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Equivalent & Substitute Parts for 1337GCSRI8
Part Overview
The 1337GCSRI8 is a Real Time Clock (RTC) IC with Clock/Calendar functionality manufactured by Renesas Electronics Corporation. This device integrates I2C/2-Wire Serial interface capability with alarm, leap year, and square wave output features in a 16-SOIC package. The part is classified as obsolete, making equivalent and substitute components necessary for ongoing design support and production continuity. Substitute parts must maintain functional compatibility across timing accuracy, interface protocol, and electrical operating parameters.
Substiute Parts
Key Parameters
| Parameter | 1337GCSRI8 Specification |
|---|---|
| Manufacturer | Renesas Electronics Corporation |
| Category | Clock/Timing |
| Type | Clock/Calendar |
| Interface | I2C, 2-Wire Serial |
| Package / Case | 16-SOIC (0.295", 7.50mm Width) |
| Voltage - Supply | 1.8V ~ 5.5V |
| Current - Timekeeping (Max) | 0.6µA @ 1.3V ~ 1.8V |
| Operating Temperature | -40°C ~ 85°C |
| Time Format | HH:MM:SS (12/24 hr) |
| Date Format | YY-MM-DD-dd |
| Features | Alarm, Leap Year, Square Wave Output |
| Mounting Type | Surface Mount |
| Product Status | Obsolete |
| RoHS Status | RoHS non-compliant |
Substitute Part Grouping Explanation
Substitution eligibility is determined by the following critical parameters:
Primary Compatibility Criteria:
- Interface Protocol: I2C, 2-Wire Serial (mandatory match)
- Time Format: HH:MM:SS with 12/24 hour capability
- Date Format: YY-MM-DD-dd support
- Operating Temperature Range: -40°C ~ 85°C minimum
- Supply Voltage Range: Overlap with 1.8V ~ 5.5V
- Core Features: Alarm, Leap Year, Square Wave Output
Package Considerations: Substitute parts are grouped by package type. The 1337GCSRI8 uses 16-SOIC packaging. Substitutes with different packages (8-SOIC, 8-TSSOP, 8-UFDFN, 10-SMD Module) are functionally equivalent but require PCB layout redesign.
Product Status Impact: Active status substitutes (DS1337C#, DS1337C#T&R, DS1338Z series, DS1339U series, AB-RTCMC-32.768KHZ-B5GA-S3-T) provide long-term availability and design support. The BU9873NUX-TTR is marked "Not For New Designs" and should be avoided for new applications.
Parameter Comparison
| Parameter | 1337GCSRI8 | DS1337C# | DS1337C#T&R | AB-RTCMC-32.768KHZ-B5GA-S3-T | BU9873NUX-TTR | DS1308U-18+ | DS1338Z-3+T&R | DS1339U-3+T&R |
|---|---|---|---|---|---|---|---|---|
| Manufacturer | Renesas | Analog Devices/Maxim | Analog Devices/Maxim | Abracon LLC | Rohm Semiconductor | Analog Devices/Maxim | Analog Devices/Maxim | Analog Devices/Maxim |
| Interface | I2C, 2-Wire | I2C, 2-Wire | I2C, 2-Wire | I2C, 2-Wire | I2C, 2-Wire | I2C, 2-Wire | I2C, 2-Wire | I2C, 2-Wire |
| Package / Case | 16-SOIC | 16-SOIC | 16-SOIC | 10-SMD Module | 8-UFDFN | 8-TSSOP/MSOP | 8-SOIC | 8-TSSOP/MSOP |
| Voltage - Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.2V ~ 5.5V | 1.8V ~ 5.5V | 1.71V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Current - Timekeeping (Max) | 0.6µA @ 1.3V ~ 1.8V | 0.6µA @ 1.3V ~ 1.8V | 0.6µA @ 1.3V ~ 1.8V | 0.45µA ~ 0.55µA @ 2V ~ 5V | 1µA ~ 1.35µA @ 3V ~ 5.5V | 100µA @ 200µA @ 1.89V ~ 5.5V | 200µA @ 3.3V | 150µA @ 3.3V |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C |
| Time Format | HH:MM:SS (12/24 hr) | HH:MM:SS (12/24 hr) | HH:MM:SS (12/24 hr) | HH:MM:SS (24 hr) | HH:MM:SS (12/24 hr) | HH:MM:SS (12/24 hr) | HH:MM:SS (12/24 hr) | HH:MM:SS (12/24 hr) |
| Date Format | YY-MM-DD-dd | YY-MM-DD-dd | YY-MM-DD-dd | YY-MM-DD-dd | YY-MM-DD-dd | YY-MM-DD-dd | YY-MM-DD-dd | YY-MM-DD-dd |
| Features | Alarm, Leap Year, Square Wave Output | Alarm, Leap Year, Square Wave Output | Alarm, Leap Year, Square Wave Output | Alarm, Leap Year, Square Wave Output | Alarm, Leap Year | Leap Year, NVSRAM, Square Wave Output | Leap Year, NVSRAM, Square Wave Output | Alarm, Leap Year, Square Wave Output, Trickle-Charger |
| Product Status | Obsolete | Active | Active | Active | Not For New Designs | Active | Active | Active |
| RoHS Status | RoHS non-compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
Direct Package Equivalents (16-SOIC):
DS1337C# and DS1337C#T&R are the primary substitutes for 1337GCSRI8. Both maintain identical 16-SOIC packaging, eliminating PCB redesign requirements. These parts are manufactured by Analog Devices Inc./Maxim Integrated and carry Active product status with ROHS3 compliance. The DS1337C# is supplied in Tube packaging, while DS1337C#T&R uses Cut Tape & Digi-Reel® packaging. Electrical parameters, interface protocol, and feature sets are functionally equivalent to the original part.
Compliance Upgrade Path:
The 1337GCSRI8 is RoHS non-compliant with MSL 3 rating. All substitute options provide ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity, supporting modern manufacturing and storage requirements without special handling protocols.
Alternative Package Options:
For designs permitting package changes, DS1338Z-3+T&R and DS1338Z-33+T&R offer 8-SOIC packaging with integrated NVSRAM (56B memory). DS1339U-3+T&R and DS1339U-33+T&R provide 8-TSSOP packaging with trickle-charger functionality. AB-RTCMC-32.768KHZ-B5GA-S3-T is a 10-SMD module option with extended supply voltage range (1.2V ~ 5.5V) and lower timekeeping current consumption (0.45µA ~ 0.55µA).
Avoid for New Designs:
BU9873NUX-TTR carries "Not For New Designs" status and should not be selected for new applications despite functional compatibility.
Frequently Asked Questions (FAQ)
Q: Can DS1337C# directly replace 1337GCSRI8 without PCB modification?
A: Yes. DS1337C# and DS1337C#T&R maintain identical 16-SOIC (0.295", 7.50mm Width) packaging. Pin-to-pin compatibility and electrical parameters are equivalent, allowing direct substitution without PCB layout changes.
Q: What is the primary difference between DS1337C# and DS1337C#T&R?
A: Both parts are electrically identical. The difference is packaging format: DS1337C# is supplied in Tube, while DS1337C#T&R uses Cut Tape & Digi-Reel® format. Selection depends on assembly line requirements and inventory management preferences.
Q: Why do DS1338Z and DS1339U series use smaller packages?
A: DS1338Z series (8-SOIC) and DS1339U series (8-TSSOP) are functionally equivalent but use reduced pin-count packages. DS1338Z adds 56B NVSRAM, while DS1339U includes trickle-charger capability. These require PCB redesign but offer space savings and additional features.
Q: Is AB-RTCMC-32.768KHZ-B5GA-S3-T compatible with 1337GCSRI8 designs?
A: Functionally compatible for I2C interface, timing format, and date format. However, it uses 10-SMD Module packaging instead of 16-SOIC, requiring PCB redesign. It offers lower timekeeping current (0.45µA ~ 0.55µA) and extended supply voltage range (1.2V ~ 5.5V).
Q: What does "Not For New Designs" mean for BU9873NUX-TTR?
A: This designation indicates the manufacturer recommends against using this part in new product development. While functionally compatible, it lacks long-term availability guarantees and design support. Use only for legacy system maintenance.
Q: How does the 1337GCSRI8 obsolescence affect supply chain planning?
A: The 1337GCSRI8 is classified as obsolete. DS1337C# and DS1337C#T&R are Active status parts with established long-term availability. Transitioning to these substitutes ensures design continuity and reduces supply chain risk.
Q: Are all substitute parts ROHS3 compliant?
A: Yes, all substitute options listed are ROHS3 compliant. The original 1337GCSRI8 is RoHS non-compliant. Substitution provides regulatory compliance upgrade for new production runs.
Q: What is the significance of MSL rating differences?
A: The 1337GCSRI8 has MSL 3 (168 Hours), requiring controlled storage and handling. All substitutes have MSL 1 (Unlimited), eliminating moisture sensitivity constraints and reducing manufacturing process complexity.
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