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Amphenol ICC 68664-006 Equivalent & Substitute Parts
Part Overview
The Amphenol ICC 68664-006 is a rectangular connector header designed for through-hole mounting applications. This 16-position, 2-row connector with 0.100" (2.54mm) pitch belongs to the BergCon® series and features shrouded 4-wall construction with solder termination and detent lock fastening. The part is currently classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing design support and component procurement.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Connector Type | Header |
| Contact Type | Male Pin |
| Number of Positions | 16 |
| Number of Rows | 2 |
| Pitch - Mating | 0.100" (2.54mm) |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Shrouding | Shrouded - 4 Wall |
| Mounting Type | Through Hole |
| Termination | Solder |
| Fastening Type | Detent Lock |
| Contact Shape | Square |
| Material Flammability Rating | UL94 V-0 |
| Insulation Color | Black |
Substitute Part Grouping Explanation
Substitution eligibility for the 68664-006 is determined by strict alignment with the following core parameters:
- Connector Type & Contact Configuration: Header with male pins
- Position Count & Row Configuration: 16 positions in 2 rows
- Mating Pitch & Row Spacing: 0.100" (2.54mm) for both mating pitch and row spacing
- Shrouding & Mounting: Shrouded 4-wall construction with through-hole mounting
- Termination & Fastening: Solder termination with detent lock fastening
- Contact Shape & Flammability: Square contacts with UL94 V-0 rating
The two substitute parts listed—Molex 0015801161 and TE Connectivity 102618-6—meet all these core substitution criteria. Both are active-status components that provide functional equivalence to the obsolete 68664-006 while maintaining compatibility with existing board designs and mating connectors.
Parameter Comparison
| Parameter | 68664-006 (Amphenol ICC) | 0015801161 (Molex) | 102618-6 (TE Connectivity) |
|---|---|---|---|
| Manufacturer | Amphenol ICC (FCI) | Molex | TE Connectivity AMP Connectors |
| Series | BergCon® | C-Grid 70567 | AMPMODU Mod II |
| Product Status | Obsolete | Active | Active |
| Connector Type | Header | Header | Header |
| Contact Type | Male Pin | Male Pin | Male Pin |
| Number of Positions | 16 | 16 | 16 |
| Number of Rows | 2 | 2 | 2 |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Row Spacing - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Shrouding | Shrouded - 4 Wall | Shrouded - 4 Wall | Shrouded - 4 Wall |
| Mounting Type | Through Hole | Through Hole | Through Hole |
| Termination | Solder | Solder | Solder |
| Fastening Type | Detent Lock | Detent Lock | Detent Lock |
| Contact Shape | Square | Square | Square |
| Contact Length - Mating | 0.315" (8.00mm) | 0.315" (8.00mm) | 0.318" (8.08mm) |
| Contact Length - Post | 0.130" (3.30mm) | 0.130" (3.30mm) | 0.125" (3.18mm) |
| Insulation Height | 0.440" (11.18mm) | 0.475" (12.07mm) | 0.440" (11.18mm) |
| Contact Finish - Mating | Gold or Gold, GXT™ | Gold | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) | 30.0µin (0.76µm) | 15.0µin (0.38µm) |
| Contact Material | Phosphor Bronze Alloy | Copper Alloy | Phosphor Bronze |
| Insulation Material | Polyester, Glass Filled | Liquid Crystal Polymer (LCP), Glass Filled | Thermoplastic |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 | UL94 V-0 |
| Insulation Color | Black | Black | Black |
| Operating Temperature | Not specified | Not specified | -65°C ~ 105°C |
| Current Rating (Amps) | Not specified | Not specified | 3A |
| RoHS Status | RoHS non-compliant | ROHS3 Compliant | RoHS non-compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| ECCN | EAR99 | EAR99 | EAR99 |
| HTSUS | 8536.69.4040 | 8536.69.4040 | 8536.69.4040 |
Engineering Selection Recommendations
Molex 0015801161 is the preferred substitute for new designs and ongoing procurement. This part is active-status and ROHS3 compliant, providing regulatory advantage over the obsolete 68664-006. The C-Grid 70567 series maintains full functional compatibility with identical mating pitch, row spacing, shrouding, and fastening characteristics. The insulation height variance (0.475" vs. 0.440") is within acceptable tolerance for standard board-to-cable applications. Packaging in tube format supports standard component handling workflows.
TE Connectivity 102618-6 serves as an alternative substitute with active product status. The AMPMODU Mod II series provides equivalent core functionality with documented operating temperature range (-65°C ~ 105°C) and current rating (3A). Contact post length (0.125" vs. 0.130") and mating contact finish thickness (15.0µin vs. 30.0µin) represent minor variations that remain compatible with standard PCB designs. Tray packaging accommodates high-volume assembly operations. RoHS non-compliance status matches the original part.
Both substitutes maintain UL94 V-0 flammability rating and MSL 1 moisture sensitivity classification, ensuring compatibility with existing environmental and reliability specifications.
Frequently Asked Questions (FAQ)
Q: Can the Molex 0015801161 or TE Connectivity 102618-6 directly replace the Amphenol ICC 68664-006 in existing designs?
A: Yes. Both substitute parts meet all core substitution criteria: 16-position, 2-row configuration with 0.100" (2.54mm) mating pitch and row spacing, shrouded 4-wall construction, through-hole solder termination, and detent lock fastening. Mating connector compatibility is maintained across all three parts.
Q: What are the key differences between the two substitute options?
A: The Molex 0015801161 offers ROHS3 compliance and higher contact finish thickness on mating surfaces (30.0µin). The TE Connectivity 102618-6 provides documented operating temperature range and current rating specifications. Insulation material differs: Molex uses Liquid Crystal Polymer (LCP) while TE Connectivity uses Thermoplastic. Both are functionally equivalent for standard applications.
Q: Does the insulation height difference between parts affect PCB layout?
A: The Molex 0015801161 has 0.475" insulation height compared to 0.440" on the original part. This 0.035" variance is within standard PCB design tolerances and does not require layout modifications for typical board-to-cable applications.
Q: Are there packaging considerations when transitioning from the obsolete part?
A: Yes. The Amphenol ICC 68664-006 packaging format is not specified. The Molex 0015801161 is supplied in tube packaging, while the TE Connectivity 102618-6 is supplied in tray packaging. Verify packaging compatibility with your assembly process and component handling systems.
Q: Which substitute is recommended for new product designs?
A: The Molex 0015801161 is recommended for new designs due to active product status and ROHS3 compliance, providing long-term supply assurance and regulatory alignment with current environmental standards.
Q: Do the substitute parts require any design verification before implementation?
A: Both substitute parts maintain functional equivalence with the original 68664-006 across all critical parameters. Standard design verification procedures for connector substitution should be followed per your organization's engineering change control process.
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