 3M 961106-6700-AR-TP | Samtec TSM-106-02-F-SV | Samtec TSM-106-02-G-SV | Samtec TSM-106-02-H-SV |
|---|---|---|---|---|
| Manufacturer | 3M | Samtec Inc. | Samtec Inc. | Samtec Inc. |
| Product Status | Obsolete | Active | Active | Active |
| Connector Type | Header | Header, Cuttable | Header, Cuttable | Header, Cuttable |
| Contact Type | Male Pin | Male Pin | Male Pin | Male Pin |
| Number of Positions | 6 | 6 | 6 | 6 |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Termination | Solder | Solder | Solder | Solder |
| Fastening Type | Push-Pull | Push-Pull | Push-Pull | Push-Pull |
| Shrouding | Unshrouded | Unshrouded | Unshrouded | Unshrouded |
| Contact Finish - Mating | Gold (Flash) | Gold (3.00µin) | Gold (10.0µin) | Gold (30.0µin) |
| Contact Material | Copper Alloy | Phosphor Bronze | Phosphor Bronze | Phosphor Bronze |
| Insulation Material | Thermoplastic | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -25°C ~ 105°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 |
| Insulation Color | Black | Black | Black | Black |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| RoHS Status | Not specified | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
Primary Substitutes (Recommended for New Designs):
TSM-106-02-G-SV-P-TR and TSM-106-02-G-SV-P represent the optimal substitutes for the 3M 961106-6700-AR-TP. These variants feature 10.0µin (0.25µm) gold plating on both mating and post contacts, providing balanced contact durability and cost efficiency. Active product status ensures long-term availability and supply chain stability. ROHS3 compliance supports regulatory requirements for new product development. Tape & Reel packaging (TR suffix) accommodates automated assembly processes.
Alternative Substitutes (Extended Temperature Applications):
TSM-106-02-H-SV and TSM-106-02-H-SV-P offer 30.0µin (0.76µm) gold plating for applications requiring enhanced contact wear resistance and extended mating cycles. The thicker gold finish provides superior corrosion protection in demanding environments while maintaining full electrical and mechanical compatibility.
Cost-Optimized Substitutes:
TSM-106-02-F-SV provides the minimum gold plating specification (3.00µin / 0.076µm) suitable for standard applications with moderate mating cycle requirements. This variant delivers cost reduction while maintaining all critical electrical parameters and compliance certifications.
Feature-Enhanced Variants:
TSM-106-02-F-SV-A-P-TR, TSM-106-02-G-SV-A-P-TR, and TSM-106-02-G-SV-A-P-TR include board guide and pick-and-place features, supporting automated manufacturing workflows and improved assembly accuracy.
All recommended substitutes maintain the 0.100" (2.54mm) pitch, 6-position configuration, surface mount solder termination, and push-pull fastening mechanism required for direct PCB layout compatibility.
Frequently Asked Questions (FAQ)
Q: Can TSM-106 series connectors replace the 3M 961106-6700-AR-TP in existing designs without PCB modification?
A: Yes. All TSM-106-02 variants maintain identical pitch (0.100" / 2.54mm), position count (6), mounting type (surface mount), and termination method (solder). PCB footprints are compatible without redesign. The increased contact length (0.320" versus 0.260") provides additional mating engagement without affecting board-level clearances.
Q: What is the difference between TSM-106-02-F-SV, TSM-106-02-G-SV, and TSM-106-02-H-SV?
A: The primary difference is mating contact gold plating thickness. TSM-106-02-F-SV features 3.00µin plating (minimum specification), TSM-106-02-G-SV features 10.0µin plating (standard specification), and TSM-106-02-H-SV features 30.0µin plating (enhanced specification). Thicker plating increases contact durability and corrosion resistance for high-cycle or harsh environment applications. All three variants are electrically and mechanically identical.
Q: Does the extended operating temperature range (-55°C ~ 125°C) of TSM-106 series affect compatibility?
A: No. The extended temperature range represents an enhancement over the original 3M part (-25°C ~ 105°C). TSM-106 connectors operate safely within the original temperature specification and provide additional margin for applications requiring broader thermal performance.
Q: What packaging options are available for TSM-106-02 substitutes?
A: Samtec offers TSM-106-02 variants in three packaging formats: standard Tube packaging, Tape & Reel (TR) for automated pick-and-place assembly, and bulk packaging. Tape & Reel variants (identified by TR suffix) are recommended for high-volume manufacturing. Tube packaging is suitable for manual assembly and lower-volume applications.
Q: Are TSM-106-02 connectors RoHS compliant?
A: Yes. All TSM-106-02 variants listed are ROHS3 compliant, meeting current regulatory requirements for electronic component manufacturing and end-of-life recycling.
Q: What is the difference between variants with and without the -A-P suffix?
A: The -A-P suffix indicates board guide and pick-and-place features. These variants include mechanical guides for improved alignment during automated assembly and manual placement. Standard variants (without -A-P) omit these features but maintain full electrical and mechanical compatibility.
Q: Can I mix different TSM-106-02 variants in the same design?
A: Yes. All TSM-106-02 variants share identical electrical and mechanical interfaces. Different gold plating thicknesses or packaging formats can be used interchangeably based on application requirements and supply availability without affecting circuit performance or PCB compatibility.
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